专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5156710A Method of laminating polyimide to thin sheet metal 失效
标题翻译：将聚酰亚胺层压到薄金属板上的方法
公开(公告)号：US5156710A
公开(公告)日：1992-10-20
申请号：US695850
申请日：1991-05-06
申请人： Pei C. Chen , Thomas E. Kindl , Paul G. Rickerl , Mark J. Schadt , John G. Stephanie
发明人： Pei C. Chen , Thomas E. Kindl , Paul G. Rickerl , Mark J. Schadt , John G. Stephanie
IPC分类号： B29C65/64 , B29K79/00 , B29L9/00 , B32B15/08 , B32B15/088 , B32B37/00 , C08G73/10 , C08J5/12 , C08J5/18 , H05K1/03 , H05K1/05
CPC分类号： C08J5/125 , B32B15/08 , C08G73/1039 , C08G73/1057 , C08G73/106 , C08G73/1064 , C08G73/1067 , C08G73/1078 , H05K1/0346 , H05K1/056 , C08J2379/02 , H05K1/036 , H05K2201/0355 , Y10T428/31536 , Y10T428/31681 , Y10T428/31721
摘要： An improved method of laminating a metal foil or sheet to a polyimide material is provided. A solution of a precursor of an intractable (i.e. thermosetting) polyimide is applied to a substrate and the solvent is removed to form a dry tack-free film. Thereafter, a solution of a precursor of a thermoplastic polyimide is applied onto the first film of polyimide and the solvent is removed to form a dry tack-free second film. Both films are then cured concomitantly at a sufficiently rapid rate and low temperature to effect substantial imidization of the polyimide precursors of both films without substantial crosslinking or densification of the polyimides in either of the films. Thereafter, a metal sheet or foil is laminated onto the thermoplastic polyimide film according to the following process. The thermoplastic film is contacted with the sheet or foil of metal to be laminated thereto. A first pressure is applied to the metal sheet and the polyimide substrate composite, which pressure is sufficiently low to permit outgassing of any gases trapped or generated within the polyimides and the temperature is increased. The temperature is raised to a level to essentially complete imidization of the polyimides and also to expel any gases contained or generated by said polyimide films. Thereafter, the pressure is increased to a second level or value and the temperature is controlled to a value which temperature is above the T.sub.g of the thermoplastic film. This second pressure is sufficiently high to complete the lamination of the metal sheet or foil to the thermoplastic polyimide.
摘要翻译：提供了一种将金属箔或片层压到聚酰亚胺材料上的改进方法。将难溶物（即热固性）聚酰亚胺的前体溶液施加到基材上，并除去溶剂以形成无干粘性膜。此后，将热塑性聚酰亚胺的前体溶液施加到第一聚酰亚胺薄膜上，除去溶剂以形成无干粘性的第二薄膜。然后两个膜以足够快的速率和低温同时固化，以实现两种膜的聚酰亚胺前体的显着酰亚胺化，而不影响任何一种膜中聚酰亚胺的交联或致密化。此后，根据以下方法将金属片或箔层压到热塑性聚酰亚胺膜上。将热塑性膜与待层压的金属片或箔片接触。对金属板和聚酰亚胺基板复合体施加第一压力，其压力足够低以允许在聚酰亚胺内捕获或产生的任何气体脱气，并且温度升高。将温度升高到基本上完全聚酰亚胺的酰亚胺化水平，并且还排出由所述聚酰亚胺膜包含或产生的任何气体。此后，将压力提高到第二水平或值，并将温度控制在该温度高于热塑性膜的Tg的值。该第二压力足够高以完成金属片或箔与热塑性聚酰亚胺的层压。

