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1. 发明申请

US20110253411A1 Techniques for Marking Translucent Product Housings 有权
标题翻译：标记半透明产品外壳的技术
公开(公告)号：US20110253411A1
公开(公告)日：2011-10-20
申请号：US12794497
申请日：2010-06-04
申请人： Phillip Wing-Jung Hum , David Pakula
发明人： Phillip Wing-Jung Hum , David Pakula
IPC分类号： H05K5/00 , C23F1/02
CPC分类号： H05K5/0252 , B44C1/228 , H04M1/0283
摘要： Techniques or processes for providing markings on products are disclosed. The markings provided on products can be textual and/or graphic. The techniques or processes can provide high resolution markings on surfaces that are flat or curved. In one embodiment, the products have housings and the markings are to be provided on the housings. For example, the housing for a particular product can include a housing surface and the markings can be provided on the housing surface such that the marking are visible to users of the products. The products can be electronic devices (e.g., portable electronic devices).
摘要翻译：公开了在产品上提供标记的技术或工艺。产品上提供的标记可以是文字和/或图形。这些技术或工艺可以在平坦或弯曲的表面上提供高分辨率的标记。在一个实施例中，产品具有外壳，并且标记将设置在外壳上。例如，用于特定产品的壳体可以包括壳体表面，并且标记可以设置在壳体表面上，使得标记对于产品的使用者是可见的。产品可以是电子设备（例如便携式电子设备）。

2. 发明授权

US08489158B2 Techniques for marking translucent product housings 有权
标题翻译：标记半透明产品外壳的技术
公开(公告)号：US08489158B2
公开(公告)日：2013-07-16
申请号：US12794497
申请日：2010-06-04
申请人： Phillip Wing-Jung Hum , David Pakula
发明人： Phillip Wing-Jung Hum , David Pakula
IPC分类号： H04M1/00
CPC分类号： H05K5/0252 , B44C1/228 , H04M1/0283
摘要： Techniques or processes for providing markings on products are disclosed. The markings provided on products can be textual and/or graphic. The techniques or processes can provide high resolution markings on surfaces that are flat or curved. In one embodiment, the products have housings and the markings are to be provided on the housings. For example, the housing for a particular product can include a housing surface and the markings can be provided on the housing surface such that the marking are visible to users of the products. The products can be electronic devices (e.g., portable electronic devices).
摘要翻译：公开了在产品上提供标记的技术或工艺。产品上提供的标记可以是文字和/或图形。这些技术或工艺可以在平坦或弯曲的表面上提供高分辨率的标记。在一个实施例中，产品具有外壳，并且标记将设置在外壳上。例如，用于特定产品的壳体可以包括壳体表面，并且标记可以设置在壳体表面上，使得标记对于产品的使用者是可见的。产品可以是电子设备（例如便携式电子设备）。

3. 发明授权

US09363905B2 Cosmetic co-removal of material for electronic device surfaces 有权
标题翻译：用于电子设备表面的材料的化妆品去除
公开(公告)号：US09363905B2
公开(公告)日：2016-06-07
申请号：US12794496
申请日：2010-06-04
申请人： Scott Myers , Richard Heley , Matthew Theobald , Adam Stagnaro , Tang Tan , Richard Dinh , David Pakula
发明人： Scott Myers , Richard Heley , Matthew Theobald , Adam Stagnaro , Tang Tan , Richard Dinh , David Pakula
IPC分类号： H05K5/02 , H05K13/00 , G06F1/16 , H05K5/03 , H04M1/02
CPC分类号： G06F1/1656 , G06F1/1626 , G06F1/1658 , G06F1/1684 , G06F1/1698 , H01Q1/2258 , H01Q1/241 , H04M1/0249 , H04M1/026 , H04M1/0274 , H05K5/02 , H05K5/0208 , H05K5/03 , Y10T29/49002 , Y10T29/49169
摘要： This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.
摘要翻译：这旨在通过连接多个元件构建的部件上提供化妆品。可以将单个制造过程（诸如机械加工或研磨）应用于连接的元件以从部分或全部元件中移除材料，并且在部件的各个元件之间的界面之间形成平滑且连续的表面。在某些情况下，材料去除过程的设置可以根据元件的材料进行调整。例如，可以基于每个元件材料的制造或机械性质来调整设置。

