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1. 发明授权

US07365553B2 Probe card assembly 有权
标题翻译：探头卡组合
公开(公告)号：US07365553B2
公开(公告)日：2008-04-29
申请号：US11317408
申请日：2005-12-22
申请人： Raffi Garabedian , Nim Hak Tea , Steven Wang , Heather Karklin
发明人： Raffi Garabedian , Nim Hak Tea , Steven Wang , Heather Karklin
IPC分类号： G01R31/02 , G01R1/073
CPC分类号： G01R3/00 , G01R1/07378 , Y10T29/53243
摘要： A probe card assembly has a probe contractor substrate having a plurality of probe contractor tips thereon and a probe card wiring board with an interposer disposed between the two. Support posts contacting the probe contractor substrate are vertically adjustable until secured by a locking mechanism which is coupled to the probe card wiring board. When the posts are secured in a fixed position, the position is one in which the plane of the plurality of probe contractor substrates is substantially parallel to a predetermined reference plane.
摘要翻译：探针卡组件具有在其上具有多个探针承载器尖端的探针承载器基板和设置在两者之间的插入器的探针卡布线板。与探针承载器基板接触的支撑柱是垂直可调的，直到通过联接到探针卡布线板的锁定机构固定。当柱固定在固定位置时，位置是多个探头承载器基板的平面基本上平行于预定参考平面的位置。

2. 发明授权

US07728612B2 Probe card assembly and method of forming same 有权
标题翻译：探针卡组装及其形成方法
公开(公告)号：US07728612B2
公开(公告)日：2010-06-01
申请号：US11986453
申请日：2007-11-21
申请人： Raffi Garabedian , Nim Hak Tea , Steven Wang , Heather Karklin
发明人： Raffi Garabedian , Nim Hak Tea , Steven Wang , Heather Karklin
IPC分类号： G01R31/02 , G01R1/073
CPC分类号： G01R3/00 , G01R1/07378 , Y10T29/53243
摘要： A probe card assembly has a probe contactor substrate having a plurality of probe contactor tips thereon and a probe card wiring board with an interposer disposed between the two. Support posts contacting the probe contactor substrate are vertically adjustable until secured by a locking mechanism which is coupled to the probe card wiring board. When the posts are secured in a fixed position, the position is one in which the plane of the plurality of probe contactor substrates is substantially parallel to a predetermined reference plane.
摘要翻译：探针卡组件具有在其上具有多个探针接触器尖端的探针接触器基板和设置在两者之间的插入器的探针卡布线板。与探针接触器基板接触的支撑柱是垂直可调的，直到通过联接到探针卡布线板的锁定机构固定。当柱固定在固定位置时，位置是多个探针接触器基板的平面基本上平行于预定参考平面的位置。

3. 发明授权

US07759952B2 Method of forming probe card assembly 有权
标题翻译：形成探针卡组件的方法
公开(公告)号：US07759952B2
公开(公告)日：2010-07-20
申请号：US11901014
申请日：2007-09-14
申请人： Raffi Garabedian , Nim Hak Tea , Steven Wang , Heather Karklin
发明人： Raffi Garabedian , Nim Hak Tea , Steven Wang , Heather Karklin
IPC分类号： G01R31/02
CPC分类号： G01R3/00 , G01R1/07378 , Y10T29/53243
摘要： A probe card assembly has a probe contactor substrate having a plurality of probe contactor tips thereon and a probe card wiring board with an interposer disposed between the two. Support posts contacting the probe contactor substrate are vertically adjustable until secured by a locking mechanism which is coupled to the probe card wiring board. When the posts are secured in a fixed position, the position is one in which the plane of the plurality of probe contactor substrates is substantially parallel to a predetermined reference plane.
摘要翻译：探针卡组件具有在其上具有多个探针接触器尖端的探针接触器基板和设置在两者之间的插入器的探针卡布线板。与探针接触器基板接触的支撑柱是垂直可调的，直到通过联接到探针卡布线板的锁定机构固定。当柱固定在固定位置时，位置是多个探针接触器基板的平面基本上平行于预定参考平面的位置。

