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1. 发明申请

US20050001785A1 RFID device and method of forming 有权
标题翻译： RFID设备和成型方法
公开(公告)号：US20050001785A1
公开(公告)日：2005-01-06
申请号：US10871169
申请日：2004-06-18
申请人： Scott Ferguson , David Edwards , Peikang Liu , Jason Munn , Ian Forster , Samuel Linder , Thomas Weakley , David Puleston , Steven Kennedy , Christine Dang
发明人： Scott Ferguson , David Edwards , Peikang Liu , Jason Munn , Ian Forster , Samuel Linder , Thomas Weakley , David Puleston , Steven Kennedy , Christine Dang
IPC分类号： G06K19/077 , H01Q1/22 , H01Q1/38 , H01Q7/00 , H01Q1/36
CPC分类号： G06K19/07752 , G06K19/07745 , G06K19/07749 , G06K19/07756 , H01L2224/16 , H01L2924/01046 , H01L2924/01079 , H01L2924/1461 , H01L2924/3011 , H01Q1/22 , H01Q1/2225 , H01Q1/38 , H01Q7/00 , Y10T29/49124 , H01L2924/00
摘要： A radio frequency identification (RIFD) inlay includes an electrical connection between a chip and an antenna. The electrical connection includes conductive interposer leads and a capacitive connection. The capacitive connection may involve putting the antenna and the interposer leads into close proximity, with dielectric pads therebetween, to allow capacitive coupling between the antenna and the interposer leads. The dielectric pads may include a non-conductive adhesive and a high dielectric material, such as a titanium oxide. The connections provide a convenient, fast, and effective way to operatively couple antennas and interposers.
摘要翻译：射频识别（RIFD）嵌体包括芯片和天线之间的电连接。电气连接包括导电插入引线和电容连接。电容连接可能涉及将天线和插入器引线紧密接合，其间具有介电垫，以允许天线和插入器引线之间的电容耦合。介电垫可以包括非导电粘合剂和高介电材料，例如氧化钛。这些连接提供了方便，快速和有效的方式来操作地耦合天线和插入器。

2. 发明申请

US20070216534A1 RFID DEVICE AND METHOD OF FORMING 有权
标题翻译： RFID设备及其形成方法
公开(公告)号：US20070216534A1
公开(公告)日：2007-09-20
申请号：US11752482
申请日：2007-05-23
申请人： Scott Ferguson , David Edwards , Peikang Liu , Jason Munn , Ian Forster , Samuel Linder , Thomas Weakley , David Puleston , Steven Kennedy , Christine Dang
发明人： Scott Ferguson , David Edwards , Peikang Liu , Jason Munn , Ian Forster , Samuel Linder , Thomas Weakley , David Puleston , Steven Kennedy , Christine Dang
IPC分类号： G08B13/14
CPC分类号： G06K19/07752 , G06K19/07745 , G06K19/07749 , G06K19/07756 , H01L2224/16 , H01L2924/01046 , H01L2924/01079 , H01L2924/1461 , H01L2924/3011 , H01Q1/22 , H01Q1/2225 , H01Q1/38 , H01Q7/00 , Y10T29/49124 , H01L2924/00
摘要： A radio frequency identification (RIFD) inlay includes an electrical connection between a chip and an antenna. The electrical connection includes conductive interposer leads and a capacitive connection. The capacitive connection may involve putting the antenna and the interposer leads into close proximity, with dielectric pads therebetween, to allow capacitive coupling between the antenna and the interposer leads. The dielectric pads may include a non-conductive adhesive and a high dielectric material, such as a titanium oxide. The connections provide a convenient, fast, and effective way to operatively couple antennas and interposers. The RFID inlay may be part of an RFID label or RFID tag.
摘要翻译：射频识别（RIFD）嵌体包括芯片和天线之间的电连接。电气连接包括导电插入引线和电容连接。电容连接可能涉及将天线和插入器引线紧密接合，其间具有介电垫，以允许天线和插入器引线之间的电容耦合。介电垫可以包括非导电粘合剂和高介电材料，例如氧化钛。这些连接提供了方便，快速和有效的方式来操作地耦合天线和插入器。 RFID嵌体可以是RFID标签或RFID标签的一部分。

3. 发明申请

US20050035924A1 RFID device and method of forming 有权
标题翻译： RFID设备和成型方法
公开(公告)号：US20050035924A1
公开(公告)日：2005-02-17
申请号：US10871136
申请日：2004-06-18
申请人： Peikang Liu , Jason Munn , Thomas Weakley , Ian Forster
发明人： Peikang Liu , Jason Munn , Thomas Weakley , Ian Forster
IPC分类号： G06K19/077 , H01Q1/22 , H01Q1/38 , H01Q7/00 , H01Q1/36
CPC分类号： H01Q1/2225 , G06K19/07749 , G06K19/07752 , H01L2924/15153 , H01Q1/22 , H01Q1/38 , H01Q7/00
摘要： A radio frequency identification (RIFD) inlay includes an interposer that has a chip, and an antenna on an antenna substrate. The antenna substrate has a recess or hole, and the chip is at least partially in the recess or hole. By placing the chip or the interposer face down and at least partially in a recess or hole, thickness of the inlay may be reduced.
摘要翻译：射频识别（RIFD）嵌体包括具有芯片的插入器和天线基板上的天线。天线基板具有凹部或孔，并且芯片至少部分地在凹部或孔中。通过将芯片或插入件面朝下放置并且至少部分地放置在凹部或孔中，可以减小嵌体的厚度。

