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1. 发明授权

US11315866B2 Semiconductor device 有权
公开(公告)号：US11315866B2
公开(公告)日：2022-04-26
申请号：US16893650
申请日：2020-06-05
申请人： ROHM CO., LTD.
发明人： Isamu Nishimura , Hirofumi Takeda , Hideaki Yanagida , Taro Hayashi , Natsuki Sakamoto
IPC分类号： H01L29/40 , H01L23/498 , H01L23/48 , H01L21/48 , H01L23/00 , H01L43/04
摘要： A semiconductor device includes: a substrate including a main surface; a wiring portion including a first conductive layer formed on the main surface, and a first plating layer which is provided on the first conductive layer and on which an oxide film is formed; a semiconductor element including an element mounting surface and an element electrode formed on the element mounting surface; a bonding portion including a second plating layer made of the same material as the first plating layer and laminated on the first conductive layer, and a solder layer laminated on the second plating layer and bonded to the element electrode; and a sealing resin covering the semiconductor element.

2. 发明授权

US10879146B2 Electronic component and manufacturing method thereof 有权
公开(公告)号：US10879146B2
公开(公告)日：2020-12-29
申请号：US16373253
申请日：2019-04-02
申请人： ROHM CO., LTD.
发明人： Hideaki Yanagida
IPC分类号： H01L23/31 , H01L21/48 , H01L23/498 , H01L23/13 , H01L21/56 , H01L23/538 , H01L23/00
CPC分类号： H01L23/3135 , H01L21/481 , H01L21/4853 , H01L21/561 , H01L23/13 , H01L23/49811 , H01L23/49838 , H01L23/5386 , H01L24/08 , H01L2224/08225
摘要： An electronic component includes a substrate which has a first major surface on one side and a second major surface on the other side, a chip which has a mounting surface on one side and a non-mounting surface on the other side and is disposed on the first major surface of the substrate in a posture that the mounting surface faces the first major surface of the substrate, a sealing insulation layer which seals the chip so as to expose the non-mounting surface above the first major surface of the substrate, and a cover layer which covers the non-mounting surface of the chip.

3. 发明授权

US11811365B2 Terahertz device and method for manufacturing terahertz device 有权
公开(公告)号：US11811365B2
公开(公告)日：2023-11-07
申请号：US17832209
申请日：2022-06-03
申请人： ROHM CO., LTD.
发明人： Kazuisao Tsuruda , Hideaki Yanagida
IPC分类号： H03B7/08 , H01L23/14 , H01L23/28 , H01L23/498 , H01L23/538 , H01L23/66 , H01P1/20 , H01L23/00 , H01L23/31 , H01L25/065 , H01L25/00
CPC分类号： H03B7/08 , H01L23/14 , H01L23/28 , H01L23/3135 , H01L23/49811 , H01L23/49827 , H01L23/5389 , H01L23/66 , H01L24/16 , H01L24/81 , H01L24/97 , H01L25/0655 , H01L25/50 , H01P1/2005 , H01L2221/68345 , H01L2224/13111 , H03B2200/0084
摘要： Terahertz device includes first resin layer, columnar conductor, wiring layer, terahertz element, second resin layer, and external electrode. Resin layer includes first resin layer obverse face and first resin layer reverse face. Columnar conductor includes first conductor obverse face and first conductor reverse face, penetrating first resin layer in z-direction. Wiring layer spans between first resin layer obverse face and first conductor obverse face. Terahertz element includes element obverse face and element reverse face, and converts between terahertz wave and electric energy. Second resin layer includes second resin layer obverse face and second resin layer reverse face, and covers wiring layer and terahertz element. External electrode, disposed offset in a direction first resin layer reverse face faces with respect to first resin layer, is electrically connected to columnar conductor. Terahertz element is conductively bonded to wiring layer.

