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1. 发明申请

US20130197850A1 Methods for Testing Wireless Electronic Devices Using Automatic Self-Test Mode 有权
标题翻译：使用自动自检模式测试无线电子设备的方法
公开(公告)号：US20130197850A1
公开(公告)日：2013-08-01
申请号：US13359292
申请日：2012-01-26
申请人： Qishan Yu , Jeffrey M. Thoma , Robert S. Sorensen
发明人： Qishan Yu , Jeffrey M. Thoma , Robert S. Sorensen
IPC分类号： G06F19/00 , G01R31/02
CPC分类号： G01R31/2822 , G01R31/2843 , H04M1/24
摘要： A device under test (DUT) may be tested using a radio-frequency test station. The DUT may include at least one antenna, wireless communications circuitry associated with the antenna, and other peripheral components such as a camera module, a display module, and audio circuitry. The test station may include a shielded enclosure in which the DUT is placed during testing. The DUT need not be electrically wired to any test equipment. The DUT may be configured to operate in self test mode. The DUT may be configured to obtain baseline noise floor measurements while all the peripheral components are deactivated and may be configured to obtain elevated noise floor measurements while selectively activating desired subsets of the peripheral components. The difference between the elevated and baseline noise floor measurements may be computed to determine whether at least some of the peripheral components negatively impact the antenna performance by an excessive amount.
摘要翻译：被测设备（DUT）可以使用射频测试台进行测试。 DUT可以包括至少一个天线，与天线相关联的无线通信电路以及诸如相机模块，显示模块和音频电路的其它外围组件。测试台可以包括在测试期间放置DUT的屏蔽外壳。 DUT不需要电连接到任何测试设备。 DUT可以配置为在自检模式下运行。 DUT可以被配置为在所有外围组件被去激活时获得基线噪声本底测量值，并且可以被配置为在选择性地激活外围组件的期望子集的同时获得提高的本底噪声测量值。可以计算升高和基线噪声基底测量值之间的差异，以确定至少一些外围组件是否会对天线性能造成过大的负面影响。

2. 发明授权

US09069037B2 Methods for testing wireless electronic devices using automatic self-test mode 有权
标题翻译：使用自动自检模式测试无线电子设备的方法
公开(公告)号：US09069037B2
公开(公告)日：2015-06-30
申请号：US13359292
申请日：2012-01-26
申请人： Qishan Yu , Jeffrey M. Thoma , Robert S. Sorensen
发明人： Qishan Yu , Jeffrey M. Thoma , Robert S. Sorensen
IPC分类号： G01R31/28 , H04M1/24
CPC分类号： G01R31/2822 , G01R31/2843 , H04M1/24
摘要： A device under test (DUT) may be tested using a radio-frequency test station. The DUT may include at least one antenna, wireless communications circuitry associated with the antenna, and other peripheral components such as a camera module, a display module, and audio circuitry. The test station may include a shielded enclosure in which the DUT is placed during testing. The DUT need not be electrically wired to any test equipment. The DUT may be configured to operate in self test mode. The DUT may be configured to obtain baseline noise floor measurements while all the peripheral components are deactivated and may be configured to obtain elevated noise floor measurements while selectively activating desired subsets of the peripheral components. The difference between the elevated and baseline noise floor measurements may be computed to determine whether at least some of the peripheral components negatively impact the antenna performance by an excessive amount.
摘要翻译：被测设备（DUT）可以使用射频测试台进行测试。 DUT可以包括至少一个天线，与天线相关联的无线通信电路以及诸如相机模块，显示模块和音频电路的其它外围组件。测试台可以包括在测试期间放置DUT的屏蔽外壳。 DUT不需要电连接到任何测试设备。 DUT可以配置为在自检模式下运行。 DUT可以被配置为在所有外围组件被去激活时获得基线噪声本底测量值，并且可以被配置为在选择性地激活外围组件的期望子集的同时获得提高的本底噪声测量值。可以计算升高和基线噪声基底测量值之间的差异，以确定至少一些外围组件是否会对天线性能造成过大的负面影响。