4. 发明授权

US09235240B2 Insert molding around glass members for portable electronic devices 有权
标题翻译：在便携式电子设备的玻璃构件周围嵌入成型
公开(公告)号：US09235240B2
公开(公告)日：2016-01-12
申请号：US12944671
申请日：2010-11-11
申请人： David Pakula , Stephen Brian Lynch , Richard Hung Minh Dinh , Tang Yew Tan , Lee Hua Tan
发明人： David Pakula , Stephen Brian Lynch , Richard Hung Minh Dinh , Tang Yew Tan , Lee Hua Tan
IPC分类号： H01L23/28 , G06F1/16 , H04M1/02
CPC分类号： H05K5/03 , A45C11/00 , A45F5/00 , G06F1/1626 , G06F1/1656 , G06F3/041 , H04M1/0249 , H04M1/0266 , H05K5/0017
摘要： An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.
摘要翻译：公开了一种电子设备，其具有由至少一个玻璃盖和邻近玻璃盖周边形成的外围结构形成的外壳。周边结构可以用粘合剂固定在玻璃盖附近。外围结构可以在玻璃盖附近模制，从而在外围结构和玻璃罩周边之间形成无间隙的界面。在一个实施例中，外围结构至少包括内周结构和外周结构。

5. 发明授权

US09232670B2 Protection and assembly of outer glass surfaces of an electronic device housing 有权
标题翻译：保护和组装电子设备外壳的外玻璃表面
公开(公告)号：US09232670B2
公开(公告)日：2016-01-05
申请号：US12794617
申请日：2010-06-04
申请人： David Pakula , Richard Hung Minh Dinh , Tang Yew Tan
发明人： David Pakula , Richard Hung Minh Dinh , Tang Yew Tan
IPC分类号： H05K5/03 , H04M1/02 , G06F1/16
CPC分类号： H05K7/14 , B29L2031/3481 , G02B7/02 , G02B13/001 , G06F1/1626 , G06F1/1637 , G06F1/1656 , G06F1/1658 , H04M1/0202 , H04M1/0266 , H04N5/2252 , H04N5/2254 , H05K5/0086 , H05K5/03 , Y10T29/49002 , Y10T156/10
摘要： Improved housings for electronic devices are disclosed. An electronic device housing can make use of at least one outer member (e.g., cover) that can be aligned, protected and/or secured with respect to other portions of the housing for the electronic device. In one embodiment, an electronic device housing can have one or more outer members (e.g., exposed major surfaces), such as front or back surfaces, that are formed of glass. Protective sides can be provided in some embodiments to protect the edges of the one or more glass surfaces so as to dissipate impact forces and thus reduce damage to the electronic device housing. The one or more glass surfaces can be part of outer member assemblies that can be secured to other portions of the electronic device housing. The electronic device can be portable and in some cases handheld.
摘要翻译：公开了改进的电子设备外壳。电子设备壳体可以利用至少一个外部构件（例如，盖子），该外部构件可相对于用于电子设备的壳体的其它部分对准，保护和/或固定。在一个实施例中，电子设备外壳可以具有由玻璃形成的一个或多个外部构件（例如，暴露的主表面），例如前表面或后表面。在一些实施例中可以提供保护侧以保护一个或多个玻璃表面的边缘，以便消散冲击力，从而减少对电子设备外壳的损坏。一个或多个玻璃表面可以是可以固定到电子设备外壳的其它部分的外部构件组件的一部分。电子设备可以是便携式的，并且在某些情况下是手持的。