4. 发明授权

US10804190B2 Multi-chip module and method for manufacturing same 有权
公开(公告)号：US10804190B2
公开(公告)日：2020-10-13
申请号：US15180854
申请日：2016-06-13
申请人： ROHM CO., LTD.
发明人： Mamoru Yamagami , Yasuhiro Fuwa , Hideaki Yanagida , Takafumi Okada
IPC分类号： H05K1/18 , H01L23/498 , H01L21/683 , H01L23/31 , H01L21/56 , H05K1/16
摘要： A multi-chip module includes a plurality of chip parts with each chip part having an electrode, a sealing resin for sealing the plurality of chip parts, and an external connection terminal secured to the sealing resin so as to be exposed from the outer surface of the sealing resin and electrically connected to the electrode of at least one of the chip parts.

5. 发明授权

US10163775B2 Electronic device 有权
公开(公告)号：US10163775B2
公开(公告)日：2018-12-25
申请号：US15044878
申请日：2016-02-16
申请人： ROHM CO., LTD.
发明人： Hideaki Yanagida
IPC分类号： H05K1/18 , H01L23/498 , H01L23/13 , H01L23/14 , H01L21/48 , H01L23/31
摘要： The present disclosure provides an electronic device suitable for miniaturization. The present electronic device includes: a substrate (1), having a main surface (111) and a back surface (112) facing opposite sides with each other in a thickness direction, wherein the substrate comprises a semiconductor material; an electronic component (8), which is disposed over the substrate (1); and a conductive layer (3), which is electrically connected with the electronic component (8); wherein a recess for disposing the component (14) and a through recess (17) are formed in the substrate, in which recess for disposing the component (14) is recessed from the main surface (111), and the through recess (17) penetrates from the recess for disposing the component (14) to the back surface (112); the electronic component (8) is disposed over the recess for disposing the component (14); a metal-filled portion (4) is formed in the through recess (17), wherein the metal-filled portion blocks at least the bottom of the through recess (17) and is filled with a metal material; and the conductive layer (3) is formed at least from the through recess (17) to the back surface (112).

6. 发明授权

US09585254B2 Electronic device 有权
标题翻译：电子设备
公开(公告)号：US09585254B2
公开(公告)日：2017-02-28
申请号：US15015870
申请日：2016-02-04
申请人： ROHM CO., LTD.
发明人： Isamu Nishimura , Hideaki Yanagida , Michihiko Mifuji , Yasuhiro Fuwa
IPC分类号： H05K1/16 , H05K1/18 , H05K1/11
CPC分类号： H05K1/183 , H01L23/13 , H01L23/147 , H01L23/49827 , H01L2224/16225 , H01L2924/15156 , H01L2924/181 , H05K1/0306 , H05K1/111 , H05K1/112 , H05K1/186 , H05K2201/0162 , H05K2201/0376 , H05K2201/09036 , H01L2924/00012
摘要： An electronic device includes a semiconductor substrate, an electronic element mounted on the substrate, a conductive layer electrically connected to the electronic element, a sealing resin and a columnar conductor. The substrate has a recess formed in its obverse surface. The electronic element is mounted on the bottom surface of the recess. The conductive layer has an obverse-surface contacting region located on the obverse surface of the substrate. The sealing resin is disposed in at least a part of the recess for covering at least a part of the obverse surface of the substrate. The columnar conductor is electrically connected to the obverse-surface contacting region of the conductive layer and exposed from the sealing resin at a side opposite to the obverse surface of the substrate.
摘要翻译：电子设备包括半导体衬底，安装在衬底上的电子元件，与电子元件电连接的导电层，密封树脂和柱状导体。基板具有在其正面形成的凹部。电子元件安装在凹槽的底面上。导电层具有位于基板的正面上的正面接触区域。密封树脂设置在用于覆盖基板的正面的至少一部分的凹部的至少一部分中。柱状导体与导电层的正面接触区域电连接，并且在密封树脂的与基板的正面相反的一侧露出。