3. 发明授权

US08767408B2 Three dimensional passive multi-component structures 有权
标题翻译：三维无源多分量结构
公开(公告)号：US08767408B2
公开(公告)日：2014-07-01
申请号：US13592037
申请日：2012-08-22
申请人： Shawn X. Arnold , Douglas P. Kidd , Sean A. Mayo , Scott P. Mullins , Dennis R. Pyper , Jeffrey M. Thoma , Kenyu Tojima
发明人： Shawn X. Arnold , Douglas P. Kidd , Sean A. Mayo , Scott P. Mullins , Dennis R. Pyper , Jeffrey M. Thoma , Kenyu Tojima
IPC分类号： H05K1/18
CPC分类号： G06F1/183 , H01L2224/16227 , H01L2924/19106 , H05K1/0231 , H05K1/141 , H05K1/181 , H05K1/185 , H05K3/403 , H05K2201/10378 , H05K2201/10515 , H05K2201/1053 , H05K2201/10545 , Y02P70/611 , Y10T29/4913
摘要： Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to an interposer with an encapsulated third layer of components disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can couple signals between the components on the first and second layers.
摘要翻译：公开了堆叠的组件阵列。在一个实施例中，第一和第二层组件通过电介质和机械耦合到具有设置在第一层和第二层之间的被封装的第三层组件的中介层。第一层可以被配置为将堆叠的阵列附接到主机印刷电路板。插入器可以在第一层和第二层之间的组件之间耦合信号。

4. 发明申请

US20130201616A1 THREE DIMENSIONAL PASSIVE MULTI-COMPONENT STRUCTURES 有权
标题翻译：三维被动多组分结构
公开(公告)号：US20130201616A1
公开(公告)日：2013-08-08
申请号：US13595976
申请日：2012-08-27
申请人： Shawn X. ARNOLD , Douglas P. Kidd , Sean A. Mayo , Scott P. Mullins , Dennis R. Pyper , Jeffrey M. Thoma , Kenyu Tojima
发明人： Shawn X. ARNOLD , Douglas P. Kidd , Sean A. Mayo , Scott P. Mullins , Dennis R. Pyper , Jeffrey M. Thoma , Kenyu Tojima
IPC分类号： H05K7/06 , H05K3/30 , G06F1/16
CPC分类号： G06F1/183 , H01L2224/16227 , H01L2924/19106 , H05K1/0231 , H05K1/141 , H05K1/181 , H05K1/185 , H05K3/403 , H05K2201/10378 , H05K2201/10515 , H05K2201/1053 , H05K2201/10545 , Y02P70/611 , Y10T29/4913
摘要： Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to a thin interposer disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can insulate the components from one another and also couple signals between the components on the first and second layers. In one embodiment, the components in the first and second layers are passive components.
摘要翻译：公开了堆叠的组件阵列。在一个实施例中，第一和第二层部件电气和机械耦合到设置在第一和第二层之间的薄插入件。第一层可以被配置为将堆叠的阵列附接到主机印刷电路板。插入器可以将组件彼此绝缘，并且还可以在第一层和第二层之间的组件之间耦合信号。在一个实施例中，第一和第二层中的部件是无源部件。

5. 发明授权

US07752365B2 Bi-directional single conductor interrupt line for communication bus 失效
标题翻译：通信总线双向单导体中断线
公开(公告)号：US07752365B2
公开(公告)日：2010-07-06
申请号：US12060540
申请日：2008-04-01
申请人： John P. Taylor , Jeffrey M. Thoma
发明人： John P. Taylor , Jeffrey M. Thoma
IPC分类号： G06F13/00
CPC分类号： G06F13/24 , G06F13/4286 , G06F2213/0016
摘要： A bi-directional single conductor interrupt line is used in conjunction with a master only initiated data communication bus, to allow a slave device to submit a slave service request to a master device and to acknowledge master service requests from the master device. When not submitting a master service request, the master device maintains an interrupt line voltage at an idle state voltage by setting the interrupt line voltage through a pull resistor. The slave and master devices submit service requests by respectively driving or pulling the interrupt line voltage from the idle voltage to the service request voltage. The slave responds to a master service request or initiates the master servicing of a slave service request by subsequently driving the interrupt line back to the idle state voltage giving a slower slave ample time to prepare for a pending master initiated data transaction. The master detects the change in the interrupt line voltage from the request to the idle state and communicates to the now readied slave device through the data communication bus.
摘要翻译：双向单导体中断线与仅主机启动的数据通信总线结合使用，以允许从设备向主设备提交从服务请求并从主设备确认主服务请求。主设备在不提交主服务请求时，通过设置中断线电压通过一个拉电阻将中断线电压维持在空闲状态电压。从设备和主设备通过分别将中断线路电压从空闲电压驱动或拉出到服务请求电压来提交服务请求。从机响应主服务请求，或通过随后将中断线驱动回空闲状态电压来启动从服务请求的主服务，从而给出较慢的从站充足的时间来准备待处理的主发起的数据事务。主机检测中断线电压从请求到空闲状态的变化，并通过数据通信总线与现在已准备好的从器件进行通信。