4. 发明申请

US20080211525A1 Probe card assembly and method of forming same 有权
标题翻译：探针卡组装及其形成方法
公开(公告)号：US20080211525A1
公开(公告)日：2008-09-04
申请号：US11986453
申请日：2007-11-21
申请人： Raffi Garabedian , Nim Hak Tea , Steven Wang , Heather Karklin
发明人： Raffi Garabedian , Nim Hak Tea , Steven Wang , Heather Karklin
IPC分类号： G01R1/073
CPC分类号： G01R3/00 , G01R1/07378 , Y10T29/53243
摘要： A probe card assembly has a probe contactor substrate having a plurality of probe contactor tips thereon and a probe card wiring board with an interposer disposed between the two. Support posts contacting the probe contactor substrate are vertically adjustable until secured by a locking mechanism which is coupled to the probe card wiring board. When the posts are secured in a fixed position, the position is one in which the plane of the plurality of probe contactor substrates is substantially parallel to a predetermined reference plane.
摘要翻译：探针卡组件具有在其上具有多个探针接触器尖端的探针接触器基板和设置在两者之间的插入器的探针卡布线板。与探针接触器基板接触的支撑柱是垂直可调的，直到通过联接到探针卡布线板的锁定机构固定。当柱固定在固定位置时，位置是多个探针接触器基板的平面基本上平行于预定参考平面的位置。

5. 发明授权

US07271022B2 Process for forming microstructures 有权
标题翻译：微结构形成工艺
公开(公告)号：US07271022B2
公开(公告)日：2007-09-18
申请号：US11102982
申请日：2005-04-11
申请人： Weilong Tang , Tseng-Yang Hsu , Salleh Ismail , Nim Hak Tea , Melvin B Khoo , Raffi Garabedian , Lakshimikanth Namburi
发明人： Weilong Tang , Tseng-Yang Hsu , Salleh Ismail , Nim Hak Tea , Melvin B Khoo , Raffi Garabedian , Lakshimikanth Namburi
IPC分类号： H01L21/00 , H01L21/4763
CPC分类号： B81C1/00436 , B81C1/00666 , B81C2201/0107 , B81C2201/0197
摘要： The present invention relates to a process for forming microstructures on a substrate. A plating surface is applied to a substrate. A first layer of photoresist is applied on top of the plating base. The first layer of photoresist is exposed to radiation in a pattern to render the first layer of photoresist dissolvable in a first pattern. The dissolvable photoresist is removed and a first layer of primary metal is electroplated in the area where the first layer of photoresist was removed. The remainder of the photoresist is then removed and a second layer of photoresist is then applied over the plating base and first layer of primary metal. The second layer of photoresist is then exposed to a second pattern of radiation to render the photoresist dissolvable and the dissolvable photoresist is removed. The second pattern is an area that surrounds the primary structure, but it does not entail the entire substrate. Rather it is an island surrounding the primary metal. The exposed surface of the secondary metal is then machined down to a desired height of the primary metal. The secondary metal is then etched away.
摘要翻译：本发明涉及一种在基板上形成微观结构的方法。将电镀表面施加到基板。将第一层光致抗蚀剂施加在电镀基底上。第一层光致抗蚀剂以图案暴露于辐射，以使第一层光致抗蚀剂以第一图案溶解。去除可溶解的光致抗蚀剂，并且在去除第一层光致抗蚀剂的区域中电镀第一层初级金属。然后除去光致抗蚀剂的其余部分，然后将第二层光致抗蚀剂涂覆在镀覆基底和第一层金属的第一层上。然后将第二层光致抗蚀剂暴露于第二辐射图案，以使光致抗蚀剂可溶解并除去可溶解的光致抗蚀剂。第二图案是围绕一次结构的区域，但不包含整个基板。相反，它是一个围绕着主要金属的岛屿。然后将次级金属的暴露表面加工到初级金属的期望高度。然后将二次金属蚀刻掉。