6. 发明申请

US20120177358A1 SYSTEMS AND METHODS FOR COUPLING A COVER TO AN ENCLOSURE 有权
标题翻译：用于将盖子连接到外壳的系统和方法
公开(公告)号：US20120177358A1
公开(公告)日：2012-07-12
申请号：US12987920
申请日：2011-01-10
申请人： Mike Wittenberg , David Pakula , Scott Myers
发明人： Mike Wittenberg , David Pakula , Scott Myers
IPC分类号： G03B17/00 , B32B37/02 , H05K5/00
CPC分类号： G03B17/04 , G03B11/00 , G03B11/04 , G03B17/00 , G03B17/02 , G06F1/1656 , H05K13/00 , Y10T156/10
摘要： An electronic device can include different components providing different functionality. Some electronic devices can include a proximity sensor for determining when a user's face is near the device. The sensor can include an emitter and a detector that are separated by a foam block to limit cross-talk between the emitter and detector. A sheet can be placed over the foam block to define openings for each of the emitter and detector. Some electronic devices can also include a camera. A glass cover secured to the device enclosure can protect the camera. To improve an adhesive bond between the glass cover and a metal enclosure, an ink layer can be placed between an adhesive and the glass. In addition, the camera or another component may need to be grounded to ensure proper operation. During assembly, however, the position of the camera can shift due to closing an enclosure. A grounding assembly that maintains contact with the camera in its initial and final positions can be provided.
摘要翻译：电子设备可以包括提供不同功能的不同组件。一些电子设备可以包括用于确定用户的脸部何时在设备附近的接近传感器。该传感器可以包括一个发射器和一个被泡沫块隔开的检测器，以限制发射器和检测器之间的串扰。可以将片材放置在泡沫块上方以为发射器和检测器中的每一个定义开口。一些电子设备也可以包括相机。固定在设备外壳上的玻璃盖可以保护相机。为了改善玻璃盖和金属外壳之间的粘结，油墨层可以放在粘合剂和玻璃之间。此外，相机或其他部件可能需要接地以确保正确的操作。然而，在组装过程中，相机的位置可能由于关闭外壳而移动。可以提供在初始和最终位置保持与相机接触的接地组件。

7. 发明申请

US20110255218A1 SYSTEMS AND METHODS FOR COVER ASSEMBLY RETENTION OF A PORTABLE ELECTRONIC DEVICE 有权
标题翻译：一种便携式电子设备的组装保持系统和方法
公开(公告)号：US20110255218A1
公开(公告)日：2011-10-20
申请号：US12794467
申请日：2010-06-04
申请人： David Pakula , Scott Myers , Tang Tan , Richard Dinh
发明人： David Pakula , Scott Myers , Tang Tan , Richard Dinh
IPC分类号： H05K7/00 , B23P11/00
CPC分类号： H05K5/03 , B65D17/4014 , B65D17/50 , B65D45/16 , B65D51/00 , G06F1/1626 , H04M1/0249 , H04M1/0252 , H04M1/026 , H04M1/0277 , Y10T29/49826
摘要： This is directed to systems and methods for cover assembly retention of a portable electronic device. In some embodiments, a cover assembly and/or housing of an electronic device can include one or more retention features such as detents, hooks, tabs, extensions, screw plates, screw holes, shuttles, latches, or any combination of the above, for retaining the cover assembly to the housing. In some embodiments, one or more retention features can be included on a internal platform of the electronic device to retain the cover assembly. In some embodiments, a hidden screw feature can be included in a SIM tray slot of the electronic device. Once a SIM tray has been inserted into the SIM tray slot, the screw feature can be hidden from sight and may become unapparent to an end user of the electronic device.
摘要翻译：这涉及用于便携式电子设备的盖组件保持的系统和方法。在一些实施例中，电子设备的盖组件和/或壳体可以包括一个或多个保持特征，例如棘爪，钩，突片，延伸部，螺钉板，螺钉孔，梭子，闩锁或上述的任何组合，用于将盖组件保持在壳体上。在一些实施例中，一个或多个保持特征可以包括在电子设备的内部平台上以保持盖组件。在一些实施例中，隐藏的螺钉特征可以包括在电子设备的SIM托盘槽中。一旦将SIM卡插入到SIM卡插槽中，则螺丝功能可能会被隐藏，并可能对电子设备的最终用户变得不可见。

8. 发明申请

US20110186325A1 COSMETIC CO-REMOVAL OF MATERIAL FOR ELECTRONIC DEVICE SURFACES 有权
标题翻译：电子装置表面材料的化学去除
公开(公告)号：US20110186325A1
公开(公告)日：2011-08-04
申请号：US12794496
申请日：2010-06-04
申请人： Scott Myers , Richard Heley , Matthew Theobald , Adam Stagnaro , Tang Tan , Richard Dinh , David Pakula
发明人： Scott Myers , Richard Heley , Matthew Theobald , Adam Stagnaro , Tang Tan , Richard Dinh , David Pakula
IPC分类号： H05K7/00 , H05K13/00
CPC分类号： G06F1/1656 , G06F1/1626 , G06F1/1658 , G06F1/1684 , G06F1/1698 , H01Q1/2258 , H01Q1/241 , H04M1/0249 , H04M1/026 , H04M1/0274 , H05K5/02 , H05K5/0208 , H05K5/03 , Y10T29/49002 , Y10T29/49169
摘要： This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.
摘要翻译：这旨在通过连接多个元件构建的部件上提供化妆品。可以将单个制造过程（诸如机械加工或研磨）应用于连接的元件以从部分或全部元件中移除材料，并且在部件的各个元件之间的界面之间形成平滑且连续的表面。在某些情况下，材料去除过程的设置可以根据元件的材料进行调整。例如，可以基于每个元件材料的制造或机械性质来调整设置。