2. 发明授权

US5306741A Method of laminating polyimide to thin sheet metal 失效
标题翻译：将聚酰亚胺层压到薄金属板上的方法
公开(公告)号：US5306741A
公开(公告)日：1994-04-26
申请号：US902951
申请日：1992-06-23
申请人： Pei C. Chen , Thomas E. Kindl , Paul G. Rickerl , Mark J. Schadt , John G. Stephanie
发明人： Pei C. Chen , Thomas E. Kindl , Paul G. Rickerl , Mark J. Schadt , John G. Stephanie
IPC分类号： B29C65/64 , B29K79/00 , B29L9/00 , B32B15/08 , B32B15/088 , B32B37/00 , C08G73/10 , C08J5/12 , C08J5/18 , H05K1/03 , H05K1/05 , C08J3/28 , C08C73/10
CPC分类号： C08J5/125 , B32B15/08 , C08G73/1039 , C08G73/1057 , C08G73/106 , C08G73/1064 , C08G73/1067 , C08G73/1078 , H05K1/0346 , H05K1/056 , C08J2379/02 , H05K1/036 , H05K2201/0355 , Y10T428/31536 , Y10T428/31681 , Y10T428/31721
摘要： An improved method of laminating a metal foil or sheet to a polyimide material is provided. A solution of a precursor of an intractable (i.e. thermosetting) polyimide is applied to a substrate and the solvent is removed to form a dry tack-free film. Thereafter, a solution of a precursor of a thermoplastic polyimide is applied onto the first film of polyimide and the solvent is removed to form a dry tack-free second film. Both films are then cured concomitantly at a sufficiently rapid rate and low temperature to effect substantial imidization of the polyimide precursors of both films without substantial crosslinking or densification of the polyimides in either of the films. Thereafter, a metal sheet or foil is laminated onto the thermoplastic polyimide film according to the following process. The thermoplastic film is contacted with the sheet or foil of metal to be laminated thereto. A first pressure is applied to the metal sheet and the polyimide substrate composite, which pressure is sufficiently low to permit outgassing of any gases trapped or generated within the polyimides and the temperature is increased. The temperature is raised to a level to essentially complete imidization of the polyimides and also to expel any gases contained or generated by said polyimide films. Thereafter, the pressure is increased to a second level or value and the temperature is controlled to a value which temperature is above the T.sub.g of the thermal plastic film. This second pressure is sufficiently high to complete the lamination of the metal sheet or foil to the thermoplastic polyimide.
摘要翻译：提供了一种将金属箔或片层压到聚酰亚胺材料上的改进方法。将难溶物（即热固性）聚酰亚胺的前体溶液施加到基材上，并除去溶剂以形成无干粘性膜。此后，将热塑性聚酰亚胺的前体溶液施加到第一聚酰亚胺薄膜上，除去溶剂以形成无干粘性的第二薄膜。然后两个膜以足够快的速率和低温同时固化，以实现两种膜的聚酰亚胺前体的显着酰亚胺化，而不影响任何一种膜中聚酰亚胺的交联或致密化。此后，根据以下方法将金属片或箔层压到热塑性聚酰亚胺膜上。将热塑性膜与待层压的金属片或箔片接触。对金属板和聚酰亚胺基板复合体施加第一压力，其压力足够低以允许在聚酰亚胺内捕获或产生的任何气体脱气，并且温度升高。将温度升高到基本上完全聚酰亚胺的酰亚胺化水平，并且还排出由所述聚酰亚胺膜包含或产生的任何气体。此后，将压力提高到第二水平或值，并将温度控制在该温度高于热塑性膜的Tg的值。该第二压力足够高以完成金属片或箔与热塑性聚酰亚胺的层压。

3. 依法登记的发明

USH1471H Metal substrate double sided circuit board 失效
标题翻译：金属基板双面电路板
公开(公告)号：USH1471H
公开(公告)日：1995-08-01
申请号：US53933
申请日：1993-04-26
申请人： David J. Braun , Charles J. Guenther , James A. Hagan , Mark K. Hoffmeyer , Steven D. Keidl , Timothy C. Daun-Lindberg , John G. Stephanie , Vincent W. Ting
发明人： David J. Braun , Charles J. Guenther , James A. Hagan , Mark K. Hoffmeyer , Steven D. Keidl , Timothy C. Daun-Lindberg , John G. Stephanie , Vincent W. Ting
IPC分类号： H05K1/03 , H05K1/05 , H05K3/42 , H05K3/44 , H02B1/56 , H05K7/20
CPC分类号： H05K3/445 , H05K1/0373 , H05K1/056 , H05K3/427 , H05K2201/0154 , H05K2201/0209 , H05K2201/09554 , H05K2203/143
摘要： Disclosed is a circuit board and a process for the manufacture thereof providing a circuit board comprising a metal core having parallel first and second major faces and exhibiting high thermal and electrical conductivity. The circuit board includes electrical insulating layers of thermally conductive, dielectric material applied to the first and second major faces of the metal core. Protecting the dielectric layer and copper conductors is a solder mask layer applied to the dielectric layers and forming outward facing major surfaces. A plurality of insulated and grounded vias having electrically conductive interior rings connecting the major surfaces are provided through the board. Conductive sleeves within the vias are either electrically insulated from the metal core by dielectric material or in electrical contact to the metal core for grounding.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式