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1. 发明授权

US06600201B2 Systems with high density packing of micromachines 失效
标题翻译：具有高机械密度的微机械系统
公开(公告)号：US06600201B2
公开(公告)日：2003-07-29
申请号：US09923000
申请日：2001-08-03
申请人： Peter G. Hartwell , Robert G. Walmsley
发明人： Peter G. Hartwell , Robert G. Walmsley
IPC分类号： H01L2982
CPC分类号： B81B7/04 , B81B2201/038
摘要： Micromachine systems are provided. An embodiment of such a micromachine system includes a substrate that defines a trench. First and second microelectromechanical devices are arranged at least partially within the trench. Each of the microelectromechanical devices incorporates a first portion that is configured to move relative to the substrate. Methods also are provided.
摘要翻译：提供微机系统。这种微机械系统的一个实施例包括限定沟槽的衬底。第一和第二微机电装置至少部分地布置在沟槽内。每个微电子机械装置包括被构造成相对于基板移动的第一部分。还提供了方法。

2. 发明授权

US06953704B2 Systems with high density packing of micromachines 失效
标题翻译：具有高机械密度的微机械系统
公开(公告)号：US06953704B2
公开(公告)日：2005-10-11
申请号：US10446036
申请日：2003-05-27
申请人： Peter G. Hartwell , Robert G Walmsley
发明人： Peter G. Hartwell , Robert G Walmsley
IPC分类号： G11C11/42 , H01L21/00 , H01L21/98
CPC分类号： H01L25/50 , H01L21/67253 , H01L2924/0002 , H01L2924/00
摘要： Micromachine systems are provided. An embodiment of such a micromachine system includes a substrate that defines a trench. First and second microelectromechanical devices are arranged at least partially within the trench. Each of the microelectromechanical devices incorporates a first portion that is configured to move relative to the substrate. Methods also are provided.
摘要翻译：提供微机系统。这种微机械系统的一个实施例包括限定沟槽的衬底。第一和第二微机电装置至少部分地布置在沟槽内。每个微电子机械装置包括被构造成相对于基板移动的第一部分。还提供了方法。

3. 发明授权

US09571008B2 Out-of plane travel restriction structures 有权
标题翻译：飞机外行程限制结构
公开(公告)号：US09571008B2
公开(公告)日：2017-02-14
申请号：US14112091
申请日：2011-06-28
申请人： Donald J. Milligan , Rodney L. Alley , Peter G. Hartwell , Robert G. Walmsley
发明人： Donald J. Milligan , Rodney L. Alley , Peter G. Hartwell , Robert G. Walmsley
IPC分类号： H01L29/84 , H02N1/00 , B81B3/00 , H01H3/60 , B81C1/00 , G01P15/08
CPC分类号： H02N1/00 , B81B3/0051 , B81B3/0054 , B81B2201/0235 , B81B2203/053 , B81C1/00388 , G01P2015/0871 , H01H3/60 , H01L29/84
摘要： The present disclosure includes structures and methods of forming structures for restricting out-of-plane travel. One example of forming such structures includes providing a first wafer 100, 220 comprising a bond layer of a particular thickness 101, 221 on a surface of a substrate material 105, 225, removing the bond layer 101, 221 in a first area 103-1, 103-2, 223 to expose the surface of the substrate material 105, 225, applying a mask to at least a portion of a remaining bond layer 109-1, 109-4, 229-1, 229-3 and a portion of the exposed surface of the substrate material in the first area 109-2, 109-3, 229-2 to form a second area exposed on the surface of the substrate material 105, 225, etching the second area to form a cavity 110, 230 in the substrate material 105, 225 and the bond layer 101, 221, and forming by the etching, in the cavity 110, 230, a structure 113-1, 113-2, 233 for restricting out-of-plane travel, where the structure 113-1, 113-2, 233 has a particular height from a bottom of the cavity 115, 235 determined by the particular thickness of the bond layer 101, 221.
摘要翻译：本公开包括形成用于限制飞机外行进的结构的结构和方法。形成这种结构的一个实例包括提供第一晶片100,220，第一晶片100,220包括在基板材料105,225的表面上的特定厚度的接合层221，在第一区103-122中去除接合层101,221 ，103-2,223，以暴露衬底材料105,225的表面，将掩模施加到剩余结合层109-1,109-4,229-1,229-3的至少一部分，以及一部分在第一区域109-2,103-3,229-2中的衬底材料的暴露表面，以形成暴露在衬底材料105,225的表面上的第二区域，蚀刻第二区域以形成空腔110,230 在衬底材料105,225和接合层101,221中，并且通过蚀刻形成在空腔110,230中的用于限制平面外行进的结构113-1,113-2,233，其中结构113-1,113-2,233具有由空腔115,235的底部由结合层101,221的特定厚度确定的特定高度。

