会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明授权
    • In situ flexible circuit embossing to form an electrical interconnect
    • 原位柔性电路压花以形成电互连
    • US08584331B2
    • 2013-11-19
    • US13232465
    • 2011-09-14
    • Bryan R DolanPeter J Nystrom
    • Bryan R DolanPeter J Nystrom
    • H04R17/10B41J2/045H05K3/30
    • B41J2/14233B41J2/161B41J2/1623
    • A method of forming a structure such as a print head or a printer including the print head having a flex circuit with a plurality of deformed (i.e., contoured, shaped, or embossed) conductive flexible printed circuit (flex circuit) pads. A plurality of flex circuit pads can be aligned with a plurality of piezoelectric elements of an ink jet print head. Within a press such as a stack press, pressure can be applied to deform the plurality of flex circuit pads and to establish electrical contact between the plurality of flex circuit pads and the plurality of piezoelectric elements. Deforming the plurality of flex circuit pads in situ during the press operation can reduce costs by eliminating a separate embossing stage performed during the manufacture or formation of the flex circuit.
    • 一种形成诸如打印头或打印机的结构的方法,其包括具有多个变形(即成型,成形或压花)导电柔性印刷电路(柔性电路)焊盘)的柔性电路的打印头。 多个柔性电路板可以与喷墨打印头的多个压电元件对准。 在诸如叠层压机的压机中,可以施加压力以使多个柔性电路板变形,并且在多个柔性电路板和多个压电元件之间建立电接触。 在压制操作过程中原位地形成多个柔性电路板可以通过消除在制造或形成柔性电路期间执行的单独的压花阶段来降低成本。