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1. 发明授权

US06386429B1 Printed circuit board header attachment station 有权
标题翻译：印刷电路板插头连接台
公开(公告)号：US06386429B1
公开(公告)日：2002-05-14
申请号：US09664369
申请日：2000-09-18
申请人： Paymon Sani-Bakhtiari , David Lekx
发明人： Paymon Sani-Bakhtiari , David Lekx
IPC分类号： B23K3102
CPC分类号： H05K3/3421 , B23K1/008 , B23K3/00 , B23K3/04 , B23K2101/40 , B23K2101/42 , H05K3/3415 , H05K3/3447 , H05K3/3494 , H05K2201/1003 , H05K2201/10318 , H05K2201/10424 , H05K2203/0195 , H05K2203/111 , Y02P70/613
摘要： The printed circuit board (PCB) header attachment station mounts a header (PCB) onto a PCB having preexisting solder joints, such as underneath a direct mount IC chip. The apparatus applies a soldering paste to PCB lands configured to receive the pins of the header; nests the header component in stacked alignment with the PCB in order to bring the header pins into contact with the respective PCB lands; heats the PCB to a temperature approaching the reflow temperature of the solder in the pre-existing PCB solder joints; and actuates a compliant heating block or bar to heat the header pins to an extent sufficient for the pins to conduct enough heat to locally reflow the solder on the corresponding PCB lands without reflowing the solder in the pre-existing solder joints. The local reflow of the solder precludes solder reflow in the surrounding pre-existing joints which may coalesce under the direct mount IC chip and render the PCB defective.
摘要翻译：印刷电路板（PCB）接头连接站将标题（PCB）安装到具有预先存在的焊点的PCB上，例如直接安装的IC芯片下方。该设备将焊膏施加到被配置为接收头部的销的PCB焊盘; 将头部组件与PCB堆叠对齐，以使插头插脚与相应的PCB焊盘接触; 将PCB加热到预先存在的PCB焊点中接近焊料回流温度的温度; 并致动符合要求的加热块或棒，以将集管插头加热到足以使引脚传导足够热量的程度，以在相应的PCB焊盘上局部回流焊料，而不回流预先存在的焊点中的焊料。焊料的局部回流排除了可能在直接安装的IC芯片下聚结的周围预先存在的接头中的回流焊，并使PCB有缺陷。

2. 发明授权

US6152353A Printed circuit board header attachment station 失效
标题翻译：印刷电路板插头连接台
公开(公告)号：US6152353A
公开(公告)日：2000-11-28
申请号：US245125
申请日：1999-01-14
申请人： Paymon Sani-Bakhtiari , David Lekx
发明人： Paymon Sani-Bakhtiari , David Lekx
IPC分类号： B23K1/008 , B23K3/00 , B23K3/04 , H05K3/34 , B23K31/02 , B23K31/00
CPC分类号： H05K3/3421 , B23K1/008 , B23K3/00 , B23K3/04 , H05K3/3494 , B23K2201/40 , B23K2201/42 , H05K2201/1003 , H05K2201/10318 , H05K2201/10424 , H05K2203/0195 , H05K2203/111 , H05K3/3415 , H05K3/3447 , Y02P70/613
摘要： The printed circuit board (PCB) header attachment station mounts a header (PCB) onto a PCB having pre-existing solder joints, such as underneath a direct mount IC chip. The apparatus applies a soldering paste to PCB lands configured to receive the pins of the header; nests the header component in stacked alignment with the PCB in order to bring the header pins into contact with the respective PCB lands; heats the PCB to a temperature approaching the reflow temperature of the solder in the pre-existing PCB solder joints; and actuates a compliant heating block or bar to heat the header pins to an extent sufficient for the pins to conduct enough heat to locally reflow the solder on the corresponding PCB lands without reflowing the solder in the pre-existing solder joints. The local reflow of the solder precludes solder reflow in the surrounding pre-existing joints which may coalesce under the direct mount IC chip and render the PCB defective.
摘要翻译：印刷电路板（PCB）接头连接站将标头（PCB）安装到具有预先存在的焊点的PCB上，例如直接安装的IC芯片下方。该设备将焊膏施加到被配置为接收头部的销的PCB焊盘; 将头部组件与PCB堆叠对齐，以使插头插脚与相应的PCB焊盘接触; 将PCB加热到预先存在的PCB焊点中接近焊料回流温度的温度; 并致动符合要求的加热块或棒，以将集管插头加热到足以使引脚传导足够热量的程度，以在相应的PCB焊盘上局部回流焊料，而不回流预先存在的焊点中的焊料。焊料的局部回流排除了可能在直接安装的IC芯片下聚结的周围预先存在的接头中的回流焊，并使PCB有缺陷。

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