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    • 1. 发明申请
    • Methods for assembling an optical transceiver
    • 组装光收发器的方法
    • US20050018177A1
    • 2005-01-27
    • US10924135
    • 2004-08-23
    • Paul RosenbergGary SasserChris TogamiDonald Ice
    • Paul RosenbergGary SasserChris TogamiDonald Ice
    • G02B6/42G01B11/26
    • G02B6/4292G02B6/42G02B6/4246
    • Methods for assembly of optical transceivers. In one example, the method is performed in connection with an optical transceiver that includes a transmitter optical subassembly and a receiver optical subassembly, as well as structure that defines a pair of ports with which the transmitter optical subassembly and receiver optical subassembly, respectively, are to be aligned. This example of the method involves positioning the transmitter optical subassembly and the receiver optical subassembly in a desired position relative to each other. The transmitter optical subassembly and the receiver optical subassembly are then fixed in the desired position. Next, the transmitter optical subassembly is aligned with one of the ports, and the receiver optical subassembly is aligned with the other port. The alignment of both the transmitter optical subassembly and the receiver optical subassembly with their respective ports is performed in a single operation.
    • 装配光收发器的方法。 在一个示例中,该方法与包括发射机光学子组件和接收机光学子组件的光收发器相关联地执行,以及限定一对端口的结构,发射器光学子组件和接收器光学子组件分别与哪个端口 要对齐 该方法的该示例涉及将发射器光学子组件和接收器光学子组件相对于彼此定位在期望位置。 然后将发射机光学子组件和接收器光学子组件固定在期望的位置。 接下来,发射机光学子组件与其中一个端口对准,并且接收机光学子组件与另一个端口对准。 发射机光学子组件和接收器光学子组件与它们各自的端口的对准在一个操作中执行。
    • 3. 发明申请
    • High density array of optical transceiver modules
    • 高密度阵列的光收发模块
    • US20050286906A1
    • 2005-12-29
    • US11145268
    • 2005-06-02
    • Chris TogamiPaul RosenbergGary Sasser
    • Chris TogamiPaul RosenbergGary Sasser
    • H04B10/00
    • G02B6/4292G02B6/4246G02B6/4277
    • Embodiments of the present invention are directed to high density arrays of optical transceiver modules. A first fabricated package includes a light source and/or light detector, a first surface with at least one opening for transferring optical signals, and a second opposing surface. A second fabricated package has an opening for accepting a component insert and is oriented such that the length of the second fabricated package is essentially perpendicular to the second opposing surface. A lead frame mechanically connects the first fabricated package and the second fabricated package and electrically connects the light source and/or light detector in the first fabricated package to contacts exposed in the opening of the second fabricated package. A component insert is mechanically coupled to the second fabricated package and electrically coupled to the exposed contacts such that components of the component insert can electrically interoperate with the light source and/or light detector.
    • 本发明的实施例涉及光收发器模块的高密度阵列。 第一制造的封装包括光源和/或光检测器,具有用于传送光信号的至少一个开口的第一表面和第二相对表面。 第二制造包装具有用于接纳部件插入件的开口,并且被定向成使得第二制造包装的长度基本上垂直于第二相对表面。 引线框架机械连接第一制造封装和第二制造封装,并将第一制造封装中的光源和/或光检测器电连接到暴露在第二制造封装的开口中的触点。 部件插入件机械地耦合到第二制造的封装并且电耦合到暴露的触点,使得部件插件的部件可以与光源和/或光检测器电互操作。
    • 4. 发明授权
    • High density array of optical transceiver modules
    • 高密度阵列的光收发模块
    • US07455463B2
    • 2008-11-25
    • US11145268
    • 2005-06-02
    • Chris K. TogamiPaul RosenbergGary Sasser
    • Chris K. TogamiPaul RosenbergGary Sasser
    • G02B6/36H04B10/00
    • G02B6/4292G02B6/4246G02B6/4277
    • Embodiments of the present invention are directed to high density arrays of optical transceiver modules. A first fabricated package includes a light source and/or light detector, a first surface with at least one opening for transferring optical signals, and a second opposing surface. A second fabricated package has an opening for accepting a component insert and is oriented such that the length of the second fabricated package is essentially perpendicular to the second opposing surface. A lead frame mechanically connects the first fabricated package and the second fabricated package and electrically connects the light source and/or light detector in the first fabricated package to contacts exposed in the opening of the second fabricated package. A component insert is mechanically coupled to the second fabricated package and electrically coupled to the exposed contacts such that components of the component insert can electrically interoperate with the light source and/or light detector.
