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1. 发明授权

US07527721B2 Electrochemical fabrication method for producing multi-layer three-dimensional structures on a porous dielectric 有权
标题翻译：在多孔电介质上制造多层三维结构的电化学制造方法
公开(公告)号：US07527721B2
公开(公告)日：2009-05-05
申请号：US10841378
申请日：2004-05-07
申请人： Pavel B. Lembrikov , Dennis R. Smalley , Adam L. Cohen
发明人： Pavel B. Lembrikov , Dennis R. Smalley , Adam L. Cohen
IPC分类号： C25D5/10
CPC分类号： C25D5/022 , B33Y10/00 , C25D5/10 , C25D5/48
摘要： Multi-layer structures are electrochemically formed on porous dielectric substrates. In some embodiments, the substrates have at least one surface which is infiltrated with a sacrificial conductive material, all pores (e.g. openings in between dielectric regions of the substrate) or selected pores near the surface of the substrate are opened, and a structural material is deposited to fill at least a portion of the opened pores. If more pores are opened than have been filled or will be filled by the structural material a sacrificial material may be deposited to fill the additional pores. After completing formation of an initial patterned surface on the substrate, a plurality of layers are formed on the substrate (e.g. via electrodeposition operations) and after layer formation is complete, the conductive sacrificial material filling the pores is removed.
摘要翻译：多层结构在多孔电介质基片上电化学形成。在一些实施例中，衬底具有至少一个被牺牲导电材料渗透的表面，所有孔（例如衬底的电介质区域之间的开口）或衬底表面附近的选定孔被打开，结构材料是沉积以填充至少一部分打开的孔。如果比已经填充的孔更多的孔被打开，或者将被结构材料填充，则可以沉积牺牲材料以填充附加的孔。在衬底上形成初始图案化表面之后，在衬底上形成多个层（例如通过电沉积操作），并且在层形成完成之后，去除填充孔的导电牺牲材料。

2. 发明申请

US20110187398A1 Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes 审中-公开
标题翻译：用于接触电子元件的悬臂式微孔和制造这种探针的方法
公开(公告)号：US20110187398A1
公开(公告)日：2011-08-04
申请号：US13025511
申请日：2011-02-11
申请人： Richard T. Chen , Ezekiel J. J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
发明人： Richard T. Chen , Ezekiel J. J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
IPC分类号： G01R1/067
CPC分类号： C25D5/02 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/06738 , G01R1/06744 , G01R1/06755 , G01R1/07342 , G01R1/07357 , G01R3/00 , G01R31/2886
摘要： Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.
摘要翻译：本文公开的实施例涉及用于与电子电路等进行临时或永久接触的柔性探针结构。具体地，实施例涉及悬臂式探针结构的各种设计。一些实施例涉及制造这种悬臂结构的方法。在一些实施例中，例如，悬臂探头具有延伸的基部结构，在安装结构中滑动，多光束配置，偏移粘合位置，以允许相邻探针，具有张力构型的柔顺元件，改善的行程，改善的顺应性，改进的擦洗能力和/或类似物。

3. 发明申请

US20120061009A1 Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes 有权
标题翻译：用于接触电子元件的悬臂式微孔和制造这种探针的方法
公开(公告)号：US20120061009A1
公开(公告)日：2012-03-15
申请号：US13273897
申请日：2011-10-14
申请人： Richard T. Chen , Ezekiel J. J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
发明人： Richard T. Chen , Ezekiel J. J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
IPC分类号： B32B38/00
CPC分类号： C25D5/02 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/06738 , G01R1/06744 , G01R1/06755 , G01R1/07342 , G01R1/07357 , G01R3/00 , G01R31/2886
摘要： Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.
摘要翻译：本文公开的实施例涉及用于与电子电路等进行临时或永久接触的柔性探针结构。具体地，实施例涉及悬臂式探针结构的各种设计。一些实施例涉及制造这种悬臂结构的方法。在一些实施例中，例如，悬臂探头具有延伸的基部结构，在安装结构中滑动，多光束配置，偏移粘合位置，以允许相邻探针，具有张力构型的柔顺元件，改善的行程，改善的顺应性，改进的擦洗能力和/或类似物。

4. 发明授权

US07557595B2 Cantilever microprobes for contacting electronic components and methods for making such probes 有权
标题翻译：用于接触电子部件的悬臂微型纺织品和用于制造这种探针的方法
公开(公告)号：US07557595B2
公开(公告)日：2009-07-07
申请号：US11929666
申请日：2007-10-30
申请人： Richard T. Chen , Ezekiel J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
发明人： Richard T. Chen , Ezekiel J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
IPC分类号： G01R31/02
CPC分类号： C25D5/02 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/06738 , G01R1/06744 , G01R1/06755 , G01R1/07342 , G01R1/07357 , G01R3/00 , G01R31/2886
摘要： Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.
摘要翻译：本文公开的实施例涉及用于与电子电路等进行临时或永久接触的柔性探针结构。具体地，实施例涉及悬臂式探针结构的各种设计。一些实施例涉及制造这种悬臂结构的方法。在一些实施例中，例如，悬臂探头具有延伸的基部结构，在安装结构中滑动，多光束配置，偏移粘合位置，以允许相邻探针，具有张力构型的顺应性元件，改善的行程，改进的顺应性，改进的擦洗能力和/或类似物。

