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1. 发明申请

US20120187430A1 Packaging Photon Building Blocks Having Only Top Side Connections in a Molded Interconnect Structure 有权
标题翻译：包装模制互连结构中仅具有顶侧连接的光子构件
公开(公告)号：US20120187430A1
公开(公告)日：2012-07-26
申请号：US13441903
申请日：2012-04-08
申请人： R. Scott West , Tao Tong , Mike Kwon , Michael Solomensky
发明人： R. Scott West , Tao Tong , Mike Kwon , Michael Solomensky
IPC分类号： H01L33/58
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/642 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/49113 , H01L2224/73265 , H01L2924/07811 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2933/0075 , H01L2924/00014 , H01L2924/00
摘要： Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.
摘要翻译：标准化的光子构建块被封装在模制的互连结构中以形成各种LED阵列产品。没有电导体穿过安装有LED管芯的基板的顶表面和底表面之间。高反射材料的微点喷射到顶面上。衬底顶表面上的着陆垫连接到布置在互连结构的唇缘下侧的接触垫。在焊料回流工艺中，光子构建块在互连结构内自对准。互连结构中的导体通过接触焊盘和着陆焊盘电耦合到光子构建块中的LED管芯。压缩成型用于在LED管芯上形成透镜，并留下覆盖着色焊盘的硅胶闪光层。通过在闪光层处的喷砂颗粒去除着陆垫上方的闪光层。

2. 发明授权

US08652860B2 Packaging photon building blocks having only top side connections in a molded interconnect structure 有权
标题翻译：包装光子构件在模制互连结构中仅具有顶侧连接
公开(公告)号：US08652860B2
公开(公告)日：2014-02-18
申请号：US13441903
申请日：2012-04-08
申请人： R. Scott West , Tao Tong , Mike Kwon , Michael Solomensky
发明人： R. Scott West , Tao Tong , Mike Kwon , Michael Solomensky
IPC分类号： H01L21/00
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/642 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/49113 , H01L2224/73265 , H01L2924/07811 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2933/0075 , H01L2924/00014 , H01L2924/00
摘要： Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.
摘要翻译：标准化的光子构建块被封装在模制的互连结构中以形成各种LED阵列产品。没有电导体穿过安装有LED管芯的基板的顶表面和底表面之间。高反射材料的微点喷射到顶面上。衬底顶表面上的着陆垫连接到布置在互连结构的唇缘下侧的接触垫。在焊料回流工艺中，光子构建块在互连结构内自对准。互连结构中的导体通过接触焊盘和着陆焊盘电耦合到光子构建块中的LED管芯。压缩成型用于在LED管芯上形成透镜，并留下覆盖着色焊盘的硅胶闪光层。通过在闪光层处的喷砂颗粒去除着陆垫上方的闪光层。

3. 发明授权

US08536605B2 Micro-bead blasting process for removing a silicone flash layer 有权
标题翻译：用于去除硅胶闪光层的微珠喷砂工艺
公开(公告)号：US08536605B2
公开(公告)日：2013-09-17
申请号：US13304769
申请日：2011-11-28
申请人： R. Scott West , Tao Tong , Mike Kwon
发明人： R. Scott West , Tao Tong , Mike Kwon
IPC分类号： H01L33/58 , B24C1/08
CPC分类号： H01L33/56 , B24C1/003 , B24C1/04 , B24C3/322 , H01L25/0753 , H01L33/54 , H01L33/58 , H01L2224/48091 , H01L2224/48137 , H01L2933/0033 , H01L2933/005 , H01L2924/00 , H01L2924/00014
摘要： Using compression molding to form lenses over LED arrays on a metal core printed circuit board leaves a flash layer of silicone covering the contact pads that are later required to connect the arrays to power. A method for removing the flash layer involves blasting particles of sodium bicarbonate at the flash layer. A nozzle is positioned within thirty millimeters of the top surface of the flash layer. The stream of air that exits from the nozzle is directed towards the top surface at an angle between five and thirty degrees away from normal to the top surface. The particles of sodium bicarbonate are added to the stream of air and then collide into the top surface of the silicone flash layer until the flash layer laterally above the contact pads is removed. The edge of silicone around the cleaned contact pad thereafter contains a trace amount of sodium bicarbonate.
摘要翻译：使用压缩成型在金属芯印刷电路板上的LED阵列上形成透镜，留下覆盖接触焊盘的硅胶闪光层，这些接触焊盘将阵列连接到电源。去除闪蒸层的方法包括在闪蒸层处喷射碳酸氢钠颗粒。喷嘴位于闪光层顶表面三十毫米内。从喷嘴出来的空气流以垂直于顶表面的五至三十度之间的角度指向顶表面。将碳酸氢钠颗粒加入到空气流中，然后碰撞到硅氧烷闪蒸层的顶表面，直到去除接触垫横向上方的闪蒸层。清洁的接触垫周围的硅树脂的边缘其后含有痕量的碳酸氢钠。