4. 发明授权

US06509620B2 Flexure coupling block for motion sensor 有权
公开(公告)号：US06509620B2
公开(公告)日：2003-01-21
申请号：US09867667
申请日：2001-05-31
申请人： Peter G. Hartwell , Donald J. Fasen
发明人： Peter G. Hartwell , Donald J. Fasen
IPC分类号： H01L2982
CPC分类号： H02N1/006
摘要： A microelectromechanical system (MEMS) device is disclosed for determining the position of a mover. The MEMS device has a bottom layer connected to a mover layer. The mover layer is connected to a mover by flexures. The mover moves relative to the mover layer and the bottom layer. The flexures urge the mover back to an initial position of mechanical equilibrium. The flexures include coupling blocks to control movement of the mover. The MEMS device determines the location of the mover by determining the capacitance between mover electrodes located on the coupling blocks of the flexures and counter electrodes located on an adjacent layer. The coupling block moves according to a determinable relationship with the mover. As the coupling block moves, the capacitance between the mover electrode and the counter electrode changes. A capacitance detector analyzes the capacitance between the electrodes and determines the position of the mover.

5. 发明申请

US20140042869A1 OUT-OF-PLANE TRAVEL RESTRICTION STRUCTURES 有权
标题翻译：超平面旅行限制结构
公开(公告)号：US20140042869A1
公开(公告)日：2014-02-13
申请号：US14112091
申请日：2011-06-28
申请人： Donald J. Milligan , Rodney L. Alley , Peter G. Hartwell , Robet G. Walmsley
发明人： Donald J. Milligan , Rodney L. Alley , Peter G. Hartwell , Robet G. Walmsley
IPC分类号： H02N1/00 , B81C1/00
CPC分类号： H02N1/00 , B81B3/0051 , B81B3/0054 , B81B2201/0235 , B81B2203/053 , B81C1/00388 , G01P2015/0871 , H01H3/60 , H01L29/84
摘要： The present disclosure includes structures and methods of forming structures for restricting out-of-plane travel. One example of forming such structures includes providing a first wafer 100, 220 comprising a bond layer of a particular thickness 101, 221 on a surface of a substrate material 105, 225, removing the bond layer 101, 221 in a first area 103-1, 103-2, 223 to expose the surface of the substrate material 105, 225, applying a mask to at least a portion of a remaining bond layer 109-1, 109-4, 229-1, 229-3 and a portion of the exposed surface of the substrate material in the first area 109-2, 109-3, 229-2 to form a second area exposed on the surface of the substrate material 105, 225, etching the second area to form a cavity 110, 230 in the substrate material 105, 225 and the bond layer 101, 221, and forming by the etching, in the cavity 110, 230, a structure 113-1, 113-2, 233 for restricting out-of-plane travel, where the structure 113-1, 113-2, 233 has a particular height from a bottom of the cavity 115, 235 determined by the particular thickness of the bond layer 101, 221.
摘要翻译：本公开包括形成用于限制飞机外行进的结构的结构和方法。形成这种结构的一个实例包括提供第一晶片100,220，第一晶片100,220包括在衬底材料105,225的表面上的特定厚度101,221的接合层，在第一区域103-1-1中去除接合层101,221 ，103-2,223，以暴露衬底材料105,225的表面，将掩模施加到剩余结合层109-1,109-4,229-1,229-3的至少一部分，以及一部分在第一区域109-2,103-3,229-2中的衬底材料的暴露表面，以形成暴露在衬底材料105,225的表面上的第二区域，蚀刻第二区域以形成空腔110,230 在衬底材料105,225和接合层101,221中，并且通过蚀刻形成在空腔110,230中的用于限制平面外行进的结构113-1,113-2,233，其中结构113-1,113-2,233具有由空腔115,235的底部由结合层101,221的特定厚度确定的特定高度。

6. 发明授权

US08030754B2 Chip cooling channels formed in wafer bonding gap 有权
标题翻译：在晶片接合间隙中形成的芯片冷却通道
公开(公告)号：US08030754B2
公开(公告)日：2011-10-04
申请号：US11701317
申请日：2007-01-31
申请人： Peter G. Hartwell , Duncan Stewart
发明人： Peter G. Hartwell , Duncan Stewart
IPC分类号： H01L23/15 , H01L23/06
CPC分类号： H01L23/473 , H01L25/0657 , H01L25/50 , H01L2225/06513 , H01L2225/06589 , H01L2924/0002 , H01L2924/00
摘要： One embodiment in accordance with the invention is a system that can include a first wafer and a second wafer. The first wafer and the second wafer can be bonded together by a wafer bonding process that forms a gap between the first wafer and the second wafer. The gap can be configured for receiving a heat extracting material.
摘要翻译：根据本发明的一个实施例是可以包括第一晶片和第二晶片的系统。可以通过在第一晶片和第二晶片之间形成间隙的晶片接合工艺将第一晶片和第二晶片接合在一起。间隙可以被配置为接收热提取材料。

