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1. 发明授权

US06371310B1 Boat for land grid array packages 失效
标题翻译：船用地电网阵列包
公开(公告)号：US06371310B1
公开(公告)日：2002-04-16
申请号：US09740838
申请日：2000-12-21
申请人： Raj N. Master , Mohammad Z. Khan , L. K. Teoh
发明人： Raj N. Master , Mohammad Z. Khan , L. K. Teoh
IPC分类号： A47F700
CPC分类号： H01L21/67333
摘要： A boat is formed with layers comprising substantially aligned holes for safely accommodating land grid array semiconductor packages during assembly. The boat includes a bottom layer with an array of through-holes having a substantially square cross-sectional shape with rounded corners, a middle layer with an array of through-holes having a substantially octagonal cross-sectional shape and a top layer having an array of through-holes having a substantially square cross-sectional shape with notched sides and vertical tabs extending upwardly from the sidewalls of each notched side. The layers may be attached by spot welding or other means.
摘要翻译：船形成有包括基本上对准的孔的层，用于在组装期间安全地容纳平台阵列半导体封装。船包括具有基本上具有圆角的基本正方形横截面形状的通孔阵列的底层，具有基本上八边形横截面形状的通孔阵列的中间层和具有阵列的顶层的通孔具有基本正方形的横截面形状，具有切口侧面和从每个缺口侧的侧壁向上延伸的垂直突出部。这些层可以通过点焊或其他方式附着。

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