4. 发明申请

US20130134459A1 Micro-Bead Blasting Process for Removing a Silicone Flash Layer 有权
标题翻译：用于去除硅酮闪光层的微珠爆破过程
公开(公告)号：US20130134459A1
公开(公告)日：2013-05-30
申请号：US13304769
申请日：2011-11-28
申请人： R. Scott West , Tao Tong , Mike Kwon
发明人： R. Scott West , Tao Tong , Mike Kwon
IPC分类号： H01L33/58 , B24C1/08
CPC分类号： H01L33/56 , B24C1/003 , B24C1/04 , B24C3/322 , H01L25/0753 , H01L33/54 , H01L33/58 , H01L2224/48091 , H01L2224/48137 , H01L2933/0033 , H01L2933/005 , H01L2924/00 , H01L2924/00014
摘要： Using compression molding to form lenses over LED arrays on a metal core printed circuit board leaves a flash layer of silicone covering the contact pads that are later required to connect the arrays to power. A method for removing the flash layer involves blasting particles of sodium bicarbonate at the flash layer. A nozzle is positioned within thirty millimeters of the top surface of the flash layer. The stream of air that exits from the nozzle is directed towards the top surface at an angle between five and thirty degrees away from normal to the top surface. The particles of sodium bicarbonate are added to the stream of air and then collide into the top surface of the silicone flash layer until the flash layer laterally above the contact pads is removed. The edge of silicone around the cleaned contact pad thereafter contains a trace amount of sodium bicarbonate.
摘要翻译：使用压缩成型在金属芯印刷电路板上的LED阵列上形成透镜，留下覆盖接触焊盘的硅胶闪光层，这些接触焊盘将阵列连接到电源。去除闪蒸层的方法包括在闪蒸层处喷射碳酸氢钠颗粒。喷嘴位于闪光层顶表面三十毫米内。从喷嘴出来的空气流以垂直于顶表面的五至三十度之间的角度指向顶表面。将碳酸氢钠颗粒加入到空气流中，然后碰撞到硅氧烷闪蒸层的顶表面，直到去除接触垫横向上方的闪蒸层。清洁的接触垫周围的硅树脂的边缘其后含有痕量的碳酸氢钠。

5. 发明申请

US20140077235A1 Substrate Free LED Package 有权
标题翻译：基板免费LED封装
公开(公告)号：US20140077235A1
公开(公告)日：2014-03-20
申请号：US13619886
申请日：2012-09-14
申请人： Mike Kwon , Gerry Keller , Scott West , Tao Tong , Babak Imangholi
发明人： Mike Kwon , Gerry Keller , Scott West , Tao Tong , Babak Imangholi
IPC分类号： H01L27/15 , H01L33/46 , H01L33/60 , H01L33/52
CPC分类号： H01L27/156 , H01L21/568 , H01L24/18 , H01L24/19 , H01L24/24 , H01L24/82 , H01L33/0095 , H01L33/486 , H01L33/52 , H01L33/54 , H01L33/58 , H01L33/60 , H01L2224/04105 , H01L2224/24137 , H01L2224/96 , H01L2924/12041 , H01L2924/12042 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2924/00
摘要： A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies.
摘要翻译：一种制造无衬底发光二极管（LED）的方法，包括将LED管芯布置在带上以形成LED晶片组件，在LED晶片组件的第一侧上的至少一个LED管芯上模制封装结构，去除所述带，在所述LED晶片组件的第二侧上形成电介质层，在所述电介质层上形成过大的接触区域，以形成虚拟LED晶片组件，以及将所述虚拟LED晶片组件分成包括至少一个LED的预定区域。胶带可以是载带或锯条。在将虚拟LED晶片组件分成包括在电耦合的LED管芯之间的预定区域之前，几个LED管芯也可以电耦合。