7. 发明授权

US11894494B2 Terahertz device and production method for terahertz device 有权
公开(公告)号：US11894494B2
公开(公告)日：2024-02-06
申请号：US17266008
申请日：2019-07-26
申请人： ROHM CO., LTD.
发明人： Kazuisao Tsuruda , Jaeyoung Kim , Hideaki Yanagida , Toshikazu Mukai
IPC分类号： H01L33/48 , H01L33/52 , H01L33/60 , H01L33/62
CPC分类号： H01L33/483 , H01L33/52 , H01L33/60 , H01L33/62 , H01L2933/005 , H01L2933/0016
摘要： A terahertz device includes a terahertz element, a sealing resin, a wiring layer and a frame-shaped member. The terahertz element that performs conversion between terahertz waves and electric energy. The terahertz element has an element front surface and an element back surface spaced apart from each other in a first direction. The sealing resin covers the terahertz element. The wiring layer is electrically connected to the terahertz element. A frame-shaped member is made of a conductive material and arranged around the terahertz element as viewed in the first direction. The frame-shaped member has a reflective surface capable of reflecting the terahertz waves.

8. 发明授权

US11705399B2 Terminal configuration and semiconductor device 有权
公开(公告)号：US11705399B2
公开(公告)日：2023-07-18
申请号：US17851313
申请日：2022-06-28
申请人： ROHM CO., LTD.
发明人： Hideaki Yanagida , Yoshihisa Takada
IPC分类号： H01L23/528 , H01L23/532 , H01L23/00
CPC分类号： H01L23/5283 , H01L23/53233 , H01L23/53261 , H01L24/20
摘要： There is provided a terminal that includes a first conductive layer; a wiring layer on the first conductive layer; a second conductive layer on the wiring layer; and a conductive bonding layer which is in contact with a bottom surface and a side surface of the first conductive layer, a side surface of the wiring layer, a portion of a side surface of the second conductive layer, and a portion of a bottom surface of the second conductive layer, wherein an end portion of the second conductive layer protrudes from an end portion of the first conductive layer and an end portion of the wiring layer, and wherein the conductive bonding layer is in contact with a bottom surface of the end portion of the second conductive layer.

9. 发明授权

US11417624B2 Electronic device having supporting resin and manufacturing method thereof 有权
公开(公告)号：US11417624B2
公开(公告)日：2022-08-16
申请号：US16704961
申请日：2019-12-05
申请人： ROHM CO., LTD.
发明人： Hideaki Yanagida
IPC分类号： H01L23/00 , H01L23/31 , H01L21/56
摘要： An electronic device includes: a first resin layer having a first resin layer main surface and a first resin layer inner surface; a columnar conductor having a columnar conductor main surface and a columnar conductor inner surface and penetrating the first resin layer in direction z; a wiring layer connecting the first resin layer main surface and the first conductor main surface; an electronic component being electrically connected and joined to the wiring layer; a second resin layer having a second resin layer main surface facing the same direction as the first resin layer main surface and a second resin layer inner surface being in contact with the first resin layer main surface, covering the wiring layer and the electronic component; and an external electrode closer to the side where the first resin layer inner surface faces than the first resin layer and is electrically connected to the columnar conductor.

10. 发明授权

US11387783B2 Terahertz device and method for manufacturing terahertz device 有权
公开(公告)号：US11387783B2
公开(公告)日：2022-07-12
申请号：US17296192
申请日：2019-11-28
申请人： ROHM CO., LTD.
发明人： Kazuisao Tsuruda , Hideaki Yanagida
IPC分类号： H03B7/08 , H01L23/14 , H01L23/28 , H01L23/498 , H01L23/538 , H01L23/66 , H01P1/20
摘要： Terahertz device includes first resin layer, columnar conductor, wiring layer, terahertz element, second resin layer, and external electrode. Resin layer includes first resin layer obverse face and first resin layer reverse face. Columnar conductor includes first conductor obverse face and first conductor reverse face, penetrating first resin layer in z-direction. Wiring layer spans between first resin layer obverse face and first conductor obverse face. The terahertz element includes element obverse face and element reverse face, and converts between terahertz wave and electric energy. Second resin layer includes second resin layer obverse face and second resin layer reverse face, and covers wiring layer and terahertz element. External electrode, disposed offset in a direction first resin layer reverse face faces with respect to first resin layer, is electrically connected to columnar conductor.

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