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1. 发明申请

US20120039744A1 GOLD-BASED ALLOY, FREE OF SILVER AND TIN, FOR DENTAL COPINGS OR ABUTMENTS 有权
标题翻译：金为基础的合金，不含银和锡，用于牙科复制品或背面
公开(公告)号：US20120039744A1
公开(公告)日：2012-02-16
申请号：US13050657
申请日：2011-03-17
申请人： Peter Hale , Edward F. Smith, III , Arthur S. Klein
发明人： Peter Hale , Edward F. Smith, III , Arthur S. Klein
IPC分类号： C22C5/02
CPC分类号： C22C5/02
摘要： Alloys and dental copings or abutments formed of alloys include 50-60 wt % gold, 5-14 wt % platinum, 0.1-3.0 wt % iridium and the remainder palladium. Other alloys and dental copings or abutments formed of alloys include 58 wt % gold, 10 wt% platinum, 1.0 wt % iridium, and 31 wt % palladium. The alloys are capable of withstanding temperature profiles during casting and multiple high temperature exposures of porcelain firing without excessive softening. The alloys also exhibit advantageous shear strain properties giving the alloys improved manufacturability characteristics.
摘要翻译：由合金形成的合金和牙科接合物或邻接物包括50-60重量％的金，5-14重量％的铂，0.1-3.0重量％的铱，其余的是钯。由合金形成的其它合金和牙科接合物或邻接物包括58重量％的金，10重量％的铂，1.0重量％的铱和31重量％的钯。该合金能够承受铸造过程中的温度曲线以及多次高温曝光的陶瓷烧制而不会过度软化。合金还表现出有利的剪切应变特性，从而使合金提高了可制造性能。

2. 发明授权

US09234262B2 Palladium-based alloys for use in the body and suitable for MRI imaging 有权
标题翻译：用于体内的钯基合金，适用于MRI成像
公开(公告)号：US09234262B2
公开(公告)日：2016-01-12
申请号：US12358629
申请日：2009-01-23
申请人： Arthur S. Klein , Edward F. Smith, III , Peter Hale
发明人： Arthur S. Klein , Edward F. Smith, III , Peter Hale
IPC分类号： C22C5/04 , A61N1/08
CPC分类号： C22C5/04 , A61N1/086
摘要： Ultra-low magnetic susceptibility, biocompatible palladium-tin, palladium-aluminum, and palladium-tantalum alloys include at least 75 at % palladium, between about 3 and 20 at % tin, aluminum, or tantalum, respectively, and one or more other additives chosen from niobium, tungsten, molybdenum, zirconium, titanium, tin for non-palladium-tin alloys, aluminum for non-palladium-aluminum alloys, or tantalum for non-palladium-tantalum alloys, up to about 22 at % total.
摘要翻译：超低磁化率，生物相容性钯 - 锡，钯 - 铝和钯 - 钽合金包括至少75at％的钯，约3至20at％的锡，铝或钽，以及一种或多种其它添加剂选自铌，钨，钼，锆，钛，用于非钯 - 锡合金的锡，用于非钯 - 铝合金的铝，或非钯 - 钽合金的钽，高达约22at％。

3. 发明授权

US08845959B2 Gold-based alloy, free of silver and tin, for dental copings or abutments 有权
标题翻译：金合金，不含银和锡，用于牙科接合或基牙
公开(公告)号：US08845959B2
公开(公告)日：2014-09-30
申请号：US13050657
申请日：2011-03-17
申请人： Peter Hale , Edward F. Smith, III , Arthur S. Klein
发明人： Peter Hale , Edward F. Smith, III , Arthur S. Klein
IPC分类号： C22C5/02 , C22C5/00
CPC分类号： C22C5/02
摘要： Alloys and dental copings or abutments formed of alloys include 50-60 wt % gold, 5-14 wt % platinum, 0.1-3.0 wt % iridium and the remainder palladium. Other alloys and dental copings or abutments formed of alloys include 58 wt % gold, 10 wt % platinum, 1.0 wt % iridium, and 31 wt % palladium. The alloys are capable of withstanding temperature profiles during casting and multiple high temperature exposures of porcelain firing without excessive softening. The alloys also exhibit advantageous shear strain properties giving the alloys improved manufacturability characteristics.
摘要翻译：由合金形成的合金和牙科接合物或邻接物包括50-60重量％的金，5-14重量％的铂，0.1-3.0重量％的铱，其余的是钯。由合金形成的其它合金和牙科接合物或邻接物包括58重量％的金，10重量％的铂，1.0重量％的铱和31重量％的钯。该合金能够承受铸造过程中的温度曲线以及多次高温曝光的陶瓷烧制而不会过度软化。合金还表现出有利的剪切应变特性，从而使合金提高了可制造性能。