6. 发明授权

US08748202B2 Substrate free LED package 有权
标题翻译：基板免费LED封装
公开(公告)号：US08748202B2
公开(公告)日：2014-06-10
申请号：US13619886
申请日：2012-09-14
申请人： Mike Kwon , Gerry Keller , Scott West , Tao Tong , Babak Imangholi
发明人： Mike Kwon , Gerry Keller , Scott West , Tao Tong , Babak Imangholi
IPC分类号： H01L21/00
CPC分类号： H01L27/156 , H01L21/568 , H01L24/18 , H01L24/19 , H01L24/24 , H01L24/82 , H01L33/0095 , H01L33/486 , H01L33/52 , H01L33/54 , H01L33/58 , H01L33/60 , H01L2224/04105 , H01L2224/24137 , H01L2224/96 , H01L2924/12041 , H01L2924/12042 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2924/00
摘要： A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies.
摘要翻译：一种制造无衬底发光二极管（LED）的方法，包括将LED管芯布置在带上以形成LED晶片组件，在LED晶片组件的第一侧上的至少一个LED管芯上模制封装结构，去除所述带，在所述LED晶片组件的第二侧上形成电介质层，在所述电介质层上形成过大的接触区域，以形成虚拟LED晶片组件，以及将所述虚拟LED晶片组件分成包括至少一个LED的预定区域。胶带可以是载带或锯条。在将虚拟LED晶片组件分成包括在电耦合的LED管芯之间的预定区域之前，几个LED管芯也可以电耦合。

7. 发明授权

US07117007B2 Enhanced mobility wireless local loop phone 失效
标题翻译：增强移动无线本地环路手机
公开(公告)号：US07117007B2
公开(公告)日：2006-10-03
申请号：US10660080
申请日：2003-09-10
申请人： Satoru Yukie , Mike Kwon , Duk San Kim , Craig M. Hagopian
发明人： Satoru Yukie , Mike Kwon , Duk San Kim , Craig M. Hagopian
IPC分类号： H04M1/00
CPC分类号： H04W88/021 , H04W84/14
摘要： Methods and apparatus for implementing a wireless local loop phone that operates connected to or disconnected from a terminal unit. In one implementation, a phone system includes: a terminal unit comprising: a power source, a handset connection; a handset comprising: an antenna, a modem connected to said antenna, a terminal unit connection, a handset user interface; wherein said modem provides an air interface using said antenna, said air interface provides a wireless local loop, when said handset is connected to said terminal unit through said handset connection and said terminal unit connection, said handset receives power from said power source.
摘要翻译：实现与终端单元连接或断开连接的无线本地环路电话的方法和装置。在一个实现中，电话系统包括：终端单元，包括：电源，手机连接; 手机，包括：天线，连接到所述天线的调制解调器，终端单元连接，手机用户接口; 其中所述调制解调器使用所述天线提供空中接口，所述空中接口提供无线本地环路，当所述手机通过所述手机连接和所述终端单元连接连接到所述终端单元时，所述手机从所述电源接收电力。