4. 发明申请

US20050282355A1 High density bonding of electrical devices 审中-公开
标题翻译：电气设备的高密度结合
公开(公告)号：US20050282355A1
公开(公告)日：2005-12-22
申请号：US10872235
申请日：2004-06-18
申请人： David Edwards , Jason Munn , Kouroche Kian , Reza Mehrabi , Ian Forster , Thomas Weakley
发明人： David Edwards , Jason Munn , Kouroche Kian , Reza Mehrabi , Ian Forster , Thomas Weakley
IPC分类号： H01L21/30 , H01L21/44 , H01L21/46 , H01L21/48 , H01L21/50 , H01L21/60 , H01L21/603
CPC分类号： H01L24/75 , H01L24/81 , H01L2224/16 , H01L2224/75315 , H01L2224/81801 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/3011 , H01L2924/00
摘要： A method of thermocompressive bonding of one or more electrical devices using individual heating elements and a resilient member to force the individual heating elements into compressive engagement with the electrical devices is provided. The individual heating elements may be Curie-point heating elements or conventional resistive heating elements. A method of thermocompressive bonding of one or more electrical devices using a transparent flexible platen and thermal radiation is also provided. In one embodiment, the thermal radiation is near infra-red thermal radiation and the transparent flexible platen is composed of silicone rubber. The bonding material may be an adhesive or a thermoplastic bonding material. A method of capacitively coupling a semiconductor chip to an electrical component with a pressure sensitive adhesive is also provided. The method includes compressing the chip by forcing a flexible platen of a bonding device into compressive engagement with the semiconductor chip.
摘要翻译：提供了一种使用各个加热元件和一个弹性部件热压接合一个或多个电气装置以迫使各个加热元件与电气装置压缩接合的方法。各个加热元件可以是居里点加热元件或常规电阻加热元件。还提供了使用透明柔性压板和热辐射的一个或多个电气装置的热压接合方法。在一个实施例中，热辐射接近红外热辐射，透明柔性压板由硅橡胶组成。接合材料可以是粘合剂或热塑性粘合材料。还提供了利用压敏粘合剂将半导体芯片电容耦合到电气部件的方法。该方法包括通过迫使粘结装置的柔性压板与半导体芯片压缩接合来压缩芯片。

5. 发明申请

US20060226983A1 RFID device test thresholds systems and methods 有权
标题翻译： RFID设备测试阈值系统和方法
公开(公告)号：US20060226983A1
公开(公告)日：2006-10-12
申请号：US11101352
申请日：2005-04-07
申请人： Ian Forster , Thomas Weakley
发明人： Ian Forster , Thomas Weakley
IPC分类号： G08B13/14
CPC分类号： G06K7/10465 , G01R31/312 , G06K7/0008 , G06K7/0095
摘要： Systems and methods are disclosed herein to provide RFID device test techniques. For example, in accordance with an embodiment of the present invention, a radio frequency identification (RFID) device test system includes an RFID device tester adapted to test RFID devices that are disposed in a closely spaced configuration. The RFID device tester applies a variable threshold, to each of the RFID devices tested, based on characteristics of at least one of the RFID devices neighboring the RFID device being tested.
摘要翻译：本文公开了提供RFID设备测试技术的系统和方法。例如，根据本发明的实施例，射频识别（RFID）设备测试系统包括适于测试以紧密间隔配置布置的RFID设备的RFID设备测试器。 RFID设备测试者基于被测试的RFID设备中的至少一个RFID设备的特性，向被测试的每个RFID设备施加可变阈值。

6. 发明申请

US20060044769A1 RFID device with magnetic coupling 审中-公开
标题翻译：具有磁耦合的RFID设备
公开(公告)号：US20060044769A1
公开(公告)日：2006-03-02
申请号：US10931863
申请日：2004-09-01
申请人： Ian Forster , Thomas Weakley
发明人： Ian Forster , Thomas Weakley
IPC分类号： H05K7/06
CPC分类号： H01Q7/00 , G06K19/07749 , G06K19/07756 , H01Q1/2208
摘要： An RFID device, such as an RFID tag or label, includes a magnetic coupler between an interposer or strap, and an antenna. The interposer or strap includes a transponder chip and an interposer magnetic coupling element that is operatively coupled to the transponder. An antenna portion magnetic coupling element is operatively coupled to the antenna. The magnetic coupling element s together constitute a magnetic coupler that is used to magnetically couple the transponder chip of the interposer to the RFID antenna. A high permeability material may be used to enhance the magnetic coupling between the magnetic coupling elements. The magnetic coupling elements single-turn conductive loops or multiple-turn coils. The magnetic coupler may function as a transformer, with the voltage across the antenna transformed to a different voltage across the transponder chip, and vice versa.
摘要翻译：诸如RFID标签或标签的RFID设备包括插入器或带子之间的磁耦合器和天线。插入器或带包括可转接器芯片和可操作地耦合到应答器的插入器磁耦合元件。天线部分磁耦合元件可操作地耦合到天线。磁耦合元件一起构成磁耦合器，用于将插入器的应答器芯片磁耦合到RFID天线。可以使用高磁导率材料来增强磁耦合元件之间的磁耦合。磁耦合元件单圈导通环或多匝线圈。磁耦合器可以用作变压器，天线两端的电压在转发器芯片上转换成不同的电压，反之亦然。

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