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    • 1. 发明授权
    • Optical connector with direct mounted photo diode
    • 带直接安装光电二极管的光连接器
    • US4818056A
    • 1989-04-04
    • US020269
    • 1987-03-02
    • R. Scott EnochsScott R. JansenDaniel R. MurphyRandy S. RandallJoanne Roth
    • R. Scott EnochsScott R. JansenDaniel R. MurphyRandy S. RandallJoanne Roth
    • G02B6/42H01L21/02H01L33/00
    • G02B6/4204G02B6/421G02B6/4292
    • An optical connector in accordance with the invention includes a body to which an optical fiber supporting ferrule is mounted. A photo diode is rigidly mounted to the connector such that the photo active portion of the photo diode is optically coupled to the optical fiber. An interface is provided between the photo diode and an electronic circuit. In one form of the invention, the electronic circuit is mounted to the optical connector to facilitate this interface. Alternately, the circuit may be remote from the connector. In this case, the connector includes at least one electrically conductive wire lead for connecting the photo diode to the electronic circuit. An apertured substrate may be used to mount the photo diode to the ferrule with the photo diode optically coupled to the optical fiber through the aperture. The structure may be capped for protection against the environment, or alternatively, the circuit board itself may provide protection to the opto-electronic interface.
    • 根据本发明的光连接器包括安装有光纤支撑套圈的主体。 光电二极管刚性地安装到连接器上,使得光电二极管的光有源部分光耦合到光纤。 在光电二极管和电子电路之间提供接口。 在本发明的一种形式中,电子电路安装到光学连接器以便于该接口。 或者,电路可以远离连接器。 在这种情况下,连接器包括用于将光电二极管连接到电子电路的至少一个导电导线。 可以使用有孔衬底将光电二极管安装到套圈上,光电二极管通过孔与光纤光学耦合。 该结构可以被封盖以防止环境,或者替代地,电路板本身可以为光电接口提供保护。
    • 3. 发明授权
    • Electro-optical transducer module
    • 电光传感器模块
    • US5123065A
    • 1992-06-16
    • US716472
    • 1991-06-17
    • R. Scott Enochs
    • R. Scott Enochs
    • G02F1/035
    • G02F1/0356
    • An electro-optical transducer module assembly has a substrate on which is secured a guided-wave transducer having an optical waveguide and electrode structure formed on one surface thereof with the waveguide surface in a facing relationship with the substrate. Spacers are provided to position the transducer above the substrate surface and means are provided to electrically connect the electrode structure with the substrate. Optical waveguides are affixed to the substrate adjacent to the transducer for coupling an optical signal into and out of the transducer.
    • 电光换能器模块组件具有衬底,在其上固定导波传感器,该波导传感器具有在其一个表面上形成有与衬底相对的波导表面的光波导和电极结构。 提供隔板以将换能器定位在衬底表面上方,并且提供用于将电极结构与衬底电连接的装置。 将光波导固定到与换能器相邻的衬底上,以将光学信号耦合到换能器中和从换能器射出。
    • 4. 发明授权
    • Method for attaching an optical fiber to a substrate to form an optical
fiber package
    • 将光纤连接到基板以形成光纤封装的方法
    • US4702547A
    • 1987-10-27
    • US889703
    • 1986-07-28
    • R. Scott Enochs
    • R. Scott Enochs
    • G02B6/00G02B6/36G02B6/42
    • G02B6/4202G02B6/4236G02B6/4248G02B6/3636G02B6/3652
    • A new and efficient method for attaching an optical fiber to a substrate to form a structurally secure optical fiber package is disclosed. The method first involves coating an optical fiber with an external layer of gold. A silicon retaining member is then provided having a groove therein sized to retain and receive the coated optical fiber. The silicon retaining member and optical fiber are then positioned on a substrate preferably constructed of alumina. Deposited on the substrate is at least one metal pad having an external gold layer on which the silicon retaining member is placed. The optical fiber, silicon retaining member, and substrate are then heated at a temperature sufficient to form a silicon/gold eutectic alloy between th silicon of the retaining member and the gold layers of the optical fiber and pad. Such heating involves a temperature of at least 370.degree. C. Heating is preferably accomplished using a resistor secured to the underside of the substrate. The resulting package is characterized by improved strength, durability, and structural integrity.
    • 公开了一种用于将光纤附着到基板以形成结构上可靠的光纤封装的新颖而有效的方法。 该方法首先包括用外部金层涂覆光纤。 然后提供具有凹槽的硅保持构件,其尺寸设置成保持和接收涂覆的光纤。 然后将硅保持构件和光纤定位在优选由氧化铝构成的衬底上。 沉积在基底上的是具有外部金层的至少一个金属垫,其上放置硅保持构件。 然后在足以在保持构件的硅与光纤和衬垫的金层之间形成硅/金共晶合金的温度下加热光纤,硅保持构件和衬底。 这种加热涉及至少370℃的温度。优选使用固定到基底的下侧的电阻来实现加热。 得到的包装的特征在于强度,耐久性和结构完整性的改善。