专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07671114B2 Adhesive of substituted oxirane or oxetane compound with silver-based, lead-free solder 有权
标题翻译：取代环氧乙烷或氧杂环丁烷化合物与银基，无铅焊料的粘合剂
公开(公告)号：US07671114B2
公开(公告)日：2010-03-02
申请号：US12176729
申请日：2008-07-21
申请人： John G. Woods , Yuhshi Lu , Bruce C. B. Chan , Philip T. Klemarczyk , Andrew D. Messana
发明人： John G. Woods , Yuhshi Lu , Bruce C. B. Chan , Philip T. Klemarczyk , Andrew D. Messana
IPC分类号： C08K3/08 , C08L63/00 , C08L71/00
CPC分类号： H01L21/563 , C08G59/1455 , C08G59/1494 , C08K5/5435 , C09J163/00 , H01L23/293 , H01L2224/73203 , H01L2924/01004 , H01L2924/01077 , H01L2924/01079
摘要： In accordance with the present invention, it has now been found that glycidyl epoxy resins containing substitution on the epoxide ring can be used with conventional epoxy curing agents and fluxing agents to produce underfill adhesives that are suitable for use with silver-based alloys. Owing to the structural similarity of the new materials to conventional epoxy resins, physical and material properties of the invention formulations are altered little, if at all, relative to products currently in use, and so are highly compatible with existing processes.
摘要翻译：根据本发明，已经发现在环氧化物环上含有取代基的缩水甘油基环氧树脂可以与常规的环氧固化剂和助熔剂一起使用，以生产适用于银基合金的底部填充粘合剂。由于新材料与常规环氧树脂的结构相似性，本发明制剂的物理和材料性能相对于目前使用的产品而言几乎没有改变，因此与现有方法高度兼容。

2. 发明申请

US20090018239A1 UNDERFILL ADHESIVES 有权
标题翻译：不良胶粘剂
公开(公告)号：US20090018239A1
公开(公告)日：2009-01-15
申请号：US12176729
申请日：2008-07-21
申请人： John G. Woods , Yuhshi Luh , Bruce C.B. Chan , Philip T. Klemarczyk , Andrew D. Messana
发明人： John G. Woods , Yuhshi Luh , Bruce C.B. Chan , Philip T. Klemarczyk , Andrew D. Messana
IPC分类号： C08K5/00
CPC分类号： H01L21/563 , C08G59/1455 , C08G59/1494 , C08K5/5435 , C09J163/00 , H01L23/293 , H01L2224/73203 , H01L2924/01004 , H01L2924/01077 , H01L2924/01079
摘要： In accordance with the present invention, it has now been found that glycidyl epoxy resins containing substitution on the epoxide ring can be used with conventional epoxy curing agents and fluxing agents to produce underfill adhesives that are suitable for use with silver-based alloys. Owing to the structural similarity of the new materials to conventional epoxy resins, physical and material properties of the invention formulations are altered little, if at all, relative to products currently in use, and so are highly compatible with existing processes.
摘要翻译：根据本发明，已经发现在环氧化物环上含有取代基的缩水甘油基环氧树脂可以与常规的环氧固化剂和助熔剂一起使用，以生产适用于银基合金的底部填充粘合剂。由于新材料与常规环氧树脂的结构相似性，本发明制剂的物理和材料性能相对于目前使用的产品而言几乎没有改变，因此与现有方法高度兼容。

3. 发明授权

US06572980B1 Reworkable thermosetting resin compositions 失效
标题翻译：可再结合的热固性树脂组合物
公开(公告)号：US06572980B1
公开(公告)日：2003-06-03
申请号：US10113578
申请日：2002-04-02
申请人： Philip T. Klemarczyk , Andrew D. Messana
发明人： Philip T. Klemarczyk , Andrew D. Messana
IPC分类号： H01L2912
CPC分类号： C07D409/12 , C07D303/28 , C07D331/02 , C08G59/245 , C08G59/4215 , C09J163/00 , H01L21/563 , H01L23/293 , H01L24/29 , H01L24/83 , H01L24/98 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83192 , H01L2224/83855 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01018 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01058 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , Y10T428/12528 , H01L2924/00 , H01L2924/3512
摘要： This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.
摘要翻译：本发明涉及可用于安装在诸如CSP，BGAs，LGAs等的电路板半导体器件上的热固性树脂组合物，其中每个半导体器件在载体衬底上具有诸如LSI的半导体芯片。当经受适当条件时，本发明的组合物可重复使用。