6. 发明授权

US08942002B2 Three dimensional passive multi-component structures 有权
标题翻译：三维无源多分量结构
公开(公告)号：US08942002B2
公开(公告)日：2015-01-27
申请号：US13595976
申请日：2012-08-27
申请人： Shawn X. Arnold , Douglas P. Kidd , Sean A. Mayo , Scott P. Mullins , Dennis R. Pyper , Jeffrey M. Thoma , Kenyu Tojima
发明人： Shawn X. Arnold , Douglas P. Kidd , Sean A. Mayo , Scott P. Mullins , Dennis R. Pyper , Jeffrey M. Thoma , Kenyu Tojima
IPC分类号： H05K1/18
CPC分类号： G06F1/183 , H01L2224/16227 , H01L2924/19106 , H05K1/0231 , H05K1/141 , H05K1/181 , H05K1/185 , H05K3/403 , H05K2201/10378 , H05K2201/10515 , H05K2201/1053 , H05K2201/10545 , Y02P70/611 , Y10T29/4913
摘要： Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to a thin interposer disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can insulate the components from one another and also couple signals between the components on the first and second layers. In one embodiment, the components in the first and second layers are passive components.
摘要翻译：公开了堆叠的组件阵列。在一个实施例中，第一和第二层部件电气和机械耦合到设置在第一和第二层之间的薄插入件。第一层可以被配置为将堆叠的阵列附接到主机印刷电路板。插入器可以将组件彼此绝缘，并且还可以在第一层和第二层之间的组件之间耦合信号。在一个实施例中，第一和第二层中的部件是无源部件。

7. 发明申请

US20130223041A1 LOW PROFILE, SPACE EFFICIENT CIRCUIT SHIELDS 有权
标题翻译：低剖面，空间有效的电路板
公开(公告)号：US20130223041A1
公开(公告)日：2013-08-29
申请号：US13593075
申请日：2012-08-23
申请人： Shawn X. Arnold , Scott P. Mullins , Jeffrey M. Thoma , Ram Chandhrasekhar
发明人： Shawn X. Arnold , Scott P. Mullins , Jeffrey M. Thoma , Ram Chandhrasekhar
IPC分类号： H05K9/00 , H01R43/00
CPC分类号： H01L23/552 , H01L23/3107 , H01L2223/6677 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2924/19105 , Y10T29/49204
摘要： A low profile, space efficient circuit shield is disclosed. The shield includes top and bottom metal layers disposed on the top of and below an integrated circuit. In one embodiment the shield can include edge plating arranged to encircle the edges of the integrated circuit and couple the top and bottom metal layers together. In another embodiment, the shield can include through vias arranged to encircle the edges of the integrated circuit and couple the top and bottom metal layers together. In yet another embodiment, passive components can be disposed adjacent to the integrated circuit within the shield.
摘要翻译：公开了一种低调，高效率的电路屏蔽。屏蔽包括设置在集成电路顶部和下方的顶部和底部金属层。在一个实施例中，屏蔽件可以包括布置成环绕集成电路的边缘并将顶部和底部金属层耦合在一起的边缘电镀。在另一个实施例中，屏蔽件可以包括布置成环绕集成电路的边缘并将顶部和底部金属层耦合在一起的通孔。在另一个实施例中，无源部件可以被布置成与屏蔽件内的集成电路相邻。

8. 发明授权

US09130571B2 Initializing a capacitive sensing switch for a wireless device 有权
标题翻译：初始化无线设备的电容式感应开关
公开(公告)号：US09130571B2
公开(公告)日：2015-09-08
申请号：US11776467
申请日：2007-07-11
申请人： Jeffrey M. Thoma
发明人： Jeffrey M. Thoma
IPC分类号： H03M11/00 , H03K17/96
CPC分类号： H03K17/9622 , H03K2217/94089
摘要： An apparatus, system, and method that initialize a capacitive sensing switch and detects a pushed button are described. The apparatus comprises a keypad, a logic component, an initialization threshold, a measured capacitive value, and a processor. The keypad comprises at least one capacitive sensing switch. The logic component is configured to determine a capacitive sensing range for each capacitive sensing switch, wherein the range corresponds to the difference between the maximum and minimum capacitance. Each capacitive sensing switch is initialized when the capacitive sensing range exceeds the initialization threshold. The measured capacitive value measures the capacitive value for each switch and a corresponding push-button threshold determines whether the button has been pushed. The processor is configured to process computer instructions that correspond to each switch when the capacitive sensing range exceeds the initialization threshold and when the measured capacitive value for each capacitive sensing switch exceeds the push-button threshold.
摘要翻译：描述初始化电容式感测开关并检测推压按钮的装置，系统和方法。该装置包括小键盘，逻辑组件，初始化阈值，测量的电容值和处理器。键盘包括至少一个电容式感测开关。逻辑部件被配置为确定每个电容感测开关的电容感测范围，其中该范围对应于最大和最小电容之间的差。当电容感测范围超过初始化阈值时，每个电容式感测开关被初始化。测量的电容值测量每个开关的电容值，相应的按钮阈值确定按钮是否被按下。处理器被配置为当电容感测范围超过初始化阈值时以及当每个电容感测开关的测量电容值超过按钮阈值时，处理对应于每个开关的计算机指令。