    • 本发明的实施例涉及光收发器模块的高密度阵列。 第一制造的封装包括光源和/或光检测器,具有用于传送光信号的至少一个开口的第一表面和第二相对表面。 第二制造包装具有用于接纳部件插入件的开口,并且被定向成使得第二制造包装的长度基本上垂直于第二相对表面。 引线框架机械连接第一制造封装和第二制造封装,并将第一制造封装中的光源和/或光检测器电连接到暴露在第二制造封装的开口中的触点。 部件插入件机械地耦合到第二制造的封装并且电耦合到暴露的触点,使得部件插件的部件可以与光源和/或光检测器电互操作。
    • 6. 发明申请
    • Electro-optical Connector And Methods For Aligning
    • 电光连接器和对准方法
    • US20100027941A1
    • 2010-02-04
    • US12263352
    • 2008-10-31
    • Duncan StewartPaul RosenbergMichael Tan
    • Duncan StewartPaul RosenbergMichael Tan
    • G02B6/38
    • G02B6/3817G02B6/3882G02B6/3886G02B6/4292H01R13/629H01R13/6315
    • An electro-optical connector including a first connector end and a second connector end. The first connector end is coupled to a first electro-optical device. The second connector end coupled to a second electro-optical device. The second connector is flexibly coupled to a connector base so a second connector face can move flexibly with respect to a first connector face. A force mechanism on at least one connector end applies a force on an interface between the first connector end and the second connector end. The force is applied when the first connector face is within a predefined proximity of the second connector face. A mechanical guide on the connector end can align the first connector face with the second connector face when the force mechanism applies the force. The connector end for the force mechanism or the mechanical guide can be the first connector end or the second connector end.
    • 一种电光连接器,包括第一连接器端和第二连接器端。 第一连接器端耦合到第一电光装置。 第二连接器端连接到第二电光装置。 第二连接器柔性地联接到连接器基座,使得第二连接器面可以相对于第一连接器面灵活地移动。 至少一个连接器端部上的力机构在第一连接器端部和第二连接器端部之间的界面上施加力。 当第一连接器面在第二连接器面的预定义接近范围内时施加力。 当力机构施加力时,连接器端上的机械引导件可将第一连接器面与第二连接器面对准。 用于力机构或机械引导件的连接器端可以是第一连接器端或第二连接器端。
    • 9. 发明申请
    • Electrical connector for use in an optical transceiver module
    • 用于光收发模块的电连接器
    • US20050232555A1
    • 2005-10-20
    • US11091686
    • 2005-03-28
    • Paul Rosenberg
    • Paul Rosenberg
    • G02B6/36G02B6/42H01R13/24
    • G02B6/4246G02B6/4201G02B6/428G02B6/4284G02B6/4292H01R12/714H01R12/716H01R13/24
    • A connector for interconnecting electronic components within a device, such as an optical transceiver module, is disclosed. In one embodiment the connector utilizes compressive engagement to electrically connect an optical subassembly to a printed circuit board within the optical transceiver. In one embodiment, the electrical connector includes a body that mechanically mounts on the printed circuit board. The body defines a plurality of slots, each having a first portion of a conductive finger positioned therein. The first portion of each finger is arcuately shaped and extends from the slot. The connector is positioned such that each finger compressively engages and electrically connects with a corresponding contact pad on the optical subassembly when the optical transceiver is assembled. A second portion of each finger extends from a face of the connector body and electrically connects with corresponding contact pads on the printed circuit board, electrically connecting it with the optical subassembly.
    • 公开了一种用于互连设备内的电子部件的连接器,例如光收发器模块。 在一个实施例中,连接器利用压缩接合将光学子组件电连接到光收发器内的印刷电路板。 在一个实施例中,电连接器包括机械地安装在印刷电路板上的主体。 主体限定多个狭槽,每个槽具有定位在其中的导电手指的第一部分。 每个手指的第一部分是弧形的并且从狭槽延伸。 连接器被定位成使得当光收发器组装时,每个指状物与光学子组件上的对应的接触垫片压配合并电连接。 每个手指的第二部分从连接器主体的表面延伸并与印刷电路板上的对应接触焊盘电连接,将其与光学子组件电连接。