4. 发明授权

US08053587B2 Reworkable thermosetting resin composition 失效
标题翻译：可再热固化树脂组合物
公开(公告)号：US08053587B2
公开(公告)日：2011-11-08
申请号：US12004343
申请日：2007-12-20
申请人： Philip T. Klemarczyk , Andrew D. Messana , Afranio Torres-Filho , Erin K. Yeager , Takahisa Doba
发明人： Philip T. Klemarczyk , Andrew D. Messana , Afranio Torres-Filho , Erin K. Yeager , Takahisa Doba
IPC分类号： C07D303/04 , C07D331/02
CPC分类号： C08G59/24 , C07D407/12 , C07D493/08 , C07D493/10 , C08G59/40 , C08K5/0025 , H01L21/563 , H01L23/293 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/01012 , H01L2924/01019 , H01L2924/01077 , H01L2924/00
摘要： This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.
摘要翻译：本发明涉及可用于安装在诸如CSP，BGAs，LGAs等的电路板半导体器件上的热固性树脂组合物，其中每个半导体器件在载体衬底上具有诸如LSI的半导体芯片。当经受适当条件时，本发明的组合物可重复使用。

5. 发明授权

US07411025B1 Cure accelerators for anaerobic curable compositions 有权
标题翻译：用于厌氧可固化组合物的固化促进剂
公开(公告)号：US07411025B1
公开(公告)日：2008-08-12
申请号：US11084118
申请日：2005-03-21
申请人： Andrew D. Messana , Philip T. Klemarczyk , Karen R. Brantl
发明人： Andrew D. Messana , Philip T. Klemarczyk , Karen R. Brantl
IPC分类号： C08F2/00
CPC分类号： C09J11/06 , C08L33/00 , C09D133/06 , C09J133/14
摘要： The present invention relates to phenylgycines and derivatives thereof, 1,4-aminobenzoyl compounds, and phenyl pyrazolinones as cure accelerators for anaerobically curable compositions.
摘要翻译：本发明涉及苯基及其衍生物，1,4-氨基苯甲酰化合物和作为用于厌氧可固化组合物的固化促进剂的苯基吡唑啉酮。

6. 发明授权

US07411009B1 Cure accelerators for anaerobic curable compositions 有权
标题翻译：用于厌氧可固化组合物的固化促进剂
公开(公告)号：US07411009B1
公开(公告)日：2008-08-12
申请号：US11072420
申请日：2005-03-07
申请人： Andrew D. Messana , Philip T. Klemarczyk , Karen R. Brantl
发明人： Andrew D. Messana , Philip T. Klemarczyk , Karen R. Brantl
IPC分类号： C09J4/00
CPC分类号： C09J4/00 , C08F222/1006 , C08F220/10
摘要： The present invention relates to new cure accelerators for anaerobic curable compositions. These anaerobic cure accelerators are generally sulfonimide derivatives and sulfonamide derivatives.
摘要翻译：本发明涉及用于厌氧可固化组合物的新固化促进剂。这些厌氧固化促进剂通常是磺酰亚胺衍生物和磺酰胺衍生物。

7. 发明申请

US20080214840A1 Reworkable thermosetting resin composition 失效
标题翻译：可再热固化树脂组合物
公开(公告)号：US20080214840A1
公开(公告)日：2008-09-04
申请号：US12004343
申请日：2007-12-20
申请人： Philip T. Klemarczyk , Andrew D. Messana , Afranio Torres-Filho , Erin K. Yaeger , Takahisa Doba
发明人： Philip T. Klemarczyk , Andrew D. Messana , Afranio Torres-Filho , Erin K. Yaeger , Takahisa Doba
IPC分类号： C07D303/06 , C07D331/02
CPC分类号： C08G59/24 , C07D407/12 , C07D493/08 , C07D493/10 , C08G59/40 , C08K5/0025 , H01L21/563 , H01L23/293 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/01012 , H01L2924/01019 , H01L2924/01077 , H01L2924/00
摘要： This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.
摘要翻译：本发明涉及可用于安装在诸如CSP，BGAs，LGAs等的电路板半导体器件上的热固性树脂组合物，其中每个半导体器件在载体衬底上具有诸如LSI的半导体芯片。当经受适当条件时，本发明的组合物可重复使用。

