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1. 发明申请

US20130178092A1 IMPLEMENTING ENHANCED DIMENSIONAL STABILITY WITH GRAPHITE NANOTUBE HYBRID SOCKET 有权
标题翻译：用石墨纳米管混合插座实现增强的尺寸稳定性
公开(公告)号：US20130178092A1
公开(公告)日：2013-07-11
申请号：US13346986
申请日：2012-01-10
申请人： Phillip V. Mann , Kevin M. O'Connell , Mark D. Plucinski , Sandra J. Shirk/Heath , Arvind K. Sinha
发明人： Phillip V. Mann , Kevin M. O'Connell , Mark D. Plucinski , Sandra J. Shirk/Heath , Arvind K. Sinha
IPC分类号： H01R13/40 , B82Y99/00 , B82Y30/00
CPC分类号： H05K7/1069 , B82Y30/00
摘要： A method and structure for implementing enhanced dimensional stability with a graphite nanotube hybrid socket. A socket housing wall includes a plurality of aligned graphite nanofibers. The plurality of aligned graphite nanofibers distributing heat and providing enhanced dimensional stability. For example, the plurality of aligned graphite nanofibers more evenly distributes heat when the socket is undergoing solder reflow processes, thereby reducing strain.
摘要翻译：用石墨纳米管混合插座实现增强的尺寸稳定性的方法和结构。插座壳体壁包括多个对准的石墨纳米纤维。多个对准的石墨纳米纤维分布热量并提供增强的尺寸稳定性。例如，当插座经历焊料回流工艺时，多个对准的石墨纳米纤维更均匀地分布热量，从而减少应变。

2. 发明授权

US08716597B2 Implementing enhanced dimensional stability with graphite nanotube hybrid socket 有权
标题翻译：用石墨纳米管混合插座实现增强的尺寸稳定性
公开(公告)号：US08716597B2
公开(公告)日：2014-05-06
申请号：US13346986
申请日：2012-01-10
申请人： Phillip V. Mann , Kevin M. O'Connell , Mark D. Plucinski , Sandra J. Shirk/Heath , Arvind K. Sinha
发明人： Phillip V. Mann , Kevin M. O'Connell , Mark D. Plucinski , Sandra J. Shirk/Heath , Arvind K. Sinha
IPC分类号： H02G3/08 , H01R13/14 , B82Y40/00
CPC分类号： H05K7/1069 , B82Y30/00
摘要： A method and structure for implementing enhanced dimensional stability with a graphite nanotube hybrid socket. A socket housing wall includes a plurality of aligned graphite nanofibers. The plurality of aligned graphite nanofibers distributing heat and providing enhanced dimensional stability. For example, the plurality of aligned graphite nanofibers more evenly distributes heat when the socket is undergoing solder reflow processes, thereby reducing strain.
摘要翻译：用石墨纳米管混合插座实现增强的尺寸稳定性的方法和结构。插座壳体壁包括多个对准的石墨纳米纤维。多个对准的石墨纳米纤维分布热量并提供增强的尺寸稳定性。例如，当插座经历焊料回流工艺时，多个对准的石墨纳米纤维更均匀地分布热量，从而减少应变。

3. 发明申请

US20130122738A1 PLUG AND RECEPTACLE ARRANGEMENT WITH CONNECTION SENSOR 失效
标题翻译：带连接传感器的插头和插座安装
公开(公告)号：US20130122738A1
公开(公告)日：2013-05-16
申请号：US13297659
申请日：2011-11-16
申请人： Phillip V. Mann , Mark D. Plucinski , Sandra J. Shirk/Heath , Arvind K. Sinha
发明人： Phillip V. Mann , Mark D. Plucinski , Sandra J. Shirk/Heath , Arvind K. Sinha
IPC分类号： H01R3/00
CPC分类号： H01R13/03 , H01R13/7031
摘要： An electrical connector monitoring system for a plug and receptacle assembly, that includes a plug connected to the plug assembly, a recess located within the plug, an electrically insulative layer disposed in the recess, a wear member disposed on the plug that at least partially traverses the insulated recess and in electrical contact with the plug, a contact member movably connected with a receptacle of the receptacle, and a signal device in electrical connection through a circuit with the plug, wear member, and contact member when the plug is fully seated within the receptacle.
摘要翻译：一种用于插头和插座组件的电连接器监视系统，其包括连接到插头组件的插头，位于插头内的凹部，设置在凹部中的电绝缘层，设置在插头上的耐磨构件，该耐磨构件至少部分地穿过所述绝缘凹槽与所述插塞电接触，所述接触构件与所述插座的插座可移动地连接，以及当所述插头完全安置在内部时，通过电路与插头，耐磨构件和接触构件电连接的信号装置容器

