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1. 发明授权

US07314291B2 LED lamp 有权
标题翻译：点灯
公开(公告)号：US07314291B2
公开(公告)日：2008-01-01
申请号：US10963401
申请日：2004-10-12
申请人： Ra-Min Tain , Shyi-Ching Liau , Tzong-Che Ho
发明人： Ra-Min Tain , Shyi-Ching Liau , Tzong-Che Ho
IPC分类号： F21V29/00 , H01L29/22
CPC分类号： H05B33/0857 , F21K9/00 , F21V7/0008 , F21V29/51 , F21V29/67 , F21V29/677 , F21V29/74 , F21Y2107/30 , F21Y2113/13 , F21Y2115/10 , H05B33/0803
摘要： An LED lamp includes LED chips, an axle, and a lampshade. The LED chips are mounted on surface of the axle. The axle extends across the lampshade. A heat pipe is installed inside the axle for transferring the heat generated by the LED chips to exterior of the lampshade and obtaining a better heat dissipation.
摘要翻译： LED灯包括LED芯片，轴和灯罩。 LED芯片安装在轴的表面上。车轴延伸穿过灯罩。轴内安装有热管，用于将LED芯片产生的热量传递到灯罩的外部，并获得更好的散热。

2. 发明授权

US07312478B2 Side structure of a bare LED and backlight module thereof 有权
标题翻译：裸LED及其背光模块的侧面结构
公开(公告)号：US07312478B2
公开(公告)日：2007-12-25
申请号：US11023487
申请日：2004-12-29
申请人： Ra-Min Tain , Shyi-Ching Liau , Tzong-Che Ho
发明人： Ra-Min Tain , Shyi-Ching Liau , Tzong-Che Ho
IPC分类号： H01L29/22
CPC分类号： H01L33/486 , H01L33/385 , H01L33/60 , H01L33/62 , H01L33/64 , H01L2924/0002 , H01L2924/00
摘要： The present invention discloses a side structure of a bare LED and a backlight module thereof, wherein the backlight module is preferably a light source of a display device such as an LCD device. The backlight module includes a flat plate covered with a thermally conductive dielectric material, a plurality of the side structures of the bare LEDs placed on the flat plate and in contact with the thermally conductive dielectric material, and a plurality of reflection parts also placed on the flat plate, each side structure of each bare LED includes a bare LED and two electrically conductive materials coupled to two bonding pads of the side structure of the bare LED respectively, and positioned on the flat plate therefor.
摘要翻译：本发明公开了一种裸露LED的侧面结构及其背光模块，其中，背光模块优选为LCD装置等显示装置的光源。背光模块包括被导热电介质材料覆盖的平板，放置在平板上并与导热介电材料接触的裸露LED的多个侧面结构，以及多个反射部分平板，每个裸LED的每个侧面结构包括裸LED和分别耦合到裸LED的侧结构的两个焊盘的两个导电材料，并且定位在其平板上。

3. 发明申请

US20070205427A1 Side structure of a bare LED and backlight module thereof 有权
公开(公告)号：US20070205427A1
公开(公告)日：2007-09-06
申请号：US11797789
申请日：2007-05-08
申请人： Ra-Min Tain , Shyi-Ching Liau , Tzong-Che Ho
发明人： Ra-Min Tain , Shyi-Ching Liau , Tzong-Che Ho
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/385 , H01L33/60 , H01L33/62 , H01L33/64 , H01L2924/0002 , H01L2924/00
摘要： The present invention discloses a side structure of a bare LED and a backlight module thereof, wherein the backlight module is preferably a light source of a display device such as an LCD device. The backlight module includes a flat plate covered with a thermally conductive dielectric material, a plurality of the side structures of the bare LEDs placed on the flat plate and in contact with the thermally conductive dielectric material, and a plurality of reflection parts also placed on the flat plate, each side structure of each bare LED includes a bare LED and two electrically conductive materials coupled to two bonding pads of the side structure of the bare LED respectively, and positioned on the flat plate therefor.