7. 发明授权

US06930368B2 MEMS having a three-wafer structure 有权
公开(公告)号：US06930368B2
公开(公告)日：2005-08-16
申请号：US10630769
申请日：2003-07-31
申请人： Peter G. Hartwell , Storrs T. Hoen , David Horsley , Chung Ching Yang , Paul P. Merchant , Carl P. Taussig
发明人： Peter G. Hartwell , Storrs T. Hoen , David Horsley , Chung Ching Yang , Paul P. Merchant , Carl P. Taussig
IPC分类号： G01P15/125 , B81B3/00 , B81B5/00 , B81B7/00 , B81B7/02 , H01L29/82 , H01L33/00
CPC分类号： B81B7/0041 , B81B2201/0235 , B81C2201/019 , B81C2203/019 , G01P2015/082
摘要： A microelectromechanical system includes a first wafer, a second wafer including a moveable portion, and a third wafer. The movable portion is movable between the first wafer and the third wafer. The first wafer, the second wafer, and the third wafer are bonded together.

8. 发明授权

US06784592B2 Use of standoffs to protect atomic resolution storage mover for out-of-plane motion 有权
标题翻译：使用支架来保护原子分辨率存储移动器以进行平面外运动
公开(公告)号：US06784592B2
公开(公告)日：2004-08-31
申请号：US09854599
申请日：2001-05-15
申请人： Peter G. Hartwell
发明人： Peter G. Hartwell
IPC分类号： H02N100
CPC分类号： H02N1/006
摘要： A micro-machined actuator for use in, among other things, sensors and data storage devices. The actuator includes a stator wafer and a micro-mover positioned adjacent to the stator wafer. Between the stator wafer and the micro-mover are electrodes that are set to specified voltages and that emanate electric fields that position the micro-mover relative to the stator wafer. Also between stator wafer and the micro-mover are bumpers that prevent the electrodes from coming into contact with each other.
摘要翻译：一种微加工的致动器，用于传感器和数据存储设备等。致动器包括定子晶片和邻近定子晶片定位的微型移动器。定子晶片和微动子之间的电极是被设定为指定电压的电极，并且发出相对于定子晶片定位微动子的电场。另外，定子晶片和微型动子之间也是防止电极彼此接触的保险杠。

9. 发明授权

US07618752B2 Deformation-based contact lithography systems, apparatus and methods 有权
标题翻译：基于变形的接触光刻系统，设备和方法
公开(公告)号：US07618752B2
公开(公告)日：2009-11-17
申请号：US11548975
申请日：2006-10-12
申请人： Duncan R. Stewart , Robert Walmsley , Peter G. Hartwell , Wei Wu
发明人： Duncan R. Stewart , Robert Walmsley , Peter G. Hartwell , Wei Wu
IPC分类号： G03F1/00
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00 , G03F1/38 , G03F1/50
摘要： One or more of a contact lithography module, a pattern tool and a substrate include a strain control region to prevent deformation-related misalignment.
摘要翻译：接触光刻模块，图案工具和基板中的一个或多个包括用于防止变形相关的未对准的应变控制区域。

10. 发明申请

US20080181558A1 Electronic and optical circuit integration through wafer bonding 审中-公开
标题翻译：电子和光电子集成通过晶片接合
公开(公告)号：US20080181558A1
公开(公告)日：2008-07-31
申请号：US11701314
申请日：2007-01-31
申请人： Peter G. Hartwell , Raymond Beausoleil , R. Stanley Williams , Duncan Stewart
发明人： Peter G. Hartwell , Raymond Beausoleil , R. Stanley Williams , Duncan Stewart
IPC分类号： G02B6/12 , H01L21/30
CPC分类号： G02B6/4201 , G02B6/43 , H01S5/02
摘要： One embodiment in accordance with the invention is an apparatus that can include an optical circuit wafer and an integrated circuit wafer. The optical circuit wafer and the integrated circuit wafer are bonded together by a wafer bonding process.
摘要翻译：根据本发明的一个实施例是可以包括光电路晶片和集成电路晶片的装置。光电晶片和集成电路晶片通过晶片接合工艺结合在一起。

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