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    • 7. 发明申请
    • PREDICTING MICROPROCESSOR LIFETIME RELIABILITY USING ARCHITECTURE-LEVEL STRUCTURE-AWARE TECHNIQUES
    • 使用建筑级结构技术预测微处理器的寿命可靠性
    • US20090013207A1
    • 2009-01-08
    • US12189416
    • 2008-08-11
    • Pradip BoseZhigang HuJude A. RiversJeonghee ShinVictor Zyuban
    • Pradip BoseZhigang HuJude A. RiversJeonghee ShinVictor Zyuban
    • G06F11/00
    • G06F11/008
    • A method of predicting the lifetime reliability of an integrated circuit device with respect to one or more failure mechanisms includes breaking down the integrated circuit device into structures; breaking down each structure into elements and devices; evaluating each device to determine whether the device is vulnerable to the failure mechanisms and eliminating devices determined not to be vulnerable; estimating, for each determined vulnerable device, the impact of a failure of the device on the functionality of the specific element associated therewith, and classifying the failure into a fatal failure or a non-fatal failure, wherein a fatal failure causes the element employing the given device to fail; determining, for those devices whose failures are fatal, an effective stress degree and/or time; determining one or more of a failure rate and a probability of fatal failure for the devices, and aggregating the same across the structures and the failure mechanisms.
    • 一种预测集成电路器件相对于一个或多个故障机制的寿命可靠性的方法包括将集成电路器件分解成结构; 将每个结构分解成元素和设备; 评估每个设备以确定设备是否容易受到故障机制的影响,并消除确定不易受到攻击的设备; 对于每个确定的易受攻击的设备,估计设备故障对与其相关联的特定元件的功能的影响,以及将故障分类为致命故障或非致命故障,其中致命故障导致使用 给定设备失败; 确定对于那些故障致命的设备,有效的应力程度和/或时间; 确定设备的故障率和致命故障的概率中的一个或多个,并且在整个结构和故障机制中聚合它们。
    • 8. 发明授权
    • Method of predicting microprocessor lifetime reliability using architecture-level structure-aware techniques
    • 使用架构级结构感知技术预测微处理器使用寿命可靠性的方法
    • US07472038B2
    • 2008-12-30
    • US11735533
    • 2007-04-16
    • Pradip BoseZhigang HuJude A. RiversJeonghee ShinVictor Zyuban
    • Pradip BoseZhigang HuJude A. RiversJeonghee ShinVictor Zyuban
    • G06F11/30G06F15/00G21C17/00
    • G06F11/008
    • A method of predicting the lifetime reliability of an integrated circuit device with respect to one or more failure mechanisms includes breaking down the integrated circuit device into structures; breaking down each structure into elements and devices; evaluating each device to determine whether the device is vulnerable to the failure mechanisms and eliminating devices determined not to be vulnerable; estimating, for each determined vulnerable device, the impact of a failure of the device on the functionality of the specific element associated therewith, and classifying the failure into a fatal failure or a non-fatal failure, wherein a fatal failure causes the element employing the given device to fail; determining, for those devices whose failures are fatal, an effective stress degree and/or time; determining one or more of a failure rate and a probability of fatal failure for the devices, and aggregating the same across the structures and the failure mechanisms.
    • 一种预测集成电路器件相对于一个或多个故障机制的寿命可靠性的方法包括将集成电路器件分解成结构; 将每个结构分解成元素和设备; 评估每个设备以确定设备是否容易受到故障机制的影响,并消除确定不易受到攻击的设备; 对于每个确定的易受攻击的设备,估计设备故障对与其相关联的特定元件的功能的影响,以及将故障分类为致命故障或非致命故障,其中致命故障导致使用 给定设备失败; 确定对于那些故障致命的设备,有效的应力程度和/或时间; 确定设备的故障率和致命故障的概率中的一个或多个,并且在整个结构和故障机制中聚合它们。
    • 9. 发明申请
    • METHOD AND SYSTEM OF PREDICTING MICROPROCESSOR LIFETIME
    • 预测微生物生物利用度的方法与系统
    • US20080256383A1
    • 2008-10-16
    • US11735533
    • 2007-04-16
    • Pradip BoseZhigang HuJude A. RiversJeonghee ShinVictor Zyuban
    • Pradip BoseZhigang HuJude A. RiversJeonghee ShinVictor Zyuban
    • G06F11/00
    • G06F11/008
    • A method of predicting the lifetime reliability of an integrated circuit device with respect to one or more failure mechanisms includes breaking down the integrated circuit device into structures; breaking down each structure into elements and devices; evaluating each device to determine whether the device is vulnerable to the failure mechanisms and eliminating devices determined not to be vulnerable; estimating, for each determined vulnerable device, the impact of a failure of the device on the functionality of the specific element associated therewith, and classifying the failure into a fatal failure or a non-fatal failure, wherein a fatal failure causes the element employing the given device to fail; determining, for those devices whose failures are fatal, an effective stress degree and/or time; determining one or more of a failure rate and a probability of fatal failure for the devices, and aggregating the same across the structures and the failure mechanisms.
    • 一种预测集成电路器件相对于一个或多个故障机制的寿命可靠性的方法包括将集成电路器件分解成结构; 将每个结构分解成元素和设备; 评估每个设备以确定设备是否容易受到故障机制的影响,并消除确定不易受到攻击的设备; 对于每个确定的易受攻击的设备,估计设备故障对与其相关联的特定元件的功能的影响,以及将故障分类为致命故障或非致命故障,其中致命故障导致使用 给定设备失败; 确定对于那些故障致命的设备,有效的应力程度和/或时间; 确定设备的故障率和致命故障的概率中的一个或多个,并且在整个结构和故障机制中聚合它们。