4. 发明申请

US20060027827A1 Side structure of a bare LED and backlight module thereof 有权
标题翻译：裸LED及其背光模块的侧面结构
公开(公告)号：US20060027827A1
公开(公告)日：2006-02-09
申请号：US11023487
申请日：2004-12-29
申请人： Ra-Min Tain , Shyi-Ching Liau , Tzong-Che Ho
发明人： Ra-Min Tain , Shyi-Ching Liau , Tzong-Che Ho
IPC分类号： H01L33/00 , H01L31/0203
CPC分类号： H01L33/486 , H01L33/385 , H01L33/60 , H01L33/62 , H01L33/64 , H01L2924/0002 , H01L2924/00
摘要： The present invention discloses a side structure of a bare LED and a backlight module thereof, wherein the backlight module is preferably a light source of a display device such as an LCD device. The backlight module includes a flat plate covered with a thermally conductive dielectric material, a plurality of the side structures of the bare LEDs placed on the flat plate and in contact with the thermally conductive dielectric material, and a plurality of reflection parts also placed on the flat plate, each side structure of each bare LED includes a bare LED and two electrically conductive materials coupled to two bonding pads of the side structure of the bare LED respectively, and positioned on the flat plate therefor.
摘要翻译：本发明公开了一种裸露LED的侧面结构及其背光模块，其中，背光模块优选为LCD装置等显示装置的光源。背光模块包括被导热电介质材料覆盖的平板，放置在平板上并与导热电介质材料接触的裸露LED的多个侧面结构以及多个反射部分平板，每个裸LED的每个侧面结构包括裸LED和分别耦合到裸LED的侧结构的两个焊盘的两个导电材料，并且定位在其平板上。

5. 发明申请

US20060001384A1 LED lamp 有权
标题翻译：点灯
公开(公告)号：US20060001384A1
公开(公告)日：2006-01-05
申请号：US10963401
申请日：2004-10-12
申请人： Ra-Min Tain , Shyi-Ching Liau , Tzong-Che Ho
发明人： Ra-Min Tain , Shyi-Ching Liau , Tzong-Che Ho
IPC分类号： H05B41/16
CPC分类号： H05B33/0857 , F21K9/00 , F21V7/0008 , F21V29/51 , F21V29/67 , F21V29/677 , F21V29/74 , F21Y2107/30 , F21Y2113/13 , F21Y2115/10 , H05B33/0803
摘要： An LED lamp includes bare LED chips, an axle, and a lampshade. The bare LED chips are mounted on surface of the axle. The axle extends across the lampshade. A heat pipe is installed inside the axle for transferring the heat generated by the LED chips to exterior of the lampshade and obtaining a better heat dissipation.
摘要翻译： LED灯包括裸LED芯片，轴和灯罩。裸露的LED芯片安装在轴的表面上。车轴延伸穿过灯罩。轴内安装有热管，用于将LED芯片产生的热量传递到灯罩的外部，并获得更好的散热。

6. 再颁专利

USRE43626E1 LED lamp 有权
标题翻译：点灯
公开(公告)号：USRE43626E1
公开(公告)日：2012-09-04
申请号：US12859141
申请日：2010-08-18
申请人： Ra-Min Tain , Tzong-Che Ho , Shyi-Ching Liau
发明人： Ra-Min Tain , Tzong-Che Ho , Shyi-Ching Liau
IPC分类号： F21V29/00 , H01L29/22
CPC分类号： H05B33/0857 , F21K9/00 , F21V7/0008 , F21V29/51 , F21V29/67 , F21V29/677 , F21V29/74 , F21Y2107/30 , F21Y2113/13 , F21Y2115/10 , H05B33/0803
摘要： An LED lamp includes LED chips, an axle, and a lampshade. The LED chips are mounted on surface of the axle. The axle which is coupled to the lampshade includes heat pipes for transferring the heat generated by the LED chips to exterior of the lampshade and obtaining a better heat dissipation.
摘要翻译： LED灯包括LED芯片，轴和灯罩。 LED芯片安装在轴的表面上。耦合到灯罩的轴包括用于将由LED芯片产生的热量传递到灯罩外部并获得更好散热的热管。

