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1. 发明申请

US20070163354A1 Relative pressure measuring transmitter 有权
标题翻译：相对压力测量变送器
公开(公告)号：US20070163354A1
公开(公告)日：2007-07-19
申请号：US10552625
申请日：2004-04-06
申请人： Raimund Becher , Juergen Tanner
发明人： Raimund Becher , Juergen Tanner
IPC分类号： G01L7/08
CPC分类号： G01L19/0654 , G01L19/0636 , G01L19/0663
摘要： A relative pressure measuring transmitter resistant to the intrusion of moisture. includes a housing, an insert arranged in the housing, a gap existing between the housing and the insert, a relative pressure sensor, and, connected to the relative pressure sensor, a reference pressure supply line, which leads into the insert, opens on an outer wall of the insert, and has an interior, which is connected via an opening in insert with the gap The housing has a bore passing through it, via which the gap is placed in communication with an environment of the relative pressure measuring transmitter.
摘要翻译：相对的压力测量变送器耐潮湿侵入。包括壳体，布置在壳体中的插入件，存在于壳体和插入件之间的间隙，相对压力传感器，并且连接到相对压力传感器，引入插入件的参考压力供应管线在插入件的外壁，并且具有内部，其经由插入件中的开口与间隙连接。壳体具有穿过其的孔，间隙通过该孔与相对压力测量变送器的环境连通。

2. 发明授权

US07437937B2 Relative pressure measuring transmitter 有权
标题翻译：相对压力测量变送器
公开(公告)号：US07437937B2
公开(公告)日：2008-10-21
申请号：US10552625
申请日：2004-04-06
申请人： Raimund Becher , Juergen Tanner
发明人： Raimund Becher , Juergen Tanner
IPC分类号： G01L7/00
CPC分类号： G01L19/0654 , G01L19/0636 , G01L19/0663
摘要： A relative pressure measuring transmitter resistant to the intrusion of moisture. includes a housing, an insert arranged in the housing, a gap existing between the housing and the insert, a relative pressure sensor, and, connected to the relative pressure sensor, a reference pressure supply line, which leads into the insert, opens on an outer wall of the insert, and has an interior, which is connected via an opening in insert with the gap The housing has a bore passing through it, via which the gap is placed in communication with an environment of the relative pressure measuring transmitter.
摘要翻译：相对的压力测量变送器耐潮湿侵入。包括壳体，布置在壳体中的插入件，存在于壳体和插入件之间的间隙，相对压力传感器，并且连接到相对压力传感器，引入插入件的参考压力供应管线在插入件的外壁，并且具有内部，其经由插入件中的开口与间隙连接。壳体具有穿过其的孔，间隙通过该孔与相对压力测量变送器的环境连通。

3. 发明授权

US07566836B2 Potting shell 有权
标题翻译：灌封壳
公开(公告)号：US07566836B2
公开(公告)日：2009-07-28
申请号：US10569726
申请日：2004-07-30
申请人： Juergen Tanner
发明人： Juergen Tanner
IPC分类号： H01L23/28
CPC分类号： H05K5/064 , H01L2924/16151 , H05K3/284
摘要： A potting shell, for an electronic circuit on a circuit board, comprises a wall arrangement, which defines a shell volume at least in one spatial direction and in the directions perpendicular thereto; wherein the circuit board is positionable in the shell volume, and can be potted in the shell volume with a potting compound. The volume between the circuit board and a main wall of the potting shell, running essentially parallel, at least sectionally, to the circuit board, can be filled with a potting compound, characterized in that the main wall has at least one flexible section, which, based on a thermal expansion of the potting compound, can be deformed perpendicular to the plane of the flexible section.
摘要翻译：一种用于电路板上的电子电路的灌封壳包括壁布置，其至少在一个空间方向上和垂直于其的方向上限定壳体积; 其中所述电路板可定位在所述壳体中，并且可以用封装化合物封装在所述壳体中。电路板和灌封壳的主壁之间的体积至少基本平行地至少部分地延伸到电路板，其可以填充有灌封化合物，其特征在于，主壁具有至少一个柔性部分，其中基于灌封化合物的热膨胀，可以垂直于柔性部分的平面变形。

4. 发明申请

US20070165363A1 Potting shell 有权
标题翻译：灌封壳
公开(公告)号：US20070165363A1
公开(公告)日：2007-07-19
申请号：US10569726
申请日：2004-07-30
申请人： Juergen Tanner
发明人： Juergen Tanner
IPC分类号： H02B1/00
CPC分类号： H05K5/064 , H01L2924/16151 , H05K3/284
摘要： The potting shell 1 of the invention, for an electronic circuit on a circuit board 8, comprises a wall arrangement 2, 3, 6, 7, which defines a shell volume at least in one spatial direction and in the directions perpendicular thereto; wherein the circuit board is positionable in the shell volume, and can be potted in the shell volume with a potting compound; wherein the volume between the circuit board 8 and a main wall 2, 3, 6 of the potting shell, running essentially parallel, at least sectionally, to the circuit board 8, can be filled with potting compound, characterized in that the main wall has at least one flexible section 3, which, based on a thermal expansion of the potting compound, can be deformed perpendicular to the plane of the flexible section.
摘要翻译：用于电路板8上的电子电路的本发明的封装壳体1包括墙壁布置2,3,6,7，该壁布置限定了至少在一个空间方向和垂直于其的方向上的壳体积; 其中所述电路板可定位在所述壳体中，并且可以用封装化合物封装在所述壳体内; 其中电路板8和至少部分地基本平行于电路板8的灌封壳主壁壁之间的体积可以用灌封材料填充，其特征在于主壁具有至少一个柔性部分3，其基于灌封化合物的热膨胀可以垂直于柔性部分的平面变形。

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