4. 发明授权

US08550840B2 Plug and receptacle arrangement with connection sensor 失效
标题翻译：插头和插座安装与连接传感器
公开(公告)号：US08550840B2
公开(公告)日：2013-10-08
申请号：US13297659
申请日：2011-11-16
申请人： Phillip V. Mann , Mark D. Plucinski , Sandra J. Shirk/Heath , Arvind K. Sinha
发明人： Phillip V. Mann , Mark D. Plucinski , Sandra J. Shirk/Heath , Arvind K. Sinha
IPC分类号： H01R3/00
CPC分类号： H01R13/03 , H01R13/7031
摘要： An electrical connector monitoring system for a plug and receptacle assembly, that includes a plug connected to the plug assembly, a recess located within the plug, an electrically insulative layer disposed in the recess, a wear member disposed on the plug that at least partially traverses the insulated recess and in electrical contact with the plug, a contact member movably connected with a receptacle of the receptacle, and a signal device in electrical connection through a circuit with the plug, wear member, and contact member when the plug is fully seated within the receptacle.
摘要翻译：一种用于插头和插座组件的电连接器监视系统，其包括连接到插头组件的插头，位于插头内的凹部，设置在凹部中的电绝缘层，设置在插头上的耐磨构件，该耐磨构件至少部分地穿过所述绝缘凹槽与所述插塞电接触，所述接触构件与所述插座的插座可移动地连接，以及当所述插头完全安置在内部时，通过电路与插头，耐磨构件和接触构件电连接的信号装置容器

5. 发明申请

US20090119902A1 STACKED MULTIPLE ELECTRONIC COMPONENT INTERCONNECT STRUCTURE 失效
标题翻译：堆叠多个电子元件互连结构
公开(公告)号：US20090119902A1
公开(公告)日：2009-05-14
申请号：US12175071
申请日：2008-07-17
申请人： Mark D. Plucinski , Arvind K. Sinha
发明人： Mark D. Plucinski , Arvind K. Sinha
IPC分类号： H01S4/00
CPC分类号： H01R13/22 , Y10T29/49002
摘要： Forming a stacked multiple electronic component interconnect structure includes mounting a first double sided land grid to a first surface of a flexible cable and attaching a second double sided land grid array to a second surface of the flexible cable. A first electronic component is attached to a first surface of the first double sided land grid array and a second electronic component is secured to a second surface of the second double sided land grid array to form a stacked multiple electronic component interconnect structure. The stacked multiple electronic component interconnect structure is attached to a circuit board having an electronic component interface cavity. The second electronic component is mounted in the electronic component interface cavity. Finally, the method includes attaching a force member to apply a compressive force to the stacked multiple electronic component interconnect structure to maintain electrical contact between the first and second electronic components.
摘要翻译：形成堆叠的多个电子部件互连结构包括将第一双面接地栅格安装到柔性电缆的第一表面并将第二双面焊盘栅格阵列附接到柔性电缆的第二表面。第一电子部件附接到第一双面焊盘栅格阵列的第一表面，并且第二电子部件固定到第二双面焊盘栅极阵列的第二表面以形成堆叠的多个电子部件互连结构。堆叠的多个电子部件互连结构附接到具有电子部件接口腔的电路板。第二电子部件安装在电子部件接口腔中。最后，该方法包括附接力构件以向堆叠的多个电子元件互连结构施加压缩力以维持第一和第二电子部件之间的电接触。

6. 发明申请

US20140073234A1 CHASSIS WITH AN AIRFLOW ADJUSTMENT 审中-公开
标题翻译：带有气流调节的底盘
公开(公告)号：US20140073234A1
公开(公告)日：2014-03-13
申请号：US13609563
申请日：2012-09-11
申请人： Bret P. Elison , Phillip V. Mann , Arvind K. Sinha
发明人： Bret P. Elison , Phillip V. Mann , Arvind K. Sinha
IPC分类号： H05K7/20 , H05K5/02
CPC分类号： H05K7/20836 , H05K7/20727
摘要： An apparatus and method is provided for conveying heat away from an electronic component. In one embodiment, an adjustable vane is positioned so that air in a channel is diverted from a first cooling zone to a second cooling zone by the adjustable vane to another part of the chassis using a control mechanism. The apparatus can be controlled in a way that regulates temperature of an electronic component by adjusting airflow within the chassis.
摘要翻译：提供了用于将热量从电子部件传送出去的装置和方法。在一个实施例中，可调整的叶片被定位成使得通过控制机构将通道中的空气从第一冷却区域转移到第二冷却区域，由可调叶片转移到底盘的另一部分。该装置可以通过调节底盘内的气流来控制电子部件的温度。

