会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明授权
    • Wiring system and method therefor
    • 接线系统及方法
    • US06291770B1
    • 2001-09-18
    • US09312567
    • 1999-05-14
    • Paul G. Casperson
    • Paul G. Casperson
    • H02G300
    • H02G3/00B60R16/0207
    • A wiring harness for use in a networked wiring system wherein one or more multiplexed electronic circuits are contained within the wiring harness. Provision of such electronics within the wiring harness reduces the number of wires used in a networked wiring system without requiring their provision within sensor or actuator devices, or in external electronic boxes. Inclusion of such electronics within the wiring harness also eliminates the need for extra interconnections, and provides protection of the electronics from environmental conditions.
    • 一种用于网络布线系统中的线束,其中一个或多个多路复用电子电路包含在线束内。 在线束内提供这样的电子装置减少了在网络布线系统中使用的电线数量,而不需要在传感器或致动器装置内或在外部电子盒中提供。 将这种电子元件包括在线束内也消除了额外互连的需要,并且提供电子器件免受环境条件的保护。
    • 6. 发明授权
    • Electronic assembly for selective heat sinking and two-sided component
attachment
    • 用于选择性散热和双面部件附件的电子组件
    • US5812375A
    • 1998-09-22
    • US643511
    • 1996-05-06
    • Paul G. Casperson
    • Paul G. Casperson
    • H05K1/02H05K1/18H05K3/00H05K7/20
    • H05K7/2049H05K1/0204H05K7/20436H05K7/205H05K1/189H05K2201/09054H05K2201/10166H05K3/4691
    • An electronic assembly includes a flex-rigid circuit board having a flexible polyimide layer disposed on the upper side of a rigid substrate, conductive circuit paths formed within the substrate and on the polyimide layer, and a base for dissipating heat generated by electrical components mounted on the circuit board. The flex-rigid circuit board has a cavity therein extending from a lower electrical insulation layer through the rigid substrate to the upper polyimide layer. A heat-generating electrical component is mounted on the upper layer over the cavity in the circuit board. The base has a boss that protrudes into the cavity and contacts the upper polyimide layer such that heat from the electrical component is conducted through the upper polyimide layer and into the base. Cool electrical components requiring no heat sinking are mounted on the lower insulation layer and/or the upper polyimide layer. Thus, the electronic assembly allows for two-sided attachment of electrical components to the flex-rigid circuit board while providing selective heat sinking for only the heat-generating components.
    • 电子组件包括柔性刚性电路板,其具有设置在刚性基板的上侧上的柔性聚酰亚胺层,形成在基板内和聚酰亚胺层上的导电电路路径,以及用于散发由安装在 电路板。 柔性电路板具有从下电绝缘层穿过刚性基底延伸到上聚酰亚胺层的空腔。 发电电气部件安装在电路板上的空腔上的上层。 底座具有突出到腔中并与上聚酰亚胺层接触的凸起,使得来自电气部件的热量通过上部聚酰亚胺层并进入基底。 不需要散热的冷电器件安装在下绝缘层和/或上聚酰亚胺层上。 因此,电子组件允许将电气部件双向连接到柔性刚性电路板,同时为仅发热部件提供选择性散热。
    • 7. 发明授权
    • Electronic component heat sink attachment using a low force spring
    • 使用低力弹簧的电子部件散热器附件
    • US5321582A
    • 1994-06-14
    • US51661
    • 1993-04-26
    • Paul G. Casperson
    • Paul G. Casperson
    • H01L23/40H05K7/20
    • H05K7/2049H01L2924/0002
    • A thermal attachment assembly for heat generating electronic devices which includes a multi-element spring having low force, high deflection, spring fingers, and which is adjustable and attached by screws to a cover to apply pressure directly against electronic components arranged generally perpendicular to at least one edge of a printed wired board (PWB). The attachment assembly includes a heat sink housing in which the electronic components are pressed against an electrically insulating, thermally conductive film positioned against one wall of the heat sink housing. The PWB is snapped to a carrier and both are placed into the housing so that the electronic devices are positioned within spaces of the carrier. The carrier includes sloping surfaces, so that the spring fingers are deflected downward when the cover is attached to the housing, thereby insuring that the spring fingers are properly positioned onto the electronic devices, between the spaces of the carrier.
    • 一种用于发热电子装置的热连接组件,其包括具有低力,高偏转,弹簧指的多元件弹簧,并且其可调节并通过螺钉附接到盖上,以将压力直接施加到大致垂直于至少布置的电子部件 印刷电路板(PWB)的一个边缘。 附接组件包括散热器壳体,其中电子部件被压靠在抵靠散热器壳体的一个壁上的电绝缘的导热膜上。 PWB被卡扣到载体上,并且都被放置在壳体中,使得电子装置位于载体的空间内。 载体包括倾斜表面,使得当盖附接到壳体时弹簧指向下偏转,从而确保弹簧指适当地定位在载体的空间之间的电子装置上。