6. 发明授权

US07264984B2 Process for forming MEMS 有权
标题翻译： MEMS成型工艺
公开(公告)号：US07264984B2
公开(公告)日：2007-09-04
申请号：US11019912
申请日：2004-12-21
申请人： Raffi Garabedian , Salleh Ismail , Nim Hak Tea , Tseng-Yang Hsu , Melvin B Khoo , Weilong Tang
发明人： Raffi Garabedian , Salleh Ismail , Nim Hak Tea , Tseng-Yang Hsu , Melvin B Khoo , Weilong Tang
IPC分类号： H01L21/44 , H01L21/302
CPC分类号： B81C1/00666 , B81C2201/0109 , B81C2201/0197
摘要： The present invention relates to a process for forming microstructures on a substrate. A plating surface is applied to a substrate. A first layer of photoresist is applied on top of the plating base. The first layer of photoresist is exposed to radiation in a pattern to render the first layer of photoresist dissolvable in a first pattern. The dissolvable photoresist is removed and a first layer of primary metal is electroplated in the area where the first layer of photoresist was removed. The remainder of the photoresist is then removed and a second layer of photoresist is then applied over the plating base and first layer of primary metal. The second layer of photoresist is then exposed to a second pattern of radiation to render the photoresist dissolvable and the dissolvable photoresist is removed. The second pattern is an area that surrounds the primary structure, but it does not entail the entire substrate. Rather it is an island surrounding the primary metal. The exposed surface of the secondary metal is then machined down to a desired height of the primary metal. The secondary metal is then etched away.
摘要翻译：本发明涉及一种在基板上形成微观结构的方法。将电镀表面施加到基板。将第一层光致抗蚀剂施加在电镀基底上。第一层光致抗蚀剂以图案暴露于辐射，以使第一层光致抗蚀剂以第一图案溶解。去除可溶解的光致抗蚀剂，并且在去除第一层光致抗蚀剂的区域中电镀第一层初级金属。然后除去光致抗蚀剂的其余部分，然后将第二层光致抗蚀剂涂覆在镀覆基底和第一层金属的第一层上。然后将第二层光致抗蚀剂暴露于第二辐射图案，以使光致抗蚀剂可溶解并除去可溶解的光致抗蚀剂。第二图案是围绕一次结构的区域，但不包含整个基板。相反，它是一个围绕着主要金属的岛屿。然后将次级金属的暴露表面加工到初级金属的期望高度。然后将二次金属蚀刻掉。

7. 发明授权

US06666825B2 Ultrasound transducer for improving resolution in imaging system 有权
标题翻译：超声波换能器可提高成像系统的分辨率
公开(公告)号：US06666825B2
公开(公告)日：2003-12-23
申请号：US09898811
申请日：2001-07-05
申请人： Lowell Scott Smith , Nim Hak Tea , Theodore Lauer Rhyne , Xuan-Ming Lu
发明人： Lowell Scott Smith , Nim Hak Tea , Theodore Lauer Rhyne , Xuan-Ming Lu
IPC分类号： A61B800
CPC分类号： G01N29/245 , A61B8/4281 , A61B8/485 , B06B1/0622 , G01N29/28 , G01N2291/0421 , G01N2291/0422 , G01N2291/106 , G01S7/52023 , G01S7/52079 , G03B42/06 , G10K11/02 , Y10T29/42
摘要： An ultrasound transducer employs a silicon acoustic matching layer closest to the piezoelectric layer in order to achieve improved resolution. A silicon wafer, ground to an appropriate thickness, is included in the acoustic stack with other matching layer materials during transducer construction. The exact thickness is determined by the details of the design, but is nominally a quarter wavelength in the silicon.
摘要翻译：超声波换能器采用最靠近压电层的硅声匹配层，以达到改善的分辨率。在换能器构造期间，研磨成适当厚度的硅晶片与其他匹配层材料一起被包括在声学堆叠中。精确的厚度由设计的细节决定，但在硅中名义上是四分之一波长。

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