7. 发明授权

US07375384B2 Side structure of a bare LED and backlight module thereof 有权
标题翻译：裸LED及其背光模块的侧面结构
公开(公告)号：US07375384B2
公开(公告)日：2008-05-20
申请号：US11797789
申请日：2007-05-08
申请人： Ra-Min Tain , Shyi-Ching Liau , Tzong-Che Ho
发明人： Ra-Min Tain , Shyi-Ching Liau , Tzong-Che Ho
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/385 , H01L33/60 , H01L33/62 , H01L33/64 , H01L2924/0002 , H01L2924/00
摘要： The present invention discloses a side structure of a bare LED and a backlight module thereof, wherein the backlight module is preferably a light source of a display device such as an LCD device. The backlight module includes a flat plate covered with a thermally conductive dielectric material, a plurality of the side structures of the bare LEDs placed on the flat plate and in contact with the thermally conductive dielectric material, and a plurality of reflection parts also placed on the flat plate, each side structure of each bare LED includes a bare LED and two electrically conductive materials coupled to two bonding pads of the side structure of the bare LED respectively, and positioned on the flat plate therefor.
摘要翻译：本发明公开了一种裸露LED的侧面结构及其背光模块，其中，背光模块优选为LCD装置等显示装置的光源。背光模块包括被导热电介质材料覆盖的平板，放置在平板上并与导热介电材料接触的裸露LED的多个侧面结构，以及多个反射部分平板，每个裸LED的每个侧面结构包括裸LED和分别耦合到裸LED的侧结构的两个焊盘的两个导电材料，并且定位在其平板上。

8. 发明申请

US20070297178A1 LED LAMP 有权
标题翻译：点灯
公开(公告)号：US20070297178A1
公开(公告)日：2007-12-27
申请号：US11851930
申请日：2007-09-07
申请人： Ra-Min Tain , Shyi-Ching Liau , Tzong-Che Ho
发明人： Ra-Min Tain , Shyi-Ching Liau , Tzong-Che Ho
IPC分类号： F21V29/00
CPC分类号： H05B33/0857 , F21K9/00 , F21V7/0008 , F21V29/51 , F21V29/67 , F21V29/677 , F21V29/74 , F21Y2107/30 , F21Y2113/13 , F21Y2115/10 , H05B33/0803
摘要： An LED lamp includes bare LED chips, an axle, and a lampshade. The bare LED chips are mounted on surface of the axle. The axle extends across the lampshade. A heat pipe is installed inside the axle for transferring the heat generated by the LED chips to exterior of the lampshade and obtaining a better heat dissipation.
摘要翻译： LED灯包括裸LED芯片，轴和灯罩。裸露的LED芯片安装在轴的表面上。车轴延伸穿过灯罩。轴内安装有热管，用于将LED芯片产生的热量传递到灯罩的外部，并获得更好的散热。