8. 发明申请

US20110290418A1 HYDROGEN PEROXIDE COMPLEXES AND THEIR USE IN THE CURE SYSTEM OF ANAEROBIC ADHESIVES 有权
标题翻译：过氧化氢复合物及其在厌氧粘合剂固化体系中的应用
公开(公告)号：US20110290418A1
公开(公告)日：2011-12-01
申请号：US13177921
申请日：2011-07-07
申请人： Philip T. Klemarczyk , David Birkett , David Farrell , Peter Wrobel , Ciaran McArdle , Greg Clarke
发明人： Philip T. Klemarczyk , David Birkett , David Farrell , Peter Wrobel , Ciaran McArdle , Greg Clarke
IPC分类号： B32B37/12 , C07C233/31 , C07C275/02 , C07D207/26 , C09J4/02 , C09K3/00
CPC分类号： C07C275/02 , C07C275/06 , C09J4/00 , C09J5/06
摘要： Provided is a complex of hydrogen peroxide and at least one compound represented by Formula I: wherein X is: —C(R3)3, —C≡C(R3), —O(R3), —N(R3)2, or —S(R3); and R1, R2, and R3 are each independently selected from H, alkyl, alkenyl, alkynyl, aralkyl, aryl, heteroaryl heteroarylalkyl, heterocyclyl, and cycloalkyl, or R2 and an R3 are optionally taken together to form an alicyclic ring. Also provided are anaerobic cure systems and curable compositions employing the complexes described herein.
摘要翻译：提供了过氧化氢和至少一种由式I表示的化合物的络合物：其中X是：-C（R 3）3，-C≡C（R 3），-O（R 3），-N（R 3）2或 -S（R 3）; 并且R 1，R 2和R 3各自独立地选自H，烷基，烯基，炔基，芳烷基，芳基，杂芳基杂芳基烷基，杂环基和环烷基，或者R 2和R 3任选地一起形成脂环族环。还提供了使用本文所述复合物的厌氧固化体系和可固化组合物。

9. 发明授权

US06255500B1 Process for the epoxidation of diene esters 失效
标题翻译：二烯酯环氧化方法
公开(公告)号：US06255500B1
公开(公告)日：2001-07-03
申请号：US09488833
申请日：2000-01-21
申请人： Philip T. Klemarczyk
发明人： Philip T. Klemarczyk
IPC分类号： C07D30114
CPC分类号： C08G59/027 , C07D303/44 , C08G59/24
摘要： Process for the preparation of aliphatic diene ester diepoxides comprising the steps of a) reacting an aliphalic diene ester with a peracid at a temperature at or below 15° C. in the absence of a pH control agent to epoxidize the double bonds of the diene ester; and b) isolating the epoxidized diene ester form the resulting reaction mixture.
摘要翻译：用于制备脂族二烯烃二环氧化物的方法，包括以下步骤：a）在不存在pH控制剂的情况下，在等温或低于15℃的温度下，将脂族二烯烃与过酸反应，以环氧化二烯酯的双键; 和b）从得到的反应混合物中分离环氧化二烯酯。

10. 发明授权

US5585414A Filament winding compositions for fiber/resin composites 失效
标题翻译：纤维/树脂复合材料的丝卷绕组合物
公开(公告)号：US5585414A
公开(公告)日：1996-12-17
申请号：US478893
申请日：1995-06-07
申请人： Philip T. Klemarczyk , Yoshihisa Okamoto , James P. Moran, Jr.
发明人： Philip T. Klemarczyk , Yoshihisa Okamoto , James P. Moran, Jr.
IPC分类号： C08F2/50 , C08F283/10 , C08J3/24 , C08J5/04 , B29C35/10 , C08L63/00
CPC分类号： C08J5/24 , C08F283/10 , C08J3/243 , C08J5/04 , C08J2363/00 , Y10T428/1314 , Y10T428/1321 , Y10T428/1362 , Y10T428/1369 , Y10T428/2936
摘要： Resin compositions useful for filament winding applications comprising an epoxy component including at least one polyepoxide resin curable by heat, an olefinicially unsaturated monomer component including at least one polyolefinically unsaturated monomer curable by actinic radiation, at least one photoinitiator, at least one organic peroxide, and a heat activated curing agent for epoxides. The compositions have a viscosity less than about 2000 centipoise (cps) and are capable of retaining this viscosity for at least about 2 hours at a temperature of from about ambient temperature to about 60.degree. C. The resins are capable of being immobilized by actinic radiation exposure and further heat cured without substantial resin drip. One or more organic peroxides are employed, selected from the group of organic peroxides having 10 hour decomposition half lives at temperatures of from about 50.degree. C. to less than about 104.degree. C. Also, fiber resin composites comprising fiber substrates impregnated with the dual-curing resin compositions. Also the process for coating fiber substrates with the dual-curing resin compositions is disclosed.
摘要翻译：用于长丝缠绕应用的树脂组合物包括包含至少一种可热固化的聚环氧树脂的环氧组分，包含至少一种可通过光化辐射固化的聚烯烃不饱和单体的烯属不饱和单体组分，至少一种光引发剂，至少一种有机过氧化物和用于环氧化物的热活化固化剂。该组合物的粘度小于约2000厘泊（cps），并且能够在约环境温度至约60℃的温度下保持该粘度至少约2小时。树脂能够通过光化辐射固定暴露并进一步加热固化，而没有实质的树脂滴落。使用一种或多种有机过氧化物，选自在约50℃至小于约104℃的温度下具有10分钟分解半衰期的有机过氧化物。此外，包含浸渍有双重的纤维基材的纤维树脂复合材料固化树脂组合物。还公开了用双重固化树脂组合物涂布纤维基材的方法。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式