5. 发明授权

US07265565B2 Cantilever microprobes for contacting electronic components and methods for making such probes 有权
公开(公告)号：US07265565B2
公开(公告)日：2007-09-04
申请号：US11028960
申请日：2005-01-03
申请人： Richard T. Chen , Ezekiel J. J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
发明人： Richard T. Chen , Ezekiel J. J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
IPC分类号： G01R31/02
CPC分类号： C25D5/02 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/06738 , G01R1/06744 , G01R1/06755 , G01R1/07342 , G01R1/07357 , G01R3/00 , G01R31/2886
摘要： Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

6. 发明申请

US20120064226A1 Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes 有权
公开(公告)号：US20120064226A1
公开(公告)日：2012-03-15
申请号：US13273823
申请日：2011-10-14
申请人： Richard T. Chen , Ezekiel J. J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
发明人： Richard T. Chen , Ezekiel J. J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
IPC分类号： B05D5/00 , C23C14/34 , B05D1/02 , B05D1/18 , C25D5/02 , C23C16/44
CPC分类号： C25D5/02 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/06738 , G01R1/06744 , G01R1/06755 , G01R1/07342 , G01R1/07357 , G01R3/00 , G01R31/2886
摘要： Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

7. 发明申请

US20120062260A1 Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes 有权
公开(公告)号：US20120062260A1
公开(公告)日：2012-03-15
申请号：US13251789
申请日：2011-10-03
申请人： Richard T. Chen , Ezekiel J. J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
发明人： Richard T. Chen , Ezekiel J. J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
IPC分类号： G01R1/073 , G01R1/067
CPC分类号： C25D5/02 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/06738 , G01R1/06744 , G01R1/06755 , G01R1/07342 , G01R1/07357 , G01R3/00 , G01R31/2886
摘要： Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

8. 发明申请

US20100176834A1 Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes 审中-公开
标题翻译：用于接触电子元件的悬臂式微孔和制造这种探针的方法
公开(公告)号：US20100176834A1
公开(公告)日：2010-07-15
申请号：US12724287
申请日：2010-03-15
申请人： Richard T. Chen , Ezekiel J.J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
发明人： Richard T. Chen , Ezekiel J.J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
IPC分类号： G01R1/067 , G01R31/02
CPC分类号： C25D5/02 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/06738 , G01R1/06744 , G01R1/06755 , G01R1/07342 , G01R1/07357 , G01R3/00 , G01R31/2886
摘要： Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.
摘要翻译：本文公开的实施例涉及用于与电子电路等进行临时或永久接触的柔性探针结构。具体地，实施例涉及悬臂式探针结构的各种设计。一些实施例涉及制造这种悬臂结构的方法。在一些实施例中，例如，悬臂探头具有延伸的基部结构，在安装结构中滑动，多光束配置，偏移粘合位置，以允许相邻探针，具有张力构型的柔顺元件，改善的行程，改善的顺应性，改进的擦洗能力和/或类似物。

9. 发明授权

US08717054B2 Methods of creating probe structures from a plurality of planar layers 有权
标题翻译：从多个平面层产生探针结构的方法
公开(公告)号：US08717054B2
公开(公告)日：2014-05-06
申请号：US13273823
申请日：2011-10-14
申请人： Richard T. Chen , Ezekiel J. J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
发明人： Richard T. Chen , Ezekiel J. J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
IPC分类号： G01R31/00
CPC分类号： C25D5/02 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/06738 , G01R1/06744 , G01R1/06755 , G01R1/07342 , G01R1/07357 , G01R3/00 , G01R31/2886
摘要： Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. Some embodiments are directed to various designs of cantilever-like probe structures while other embodiments are directed to methods for fabricating probe structures. In some embodiments, methods of forming probe structures include formation of a plurality of planar multi-material electrodeposited layers wherein each probe structure includes a contact tip and a compliant body, wherein the compliant body is formed from at least one material that is different from the contact tip material and wherein the compliant body provides for elastic compression of the probe in a plane of primary motion during use and wherein during formation of the layers a stacking direction of the plurality of layers is perpendicular to the plane of primary motion.
摘要翻译：本文公开的实施例涉及用于与电子电路等进行临时或永久接触的柔性探针结构。一些实施例涉及悬臂式探针结构的各种设计，而其他实施例涉及用于制造探针结构的方法。在一些实施例中，形成探针结构的方法包括形成多个平面多材料电沉积层，其中每个探针结构包括接触末端和柔顺体，其中柔顺体由至少一种与接触尖端材料，并且其中柔顺体在使用期间在主运动平面中提供探针的弹性压缩，并且其中在层的形成期间，多个层的堆叠方向垂直于主运动平面。

10. 发明申请

US20120064227A1 Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes 有权
公开(公告)号：US20120064227A1
公开(公告)日：2012-03-15
申请号：US13273873
申请日：2011-10-14
申请人： Richard T. Chen , Ezekiel J. J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
发明人： Richard T. Chen , Ezekiel J. J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
IPC分类号： B05D5/00 , C25D1/00 , C23C14/34 , B05D1/02 , B05D1/18 , C23C16/44 , C25D5/02 , C25D7/00
CPC分类号： C25D5/02 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/06738 , G01R1/06744 , G01R1/06755 , G01R1/07342 , G01R1/07357 , G01R3/00 , G01R31/2886
摘要： Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

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