9. 发明授权

US08026603B2 Interconnect structure of an integrated circuit and manufacturing method thereof 有权
标题翻译：集成电路的互连结构及其制造方法
公开(公告)号：US08026603B2
公开(公告)日：2011-09-27
申请号：US11408072
申请日：2006-04-21
申请人： Yung-Yu Hsu , Chih-Yuan Cheng , Shyi-Ching Liau , Min-Lin Lee , Ra-Min Tain , Rong-Chang Feng
发明人： Yung-Yu Hsu , Chih-Yuan Cheng , Shyi-Ching Liau , Min-Lin Lee , Ra-Min Tain , Rong-Chang Feng
IPC分类号： H01L23/52
CPC分类号： H01L24/12 , H01L23/49811 , H01L24/11 , H01L24/16 , H01L24/90 , H01L2224/1147 , H01L2224/11902 , H01L2224/13099 , H01L2224/1411 , H01L2224/16105 , H01L2224/16106 , H01L2224/16237 , H01L2224/81193 , H01L2224/81194 , H01L2224/81385 , H01L2224/81899 , H01L2924/01006 , H01L2924/014 , H01L2924/14 , H01L2924/351 , H05K3/326 , H05K2201/0373 , H05K2201/209 , H01L2924/00
摘要： An interconnect structure of an integrated circuit and manufacturing method therefore are provided, relating to an interconnect structure of flexible packaging. The interconnect structure includes a first and a second conductive pads. A plurality of tiny and conductive first pillars is respectively formed on the first and second pads. With different densities and thicknesses of the first and second pillars, a contact strength can be generated when the pillars interconnecting with each other, such that the pillars are connected closely. Furthermore, the interconnect structure can also be used to connect with fibers made of conductive materials. Moreover, the higher the density of the pillars, the stronger the contact strength. And, electronic substrates and active or passive electronic elements can be stuck on the other side of each pad. Therefore, the interconnect structure can maintain flexibility and have high reliability without being enhanced by any thermosetting polymer.
摘要翻译：因此，提供了与柔性包装的互连结构相关的集成电路和制造方法的互连结构。互连结构包括第一和第二导电焊盘。多个微小且导电的第一支柱分别形成在第一和第二垫上。当第一和第二支柱具有不同的密度和厚度时，当支柱互相连接时，可以产生接触强度，使得支柱紧密连接。此外，互连结构也可以用于与由导电材料制成的纤维连接。此外，支柱的密度越高，接触强度越强。并且，电子基板和有源或无源电子元件可以卡在每个垫的另一侧上。因此，互连结构可以保持柔性并且具有高可靠性，而不会被任何热固性聚合物增强。

10. 发明授权

US07354178B2 Structure of illuminating unit and structure of illuminating light source 失效
标题翻译：照明单元的结构和照明光源的结构
公开(公告)号：US07354178B2
公开(公告)日：2008-04-08
申请号：US11223557
申请日：2005-09-09
申请人： Wei-Kuo Han , Ra-Min Tain , Chin-Lung Chen , Shyi-Ching Liau
发明人： Wei-Kuo Han , Ra-Min Tain , Chin-Lung Chen , Shyi-Ching Liau
IPC分类号： F21V7/00
CPC分类号： F21V7/09 , F21Y2115/10 , G03B21/2013 , G03B21/2033 , G03B21/208 , Y10S362/80
摘要： A structure of illuminating unit includes a point-like light-emitting device, having an optical axis. An initial-stage conoid-like reflective surface has a convergent opening end and a divergent opening end. The point-like light-emitting device is located at the convergent opening end and the optical axis is toward the divergent end for emitting light. The initial-stage conoid-like reflective surface and the optical axis include an initial-stage included angle. A final-stage conoid-like reflective surface has a convergent opening end and a divergent opening end. The convergent opening end of the final-stage conoid-like reflective surface is coupled with the divergent opening end of the initial-stage conoid-like reflective surface. The final-stage conoid-like reflective surface and the optical axis include a final-stage included angle. The initial-stage included angle is larger than the final-stage included angle.
摘要翻译：照明单元的结构包括具有光轴的点状发光装置。初级锥形反射面具有收敛的开口端和发散的开口端。点状发光装置位于会聚开口端，光轴朝向发光端的发散端。初级锥形反射面和光轴包括初始阶段夹角。最后阶段的锥形反射表面具有收敛的开口端和发散的开口端。最终级锥形反射表面的会聚开口端与初始阶段锥形反射表面的发散开口端相连。最后阶段的锥形反射表面和光轴包括最终级夹角。初始包角大于最终级夹角。

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