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1. 发明申请

US20090090927A1 Structure of light emitted diode package 审中-公开
标题翻译：发光二极管封装的结构
公开(公告)号：US20090090927A1
公开(公告)日：2009-04-09
申请号：US12003835
申请日：2008-01-02
申请人： Peter Pan , Abram Chang , Yu-Feng Lin
发明人： Peter Pan , Abram Chang , Yu-Feng Lin
IPC分类号： H01L33/00
CPC分类号： H01L33/54
摘要： A structure of light emitted diode package including a lead frame, a holder coupled on an end of the lead frame, a LED chip disposed on the holder, a lower sealing portion made by injection molding a first resin material to grab one end of lead frame with the LED chip in order to hold the lead frame and an upper sealing portion made by casting by a second resin material to dispose on the top of the lower sealing portion.
摘要翻译：发光二极管封装的结构，包括引线框架，耦合在引线框架的端部上的保持器，设置在保持器上的LED芯片，通过注射成型第一树脂材料以抓住引线框架的一端而制成的下封装部分 LED芯片为了保持引线框架和通过第二树脂材料浇注而制成的上部密封部分以配置在下部密封部分的顶部上。

2. 发明授权

US08013355B2 High power light emitting diode 失效
标题翻译：大功率发光二极管
公开(公告)号：US08013355B2
公开(公告)日：2011-09-06
申请号：US11939552
申请日：2007-11-13
申请人： Chun-Cheng Lin , Abram Chang , Sheng-Jia Sheu , Eddie Huang
发明人： Chun-Cheng Lin , Abram Chang , Sheng-Jia Sheu , Eddie Huang
IPC分类号： H01L33/00 , H01L31/0203 , H01L31/0232
CPC分类号： H05K1/0203 , H01L33/647 , H05K1/18 , H05K2201/10106 , H05K2201/10659
摘要： A high power light emitting diode, The high power light emitting diode comprises a light emitting diode chip, a main module, two first electrode pins, two second electrode pins, and at least one heat dissipation board. The main module has a concave and the light emitting diode chip is positioned in the concave. The first electrode pins are connected to a first side of the main module and also electrically connected to the light emitting diode chip. The second electrode pins are arranged on a second side of the main module that is relative to the first electrode pins wherein the second electrode pins and the first electrode pins are electrically opposite. The second electrode pins are electrically connected to the light emitting diode chip. The heat dissipation board is connected to a part of the main module between the first electrode pin and the second electrode pin.
摘要翻译：大功率发光二极管，大功率发光二极管包括发光二极管芯片，主模块，两个第一电极引脚，两个第二电极引脚和至少一个散热板。主模块具有凹面，发光二极管芯片位于凹面。第一电极引脚连接到主模块的第一侧，并且电连接到发光二极管芯片。第二电极引脚布置在主模块的相对于第一电极引脚的第二侧，其中第二电极引脚和第一电极引脚电气相对。第二电极引脚电连接到发光二极管芯片。散热板与主模块的一部分连接在第一电极销和第二电极销之间。

3. 发明申请

US20090032822A1 HIGH POWER LIGHT EMITTING DIODE 失效
标题翻译：大功率发光二极管
公开(公告)号：US20090032822A1
公开(公告)日：2009-02-05
申请号：US11939552
申请日：2007-11-13
申请人： Chun-Cheng Lin , Abram Chang , Sheng-Jia Sheu , Eddie Huang
发明人： Chun-Cheng Lin , Abram Chang , Sheng-Jia Sheu , Eddie Huang
IPC分类号： H01L33/00
CPC分类号： H05K1/0203 , H01L33/647 , H05K1/18 , H05K2201/10106 , H05K2201/10659
摘要： A high power light emitting diode, The high power light emitting diode comprises a light emitting diode chip, a main module, two first electrode pins, two second electrode pins, and at least one heat dissipation board. The main module has a concave and the light emitting diode chip is positioned in the concave. The first electrode pins are connected to a first side of the main module and also electrically connected to the light emitting diode chip. The second electrode pins are arranged on a second side of the main module that is relative to the first electrode pins wherein the second electrode pins and the first electrode pins are electrically opposite. The second electrode pins are electrically connected to the light emitting diode chip. The heat dissipation board is connected to a part of the main module between the first electrode pin and the second electrode pin.
摘要翻译：大功率发光二极管，大功率发光二极管包括发光二极管芯片，主模块，两个第一电极引脚，两个第二电极引脚和至少一个散热板。主模块具有凹面，发光二极管芯片位于凹面。第一电极引脚连接到主模块的第一侧，并且电连接到发光二极管芯片。第二电极引脚布置在主模块的相对于第一电极引脚的第二侧，其中第二电极引脚和第一电极引脚电气相对。第二电极引脚电连接到发光二极管芯片。散热板与主模块的一部分连接在第一电极销和第二电极销之间。

4. 发明授权

US07893622B2 Circuit apparatus of LED vehicle lamp 有权
标题翻译： LED车灯电路设备
公开(公告)号：US07893622B2
公开(公告)日：2011-02-22
申请号：US12046895
申请日：2008-03-12
申请人： Abram Chang , Shih-Jen Chuang
发明人： Abram Chang , Shih-Jen Chuang
IPC分类号： H05B37/00
CPC分类号： B60Q1/2696 , H05B33/0821 , H05B33/0887 , Y02B20/341
摘要： A circuit apparatus of an LED vehicle lamp is disclosed. The circuit apparatus includes an input unit, an LED unit and a current limiting unit. The LED unit includes at least one light-emitting device. Each light-emitting device includes at least one LED and a protection device. The protection device and each one LED are connected in parallel. The circuit apparatus of an LED vehicle lamp protects the element of the LEDs from being damaged, increases traveling safety and simplifies maintenance.
摘要翻译：公开了一种LED车灯的电路装置。电路装置包括输入单元，LED单元和限流单元。 LED单元包括至少一个发光装置。每个发光装置包括至少一个LED和保护装置。保护装置和每个LED并联连接。 LED车灯的电路装置保护LED的元件免受损坏，提高行驶安全性并简化维护。

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