4. 发明申请

US20090191087A1 PALLADIUM-BASED ALLOYS FOR USE IN THE BODY AND SUITABLE FOR MRI IMAGING 有权
标题翻译：基于磷酸钙的合金用于身体，适用于MRI成像
公开(公告)号：US20090191087A1
公开(公告)日：2009-07-30
申请号：US12358629
申请日：2009-01-23
申请人： Arthur S. Klein , Edward F. Smith, III , Peter Hale
发明人： Arthur S. Klein , Edward F. Smith, III , Peter Hale
IPC分类号： C22C5/04 , A61N1/04
CPC分类号： C22C5/04 , A61N1/086
摘要： Ultra-low magnetic susceptibility, biocompatible palladium-tin, palladium-aluminum, and palladium-tantalum alloys include at least 75 at % palladium, between about 3 and 20 at % tin, aluminum, or tantalum, respectively, and one or more other additives chosen from niobium, tungsten, molybdenum, zirconium, titanium, tin for non-palladium-tin alloys, aluminum for non-palladium-aluminum alloys, or tantalum for non-palladium-tantalum alloys, up to about 22 at % total.
摘要翻译：超低磁化率，生物相容性钯 - 锡，钯 - 铝和钯 - 钽合金包括至少75at％的钯，约3至20at％的锡，铝或钽，以及一种或多种其它添加剂选自铌，钨，钼，锆，钛，用于非钯 - 锡合金的锡，用于非钯 - 铝合金的铝，或非钯 - 钽合金的钽，高达约22at％。

5. 发明授权

US07354488B2 Palladium alloy 有权
标题翻译：钯合金
公开(公告)号：US07354488B2
公开(公告)日：2008-04-08
申请号：US11125746
申请日：2005-05-10
申请人： Arthur S. Klein , Edward F. Smith, III
发明人： Arthur S. Klein , Edward F. Smith, III
IPC分类号： C22C5/00
CPC分类号： C22C5/04 , A61L31/022 , A61L31/18 , H01H1/023
摘要： A family of alloys for use in medical, electrical contact and jewelry applications includes as primary components palladium, and boron and at least one of ruthenium, rhenium, platinum, gold, zirconium, tungsten, cobalt, nickel, tantalum and iridium. An alternative embodiment includes palladium and rhenium and/or ruthenium with an additional element iridium, platinum, tungsten, boron, gold, zirconium, cobalt, nickel and tantalum. The present alloy family has a high strength, high radio opacity, and biocompatibility characteristics, while also being workable into various configurations. Where required, some of the alloys also offer post form, heat treatment (age hardening) capabilities for even higher hardness and strength levels.
摘要翻译：用于医疗，电接触和珠宝应用的合金族包括作为主要组分的钯和硼以及钌，铼，铂，金，锆，钨，钴，镍，钽和铱中的至少一种。替代实施方案包括具有另外的元素铱，铂，钨，硼，金，锆，钴，镍和钽的钯和铼和/或钌。本发明的合金族具有高强度，高的无线透明度和生物相容性特性，同时也可用于各种配置。如果需要，一些合金还提供后形式，热处理（时效硬化）能力，以获得更高的硬度和强度水平。

6. 发明授权

US5833774A High strength silver palladium alloy 失效
标题翻译：高强度银钯合金
公开(公告)号：US5833774A
公开(公告)日：1998-11-10
申请号：US835665
申请日：1997-04-10
申请人： Arthur S. Klein , Edward F. Smith, III
发明人： Arthur S. Klein , Edward F. Smith, III
IPC分类号： C22C5/06 , C22C5/00 , C22C5/08 , C22C30/02 , H01H1/023 , C22C30/00
CPC分类号： C22C5/00 , C22C30/02 , H01H1/023
摘要： A silver/palladium alloy for electrical contact applications comprises, on a weight percent basis, 20-50 silver, 20-50 palladium, 20-40 copper, less than 1.0 nickel, 0.1-5 zinc, 0.01-0.3 boron, and up to 1 percent by weight of modifying elements selected from the group consisting of rhenium, ruthenium, gold, and platinum. The combination of zinc and boron provides an alloy of high strength and hardness and permits the use of lower amounts of both copper and palladium.
摘要翻译：用于电接触应用的银/钯合金包括以重量计基于20-50银，20-50钯，20-40铜，小于1.0镍，0.1-5锌，0.01-0.3硼，以及至多 1重量％的选自铼，钌，金和铂的改性元素。锌和硼的组合提供了高强度和硬度的合金，并允许使用较少量的铜和钯。