9. 发明授权

US08029187B2 Apparatus, system and method for high resolution identification with temperature dependent resistive device 有权
标题翻译：用温度依赖电阻器件进行高分辨率识别的装置，系统和方法
公开(公告)号：US08029187B2
公开(公告)日：2011-10-04
申请号：US11677480
申请日：2007-02-21
申请人： John P. Taylor , Jeffrey M. Thoma
发明人： John P. Taylor , Jeffrey M. Thoma
IPC分类号： G01K7/00 , G01K7/16 , G01K1/12
CPC分类号： G01K7/16 , G01K7/20 , G01K7/24
摘要： A temperature measuring and identification (TMID) device obtains identification information and temperature information of a connected device having a temperature sensing circuit (TSC). The TSC includes a temperature sensing element (TSE) connected in parallel with a voltage clamping network (VCN) that limits the voltage across the TSE to an identification voltage within an identification voltage range when the voltage is greater than or equal to a lower voltage of the identification voltage range. When a voltage below the lower range is applied to the TSC, the VCN appears as an open circuit and the resistance of the TSC corresponds to temperature. A translation circuit within the TMID shifts TSC voltages within the identification voltage range to a normalization voltage range. Accordingly, voltages corresponding to temperature as well as voltages corresponding to identification are within the normalization voltage range. As a result, the resolution of a voltage sensing device used for measuring the temperature and identification voltages is maximized. In addition, the translation circuit maintains a minimal current during a rest state. For cost or other concerns, a first TSC may omit the VCN to provide a maximum identification voltage and other TSCs may include VCNs with lower identification voltage ranges.
摘要翻译：温度测量和识别（TMID）装置获得具有温度感测电路（TSC）的连接装置的识别信息和温度信息。 TSC包括与压紧网络（VCN）并联连接的温度感测元件（TSE），该电压钳位网络（VCN）将电压跨越TSE的电压限制在识别电压范围内的识别电压，当电压大于或等于识别电压范围。当低于下限范围的电压施加到TSC时，VCN显示为开路，TSC的电阻对应于温度。 TMID内的平移电路将识别电压范围内的TSC电压移动到归一化电压范围。因此，对应于温度的电压以及对应于识别的电压在归一化电压范围内。结果，用于测量温度和识别电压的电压感测装置的分辨率最大化。另外，平移电路在静止状态期间保持最小的电流。为了成本或其他考虑，第一TSC可以省略VCN以提供最大识别电压，并且其他TSC可以包括具有较低识别电压范围的VCN。

10. 发明授权

US09215807B2 Small form factor stacked electrical passive devices that reduce the distance to the ground plane 有权
标题翻译：小尺寸堆叠式电气无源器件减少距离地平面的距离
公开(公告)号：US09215807B2
公开(公告)日：2015-12-15
申请号：US13626858
申请日：2012-09-25
申请人： Shawn X. Arnold , Jeffrey M. Thoma
发明人： Shawn X. Arnold , Jeffrey M. Thoma
IPC分类号： H05K1/14 , H05K1/02 , H05K1/11 , H05K3/36
CPC分类号： H05K1/141 , H05K1/0231 , H05K1/111 , H05K3/366 , H05K2201/049 , H05K2201/10045 , H05K2201/10636 , Y02P70/611 , Y10T29/49133
摘要： The described embodiments relate generally to electronic components and more specifically to a capacitor array that can increase component density on a printed circuit board and reduce a distance to a ground plane. An array of capacitors can be formed by coupling a group of capacitors on their sides interspersed with interposer boards. The resulting configuration can increase component density and reduce an amount of resistance and effective series inductance between a set of power decoupling capacitors and an integrated circuit.
摘要翻译：所描述的实施例一般涉及电子部件，更具体地涉及可以增加印刷电路板上的部件密度并减小到接地平面的距离的电容器阵列。一组电容器可以通过将一组电容器连接在插入有插入板的侧面上形成。所得到的配置可以增加组件密度并减少一组功率去耦电容器和集成电路之间的电阻和有效串联电感量。

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