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    • 1. 发明授权
    • Adhesive and sealant systems
    • 粘合剂和密封剂系统
    • US08022130B2
    • 2011-09-20
    • US10595853
    • 2004-11-17
    • Rüdiger NowakWerner MichelPia Buckel
    • Rüdiger NowakWerner MichelPia Buckel
    • C08K3/34
    • C09J11/04
    • Adhesive and sealant systems based on epoxy resins, polyurethane, silane-terminated polymers, silicones, unsaturated polyester resins, vinyl ester resins, acrylates, polyvinyl acetate, polyvinyl alcohol, polyvinyl ether, ethylene vinyl acetate, ethylene-acrylic acid copolymers, polyvinyl acetates, polystyrene, polyvinyl chloride, styrene-butadiene rubber, chloroprene rubber, nitrile rubber, butyl rubber, polysulfide, polyethylene, polypropylene, fluorinated hydrocarbons, polyamides, saturated polyesters and copolyesters, phenol-formaldehyde resins, cresol-/resorcinol-formaldehyde resins, urea-formaldehyde resins, melamine-formaldehyde resins, polyimides, polybenzimidazoles, polysulfones, which contain 1 wt. % to 15 wt. % of a compacted, hydrophobic pyrogenic silica.
    • 基于环氧树脂,聚氨酯,硅烷封端聚合物,硅酮,不饱和聚酯树脂,乙烯基酯树脂,丙烯酸酯,聚乙酸乙烯酯,聚乙烯醇,聚乙烯醚,乙烯乙酸乙烯酯,乙烯 - 丙烯酸共聚物,聚乙酸乙烯酯, 聚苯乙烯,聚氯乙烯,丁苯橡胶,氯丁二烯橡胶,丁腈橡胶,丁基橡胶,聚硫醚,聚乙烯,聚丙烯,氟化烃,聚酰胺,饱和聚酯和共聚酯,酚醛树脂,甲酚/间苯二酚 - 甲醛树脂, 甲醛树脂,三聚氰胺 - 甲醛树脂,聚酰亚胺,聚苯并咪唑,聚砜,其含有1重量% %至15wt。 %的压实的,疏水的热解二氧化硅。
    • 2. 发明申请
    • Adhesive and sealant systems
    • 粘合剂和密封剂系统
    • US20070129480A1
    • 2007-06-07
    • US10595853
    • 2004-11-17
    • Rudiger NowakWerner MichelPia Buckel
    • Rudiger NowakWerner MichelPia Buckel
    • C08K3/34
    • C09J11/04
    • Adhesive and sealant systems based on epoxy resins, polyurethane, silane-terminated polymers, silicones, unsaturated polyester resins, vinyl ester resins, acrylates, polyvinyl acetate, polyvinyl alcohol, polyvinyl ether, ethylene vinyl acetate, ethylene-acrylic acid copolymers, polyvinyl acetates, polystyrene, polyvinyl chloride, styrene-butadiene rubber, chloroprene rubber, nitrile rubber, butyl rubber, polysulfide, polyethylene, polypropylene, fluorinated hydrocarbons, polyamides, saturated polyesters and copolyesters, phenol-formaldehyde resins, cresol-/resorcinol-formaldehyde resins, urea-formaldehyde resins, melamine-formaldehyde resins, polyimides, polybenzimidazoles, polysulfones, which contain 1 wt. % to 15 wt. % of a compacted, hydrophobic pyrogenic silica.
    • 基于环氧树脂,聚氨酯,硅烷封端聚合物,硅酮,不饱和聚酯树脂,乙烯基酯树脂,丙烯酸酯,聚乙酸乙烯酯,聚乙烯醇,聚乙烯醚,乙烯乙酸乙烯酯,乙烯 - 丙烯酸共聚物,聚乙酸乙烯酯, 聚苯乙烯,聚氯乙烯,丁苯橡胶,氯丁二烯橡胶,丁腈橡胶,丁基橡胶,聚硫醚,聚乙烯,聚丙烯,氟化烃,聚酰胺,饱和聚酯和共聚酯,酚醛树脂,甲酚/间苯二酚 - 甲醛树脂, 甲醛树脂,三聚氰胺 - 甲醛树脂,聚酰亚胺,聚苯并咪唑,聚砜,其含有1重量% %至15wt。 %的压实的,疏水的热解二氧化硅。