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1. 发明授权

US4053977A Method for etching thin foils by electrochemical machining to produce electrical resistance elements 失效
标题翻译：通过电化学加工蚀刻薄箔以产生电阻元件的方法
公开(公告)号：US4053977A
公开(公告)日：1977-10-18
申请号：US679929
申请日：1976-04-26
申请人： Paul Rene Simon , Bernard LeGrives
发明人： Paul Rene Simon , Bernard LeGrives
IPC分类号： H01C17/06 , H01C3/12 , H01C17/00 , H01C17/26 , H05K1/16 , H05K3/20
CPC分类号： H01C17/003 , H01C3/12 , H05K1/167 , H05K3/20 , Y10T29/49082 , Y10T29/49099
摘要： A process for etching a thin film or foil of an electrically conductive resistive material, preferably an alloy predominantly comprising nickel and chromium, by electrolytic etching under conditions of electrochemical machining above Jacquet's plateau on the I.V. characteristic curve. The process is particularly suitable for manufacturing a planar electrical resistor having a high stability, a low temperature coefficient, and a high ohmic value despite the relatively low resistivity of the film or foil. The anode surface polarization is maintained substantially constant over the surface of the foil or film by removing the by-products of the etching process, i.e., gases, viscous layers and other impurities, by mechanical effects such as an electrolytic flow or mechanical vibration, or both together. These mechanical effects are carefully balanced against the applied potential values such that the rate of formation of the layers and gases at the anode is equal to their rate of removal. Moreover, the anode electrical resistance is kept at a negligible value independent of the progress of the attack, by securing the film or foil to a thick layer of a conductor such as copper, whereby the evolution of potential drop across the foil, due to the electrical current flow, is kept at a negligibly small level. Under these conditions, a quasi-uniform etching is obtained all over the foil or film surface. The operating parameters of the process are also described as well as the advantages of the resistor produced according to the process of the invention.
摘要翻译：通过在I.V.上的Jacquet高原上电化学加工的条件下通过电解蚀刻蚀刻导电电阻材料的薄膜或箔，优选主要包含镍和铬的合金的方法。特征曲线。该方法特别适用于制造具有高稳定性，低温度系数和高欧姆值的平面电阻器，尽管膜或箔的电阻率相对较低。通过机械效应（例如电解流动或机械振动）除去蚀刻工艺（即气体，粘性层和其它杂质）的副产物，在箔或膜的表面上保持基本上恒定的阳极表面极化，或两者在一起这些机械效应与施加的电位值进行仔细的平衡，使得阳极处的层和气体的形成速率等于其去除速率。此外，通过将膜或箔固定到诸如铜的导体的厚层，阳极电阻被保持在与攻击进程无关的可忽略的值，由此由于电流流动保持在可忽略的小水平。在这些条件下，在箔或膜表面上获得准均匀蚀刻。还描述了该方法的操作参数以及根据本发明的方法生产的电阻器的优点。

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