8. 发明授权

US07995987B2 Telephony terminal 有权
标题翻译：电话终端
公开(公告)号：US07995987B2
公开(公告)日：2011-08-09
申请号：US11549882
申请日：2006-10-16
申请人： Satoru Yukie , Mike Kwon , Craig M. Hagopian , Kazuhiko Shirai
发明人： Satoru Yukie , Mike Kwon , Craig M. Hagopian , Kazuhiko Shirai
IPC分类号： H04M11/00
CPC分类号： H04M1/2535 , H04L12/66 , H04M1/725 , H04M1/738 , H04M3/4938 , H04M7/0003 , H04M7/0036 , H04M7/0054 , H04M7/1235 , H04M7/1295
摘要： Methods and apparatus implementing a telephony terminal for connecting a telephone to a data network. In one implementation, a telephony system includes: a phone connection for connecting to a telephone; a network connection for connecting to a network; and a controller connected to said phone connection and to said network connection; wherein said controller provides a phone service for processing inflation for said phone connection, said controller provides a network service for processing information for said network connection, and said controller provides a network voice service for converting information to and from a network voice format.
摘要翻译：实现用于将电话连接到数据网络的电话终端的方法和装置。在一个实现中，电话系统包括：用于连接到电话的电话连接; 用于连接到网络的网络连接; 以及连接到所述电话连接和所述网络连接的控制器; 其中所述控制器提供用于处理所述电话连接的信息的电话服务，所述控制器提供用于处理所述网络连接的信息的网络服务，并且所述控制器提供网络语音服务以将信息转换为网络语音格式和从网络语音格式转换信息。

9. 发明申请

US20070004401A1 ENHANCED MOBILITY WIRELESS LOCAL LOOP PHONE 失效
标题翻译：增强机动性无线本地环路电话
公开(公告)号：US20070004401A1
公开(公告)日：2007-01-04
申请号：US11530214
申请日：2006-09-08
申请人： Satoru Yukie , Mike Kwon , Duk Kim , Craig Hagopian
发明人： Satoru Yukie , Mike Kwon , Duk Kim , Craig Hagopian
IPC分类号： H04Q7/20
CPC分类号： H04W88/021 , H04W84/14
摘要： Methods and apparatus for implementing a wireless local loop phone that operates connected to or disconnected from a terminal unit. In one implementation, a phone system includes: a terminal unit comprising: a power source, a handset connection; a handset comprising: an antenna, a modem connected to the antenna, a terminal unit connection, a handset user interface; and a power connection cable connected to the handset connection and to the terminal unit connection; wherein the modem provides an air interface using the antenna, and the air interface provides a wireless local loop, when the handset is connected to the terminal unit through the handset connection and the terminal unit connection, the handset receives power from the power source through the power connection cable.
摘要翻译：实现与终端单元连接或断开连接的无线本地环路电话的方法和装置。在一个实现中，电话系统包括：终端单元，包括：电源，手机连接; 手机，包括：天线，连接到天线的调制解调器，终端单元连接，手机用户接口; 以及连接到手机连接和终端单元连接的电源连接电缆; 其中所述调制解调器使用所述天线提供空中接口，并且所述空中接口提供无线本地环路，当所述手机通过所述手机连接和所述终端单元连接与所述终端单元连接时，所述手机通过所述手机从所述电源接收电力电源连接电缆

10. 发明申请

US20060264171A1 INTEGRATION OF FIXED WIRELESS TERMINAL WITH BROADCAST RADIO RECEIVING DEVICES 审中-公开
标题翻译：固定无线终端与广播无线电接收设备的集成
公开(公告)号：US20060264171A1
公开(公告)日：2006-11-23
申请号：US11462800
申请日：2006-08-07
申请人： Mike Kwon , David Kim , Sidney Park , Simon Yi
发明人： Mike Kwon , David Kim , Sidney Park , Simon Yi
IPC分类号： H04H1/00 , H04M1/00
CPC分类号： H04B1/3805 , H04H60/80 , H04H60/90
摘要： A system comprising: a broadcast radio receiving device configured to receive and provide broadcast audio-visual signals; and a fixed wireless terminal apparatus coupled to the broadcast radio receiving device, wherein the fixed wireless terminal apparatus manages and controls characteristics of the broadcast audio-visual signals.
摘要翻译：一种系统，包括：广播无线电接收装置，被配置为接收并提供广播视听信号; 以及耦合到所述广播无线电接收装置的固定无线终端装置，其中所述固定无线终端装置管理和控制所述广播视听信号的特性。

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