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    • 3. 发明授权
    • Surface-mount type overcurrent protection element
    • 表面贴装型过电流保护元件
    • US08576043B2
    • 2013-11-05
    • US13519990
    • 2010-03-10
    • Zhengping LiuYutang LiuJun WangJinhua YangDaohua GaoZhen ChengQuantao LiTianju Sun
    • Zhengping LiuYutang LiuJun WangJinhua YangDaohua GaoZhen ChengQuantao LiTianju Sun
    • H01C7/10
    • H01C7/02H01C1/1406H01C17/28
    • A surface-mount type over-current protection element includes two single-layer composite chips, wherein one chip is made of a first core material and a first and a second metallic foil layer attached on the two surfaces of the first core material, the other chip is made of a second core material and a third and a fourth metallic foil layer attached to the two surfaces of the second core material. The protection element also has an insulating layer arranged between the two chips to electrically insulate and bond to the second and third metallic layers to form a bi-layer composite chip. Part of the first metallic foil layer and the corresponding part of the fourth metallic foil layer are etched to expose part of the first core material and correspond part of the second core material. One or more through-holes are made on the bi-layer composite chip for mounting.
    • 表面安装型过电流保护元件包括两个单层复合芯片,其中一个芯片由第一芯材料和附接在第一芯材料的两个表面上的第一和第二金属箔层制成,另一个 芯片由第二芯材料和附接到第二芯材的两个表面的第三和第四金属箔层制成。 保护元件还具有布置在两个芯片之间的绝缘层,以电绝缘并结合到第二和第三金属层以形成双层复合芯片。 第一金属箔层的一部分和第四金属箔层的对应部分被蚀刻以暴露第一芯材料的一部分并对应于第二芯材料的一部分。 在双层复合材料芯片上形成一个或多个通孔用于安装。