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    • 8. 发明授权
    • Apparatus and method for direct attachment of heat sink to surface mount
    • 用于将散热片直接连接到表面安装件的装置和方法
    • US06178628B2
    • 2001-01-30
    • US09151927
    • 1998-09-11
    • Donald L. ClemensMark MellingerGary Kuzmin
    • Donald L. ClemensMark MellingerGary Kuzmin
    • H05K334
    • H01L23/3672H01L23/4093H01L2924/0002Y10T29/4913Y10T29/49144H01L2924/00
    • An apparatus and method for thermally coupling a heat sink directly to a surface mount heat generating device package in a manner which provides a more efficient thermal path between the heat sink and the device package, and which allows for a simplified assembly process. The heat sink is mounted in direct thermal communication with the heat generating device package which is surface mounted to a printed circuit board or other substrate. The inventive heat sink has a reservoir of thermal preform which allows the heat sink to be secured to a device package at the same time as the device package is being secured to the surface mount substrate, as opposed to doing so in a separate step in the assembly process after the electronic device packages have already been secured to the surface mount substrate. The inventive heat sink thereby simplifies the assembly process by eliminating steps in the manufacturing process and by allowing for the further automation of the assembly process.
    • 一种用于以散热器和器件封装之间提供更有效的热路径的方式将散热器直接热耦合到表面贴装发热器件封装的装置和方法,并且允许简化的组装过程。 散热器与表面安装到印刷电路板或其它基板上的发热器件封装直接热连接。 本发明的散热器具有热预成型件的储存器,其允许在器件封装被固定到表面安装基板的同时将散热器固定到器件封装,而不是在单独的步骤中 电子设备封装已经固定到表面安装基板之后的组装过程。 本发明的散热器因此通过消除制造过程中的步骤并允许组装过程的进一步自动化来简化组装过程。