9. 发明授权

US09185816B2 Portable electronic device housing with outer glass surfaces 有权
标题翻译：带外玻璃表面的便携式电子设备外壳
公开(公告)号：US09185816B2
公开(公告)日：2015-11-10
申请号：US13541617
申请日：2012-07-03
申请人： David Pakula , Richard Hung Minh Dinh , Scott Myers
发明人： David Pakula , Richard Hung Minh Dinh , Scott Myers
IPC分类号： G06F1/16 , H05K5/03 , H04M1/02
CPC分类号： H05K7/14 , B29L2031/3481 , G02B7/02 , G02B13/001 , G06F1/1626 , G06F1/1637 , G06F1/1656 , G06F1/1658 , H04M1/0202 , H04M1/0266 , H04N5/2252 , H04N5/2254 , H05K5/0086 , H05K5/03 , Y10T29/49002 , Y10T156/10
摘要： Improved housings for electronic devices are disclosed. In one embodiment, an electronic device housing can have one or more outer members (e.g., exposed major surfaces), such as front or back surfaces, that are formed of glass. The one or more glass surfaces can be part of outer member assemblies that can be secured to other portions of the electronic device housing. In other embodiments, apparatus, systems and methods for robustly attaching a cover portion of an electronic device to a bottom portion, e.g., a housing portion, of the electronic device are described. The electronic device can be portable and in some cases handheld.
摘要翻译：公开了改进的电子设备外壳。在一个实施例中，电子设备外壳可以具有由玻璃形成的一个或多个外部构件（例如，暴露的主表面），例如前表面或后表面。一个或多个玻璃表面可以是可以固定到电子设备外壳的其它部分的外部构件组件的一部分。在其他实施例中，描述了用于将电子设备的盖部分牢固地附接到电子设备的底部（例如，壳体部分）的装置，系统和方法。电子设备可以是便携式的，并且在某些情况下是手持的。

10. 发明授权

US08663806B2 Techniques for marking a substrate using a physical vapor deposition material 有权
标题翻译：使用物理气相沉积材料标记衬底的技术
公开(公告)号：US08663806B2
公开(公告)日：2014-03-04
申请号：US12868602
申请日：2010-08-25
申请人： Douglas Weber , Christopher Prest , David Pakula , Stephen Paul Zadesky
发明人： Douglas Weber , Christopher Prest , David Pakula , Stephen Paul Zadesky
IPC分类号： H05K7/00 , B05D1/36 , B05D3/02 , B32B17/06 , B32B15/04 , B32B18/00 , B32B15/082
CPC分类号： B32B15/04 , B05D5/06 , B05D5/068 , B05D7/52 , C23C14/024 , C23C14/042 , Y10T428/265 , Y10T428/31645 , Y10T428/31678 , Y10T428/31681 , Y10T428/31692 , Y10T428/31855
摘要： Techniques, processes and structures are disclosed for providing markings on products, such as electronic devices. For example, the markings can be formed using physical vapor deposition (PVD) processes to deposit a layer of material. The markings or labels may be textual and/or graphic. The markings are deposited on a compliant layer that is disposed on a surface to be marked. The compliant layer is arranged to isolate the surface to be marked from the layer of material deposited using the PVD process.
摘要翻译：公开了用于在诸如电子设备的产品上提供标记的技术，工艺和结构。例如，可以使用物理气相沉积（PVD）工艺形成标记以沉积一层材料。标记或标签可以是文字和/或图形。标记沉积在设置在要标记的表面上的柔顺层上。柔性层布置成将待标记的表面与使用PVD工艺沉积的材料层隔离。

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