7. 发明申请

US20130032935A1 IMPLEMENTING ENHANCED THERMAL CONDUCTIVITY IN STACKED MODULES 失效
标题翻译：在堆叠模块中实现增强的热导率
公开(公告)号：US20130032935A1
公开(公告)日：2013-02-07
申请号：US13198895
申请日：2011-08-05
申请人： Kevin M. O'Connell , Arvind K. Sinha , Kory W. Weckman
发明人： Kevin M. O'Connell , Arvind K. Sinha , Kory W. Weckman
IPC分类号： H01L23/04 , H01L21/58
CPC分类号： H01L23/10 , H01L23/36 , H01L25/0657 , H01L2225/06589 , H01L2924/0002 , H01L2924/00
摘要： A method and structures are provided for implementing enhanced thermal conductivity between a lid and heat sink for stacked modules. A chip lid and lateral heat distributor includes cooperating features for implementing enhanced thermal conductivity. The chip lid includes a groove along an inner side wall including a flat wall surface and a curved edge surface. The lateral heat distributor includes a mating edge portion received within the groove. The mating edge portion includes a bent arm for engaging the curved edge surface groove and a flat portion. The lateral heat distributor is assembled into place with the chip lid, the mating edge portion of the lateral heat distributor bends and snaps into the groove of the chip lid. The bent arm portion presses on the curved surface of the groove, and provides an upward force to push the flat portion against the flat wall surface of the groove.
摘要翻译：提供了一种方法和结构，用于在堆叠模块的盖和散热器之间实现增强的导热性。芯片盖和侧向热分布器包括用于实现增强导热性的协同特征。芯片盖包括沿着包括平坦壁表面和弯曲边缘表面的内侧壁的凹槽。横向热分布器包括容纳在槽内的配合边缘部分。配合边缘部分包括用于接合弯曲边缘表面槽的弯曲臂和平坦部分。横向热分布器与芯片盖组装就位，侧向热分布器的配合边缘部分弯曲并卡入芯片盖的凹槽中。弯曲的臂部分压在槽的弯曲表面上，并提供向上的力以将平坦部分推靠在槽的平坦壁表面上。

8. 发明授权

US08779585B2 Implementing enhanced thermal conductivity in stacked modules 失效
标题翻译：在堆叠模块中实现增强的导热性
公开(公告)号：US08779585B2
公开(公告)日：2014-07-15
申请号：US13198895
申请日：2011-08-05
申请人： Kevin M. O'Connell , Arvind K. Sinha , Kory W. Weckman, II
发明人： Kevin M. O'Connell , Arvind K. Sinha , Kory W. Weckman, II
IPC分类号： H01L23/12 , H01L21/44
CPC分类号： H01L23/10 , H01L23/36 , H01L25/0657 , H01L2225/06589 , H01L2924/0002 , H01L2924/00
摘要： A method and structures are provided for implementing enhanced thermal conductivity between a lid and heat sink for stacked modules. A chip lid and lateral heat distributor includes cooperating features for implementing enhanced thermal conductivity. The chip lid includes a groove along an inner side wall including a flat wall surface and a curved edge surface. The lateral heat distributor includes a mating edge portion received within the groove. The mating edge portion includes a bent arm for engaging the curved edge surface groove and a flat portion. The lateral heat distributor is assembled into place with the chip lid, the mating edge portion of the lateral heat distributor bends and snaps into the groove of the chip lid. The bent arm portion presses on the curved surface of the groove, and provides an upward force to push the flat portion against the flat wall surface of the groove.
摘要翻译：提供了一种方法和结构，用于在堆叠模块的盖和散热器之间实现增强的导热性。芯片盖和侧向热分布器包括用于实现增强导热性的协同特征。芯片盖包括沿着包括平坦壁表面和弯曲边缘表面的内侧壁的凹槽。横向热分布器包括容纳在槽内的配合边缘部分。配合边缘部分包括用于接合弯曲边缘表面槽的弯曲臂和平坦部分。横向热分布器与芯片盖组装就位，侧向热分布器的配合边缘部分弯曲并卡入芯片盖的凹槽中。弯曲的臂部分压在槽的弯曲表面上，并提供向上的力以将平坦部分推靠在槽的平坦壁表面上。

