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    • 4. 发明授权
    • System and method for using a shared bus for video communications
    • 使用共享总线进行视频通信的系统和方法
    • US07398293B2
    • 2008-07-08
    • US10124400
    • 2002-04-17
    • Scott M. RamseyMichael W. KolbJinsaku Masuyama
    • Scott M. RamseyMichael W. KolbJinsaku Masuyama
    • G06F15/16
    • H04N21/226
    • A system and method for using a shared bus to control a keyboard, video, and mouse (KVM) output is disclosed. The system may include a mid-plane having a video bus. At least one server module, including a video output module, may be placed in communications with the video bus. The video output module may transmit a video signal over the bus and receives a control signal over the bus. A management module may also be placed in communications with the video bus. The management module may receive the video signal from the server module via the bus and provide a control signal through the video bus to each server module. The control signal may activate or deactivate the video output module on each server module.
    • 公开了一种使用共享总线来控制键盘,视频和鼠标(KVM)输出的系统和方法。 该系统可以包括具有视频总线的中间平面。 包括视频输出模块的至少一个服务器模块可以放置在与视频总线通信中。 视频输出模块可以通过总线发送视频信号,并通过总线接收控制信号。 管理模块也可以被放置在与视频总线的通信中。 管理模块可以经由总线从服务器模块接收视频信号,并通过视频总线向每个服务器模块提供控制信号。 控制信号可以激活或去激活每个服务器模块上的视频输出模块。
    • 10. 发明授权
    • Method, system and apparatus for constructing resistive vias
    • 用于构建电阻通孔的方法,系统和装置
    • US06981239B2
    • 2005-12-27
    • US10835157
    • 2004-04-29
    • Jinsaku MasuyamaThad McMillan
    • Jinsaku MasuyamaThad McMillan
    • G06F17/50H01L21/44H05K1/11H05K1/16H05K3/40
    • H05K1/167H05K1/113H05K3/4069H05K2201/0347
    • A system, method and apparatus for constructing capped resistive vias are disclosed. In a preferred embodiment, a bare, electronic component substrate or printed circuit board via is preferably surrounded at each opening by a conductive pad. Defined by openings at a first and second surface of the substrate and a conductive material free wall defining the via is a void filled with one or more resistive inks and/or fills. A conductive cap is preferably coupled to the conductive pads such that an opening therein and the resistive fill exposed at the surface of the substrate is substantially covered. The presence of the conductive cap enables one or more electronic component conductors to be coupled directly to the capped resistive via.
    • 公开了一种用于构建封盖电阻通孔的系统,方法和装置。 在优选实施例中,裸电子部件基板或印刷电路板通孔优选地通过导电焊盘在每个开口处被包围。 由基板的第一和第二表面处的开口限定,并且限定通孔的导电材料游离壁是填充有一个或多个电阻墨水和/或填充物的空隙。 导电盖优选地耦合到导电焊盘,使得其中的开口和暴露在基板的表面处的电阻填充基本被覆盖。 导电盖的存在使得一个或多个电子部件导体能够直接耦合到封盖的电阻通孔。