7. 发明申请

US20080279717A1 PALLADIUM ALLOY 审中-公开
标题翻译：铜合金
公开(公告)号：US20080279717A1
公开(公告)日：2008-11-13
申请号：US11930923
申请日：2007-10-31
申请人： Arthur S. Klein , Edward F. Smith, III
发明人： Arthur S. Klein , Edward F. Smith, III
IPC分类号： C22C5/04
CPC分类号： C22C5/04 , A61L31/022 , A61L31/18 , H01H1/023
摘要： A family of alloys for use in medical, electrical contact and jewelry applications includes as primary components palladium, and boron and at least one of ruthenium, rhenium, platinum, gold, zirconium, tungsten, cobalt, nickel, tantalum and iridium. An alternative embodiment includes palladium and rhenium and/or ruthenium with an additional element iridium, platinum, tungsten, boron, gold, zirconium, cobalt, nickel and tantalum. The present alloy family has a high strength, high radio opacity, and biocompatibility characteristics, while also being workable into various configurations. Where required, some of the alloys also offer post form, heat treatment (age hardening) capabilities for even higher hardness and strength levels.
摘要翻译：用于医疗，电接触和珠宝应用的合金族包括作为主要组分的钯和硼以及钌，铼，铂，金，锆，钨，钴，镍，钽和铱中的至少一种。替代实施方案包括具有另外的元素铱，铂，钨，硼，金，锆，钴，镍和钽的钯和铼和/或钌。本发明的合金族具有高强度，高的无线透明度和生物相容性特性，同时也可用于各种配置。如果需要，一些合金还提供后形式，热处理（时效硬化）能力，以获得更高的硬度和强度水平。

8. 发明授权

US5484569A Silver palladium alloy 失效
标题翻译：银钯合金
公开(公告)号：US5484569A
公开(公告)日：1996-01-16
申请号：US289509
申请日：1994-08-12
申请人： Arthur S. Klein , Edward F. Smith, III
发明人： Arthur S. Klein , Edward F. Smith, III
IPC分类号： C22C5/06 , C22C30/02 , H01H1/023 , C22C5/08 , C22C30/00
CPC分类号： C22C30/02 , C22C5/06
摘要： A silver/palladium alloy for electronic applications comprises, on a percent by weight basis, 35-60 silver, 20-44 palladium, 5-20 copper, 1-7 nickel, 0.1-5 zinc, to 0.18 boron, up to 0.05 rhenium and up to 1 percent by weight of modifying elements selected from the group consisting of ruthenium, zirconium and platinum. This alloy exhibits high oxidation and tarnish resistance and is formed into wrought electronic components such as contacts and brushes to provide low noise.
摘要翻译：用于电子应用的银/钯合金包含以重量计35-60银，20-44钯，5-20铜，1-7镍，0.1-5锌，至0.18硼，至多0.05铼和至多1重量％的选自钌，锆和铂的改性元素。该合金表现出高的抗氧化和抗晦暗性，并形成诸如接触和刷子的锻造电子部件以提供低噪声。

9. 发明授权

US06210636B1 Cu-Ni-Zn-Pd alloys 失效
标题翻译： Cu-Ni-Zn-Pd合金
公开(公告)号：US06210636B1
公开(公告)日：2001-04-03
申请号：US09303244
申请日：1999-04-30
申请人： Arthur S. Klein
发明人： Arthur S. Klein
IPC分类号： C22C904
CPC分类号： C22C30/06 , C22C1/03 , C22C9/04 , C22C9/06 , C22C30/02
摘要： A family of copper-nickel-zinc-palladium alloys for sliding and static electrical contact applications comprises, on a weight percent basis, about 15-65 percent copper, up to about 30 percent nickel, about 5-30 percent zinc, about 5-45 percent palladium, and up to about 35 percent silver. One embodiment of the family of alloys is age hardenable and provides alloys with hardness values in excess of 300 Knoop (100g load) and significant improvement in high-temperature properties, formability, tensile strength and ductility. A second embodiment provides an alloy with increased strength and hardness in the wrought condition, relative to the prior art Cu—Ni—Zn alloys.
摘要翻译：用于滑动和静电接触应用的一系列铜 - 镍 - 锌 - 钯 - 钯合金包括以重量计基于约15-65％的铜，高达约30％的镍，约5-30％的锌，约5- 45％的钯，高达约35％的银。合金族的一个实施方案是老化硬化的，并提供硬度值超过300Nooop（100g负载）的合金，并且显着提高高温性能，成形性，拉伸强度和延展性。相对于现有技术的Cu-Ni-Zn合金，第二实施例提供了在锻造条件下具有增加的强度和硬度的合金。

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