9. 发明授权

US08705050B2 Providing thermal compensation for topographic measurement at an elevated temperature using a non-contact vibration transducer 失效
标题翻译：使用非接触式振动传感器，在高温下提供对地形测量的热补偿
公开(公告)号：US08705050B2
公开(公告)日：2014-04-22
申请号：US12898783
申请日：2010-10-06
申请人： Arvind K. Sinha
发明人： Arvind K. Sinha
IPC分类号： G01B11/30
CPC分类号： G01B11/24
摘要： A mechanism for providing thermal compensation when measuring surface topography at an elevated temperature using a non-contact vibration transducer, such as a laser Doppler vibrometer (LDV). Thermal compensation is provided to a detector output signal to correct for thermal diffraction of a reflected portion of a beam of radiant energy directed at a surface of a test object. The thermal compensation is based on a calculated deviation between the detector output signal r2 at an elevated temperature and the detector output signal r1 at approximately room temperature. In one embodiment, the thermal compensation mechanism calculates a stationary signal r3(t) which represents the detector output signal without noise and corrected for thermal diffraction at the elevated temperature according to the following equation: r 3 ⁡ ( t ) = lim T → ∞ ⁢ 1 / T ⁢ ∫ - t / 2 + t / 2 ⁢ r 2 * ⁡ ( t ) * r 2 * ⁡ ( t + Δ ⁢ ⁢ t ) ⁢ ⁢ ⅆ t , wherein T represents the total number of spectrums measured at the elevated temperature at multiple times upon which the compensation is based, and wherein r2*=r2−r2(baseline).
摘要翻译：使用诸如激光多普勒振动计（LDV）的非接触式振动传感器在高温测量表面形貌时提供热补偿的机构。将热补偿提供给检测器输出信号，以校正指向测试对象表面的辐射能束的反射部分的热衍射。热补偿基于在升高的温度下的检测器输出信号r2与大约室温下的检测器输出信号r1之间的计算偏差。在一个实施例中，热补偿机构根据以下等式计算表示无噪声的检测器输出信号的稳定信号r3（t），并根据以下等式对升高的温度下的热衍射进行校正：r 3⁡（t）= lim T→∞ 1 /T∫-t / 2 + t / 2r 2 *⁡（t）* r 2 *⁡（t +＆Dgr;⁢t）⁢ⅆt，其中T表示测量的光谱总数在补偿所基于的多次的高温下，其中r2 * = r2-r2（基线）。

10. 发明授权

US08611090B2 Electronic module with laterally-conducting heat distributor layer 有权
标题翻译：具有横向导热分布层的电子模块
公开(公告)号：US08611090B2
公开(公告)日：2013-12-17
申请号：US12878710
申请日：2010-09-09
申请人： Arvind K. Sinha , Kory W. Weckman
发明人： Arvind K. Sinha , Kory W. Weckman
IPC分类号： H05K7/20
CPC分类号： H05K7/20509 , H01L21/563 , H01L23/36 , H01L23/433 , H01L24/32 , H01L25/0657 , H01L2224/16225 , H01L2224/16245 , H01L2224/32225 , H01L2224/73204 , H01L2225/06513 , H01L2225/06517 , H01L2225/06589 , H01L2924/01029 , H01L2924/14 , H05K3/32 , H05K7/205 , H05K13/00 , Y10T29/49117 , H01L2924/00
摘要： An electronic module is provided in which a chip is disposed over a substrate and electrically connected to the substrate by a plurality of electrical connect structures disposed between the chip and the substrate. A heat distributor, fabricated of a thermally conductive material, is disposed between the chip and the substrate and sized to extend beyond an edge of the chip to facilitate conduction of heat laterally out from between the chip and substrate. The heat distributor includes openings sized and positioned to allow the electrical connect structures to pass through the heat distributor without electrically contacting the heat distributor. The heat distributor is electrically isolated from the electrical connect structures, the chip and the substrate. In one implementation, the heat distributor physically contacts a thermally conductive enclosure of the electronic module to facilitate conduction of heat from between the chip and substrate to the enclosure.
摘要翻译：提供了一种电子模块，其中芯片设置在衬底上并且通过设置在芯片和衬底之间的多个电连接结构电连接到衬底。由导热材料制成的热分布器设置在芯片和基板之间，其尺寸设计成延伸超过芯片的边缘，以便于从芯片和基板之间横向导出热量。热分配器包括尺寸和定位的开口，以允许电连接结构通过热分布器而不与热分布器电接触。热分配器与电连接结构，芯片和基板电隔离。在一个实施方式中，热分配器物理地接触电子模块的导热外壳，以便将热量从芯片和衬底之间传导到外壳。

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