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    • 2. 发明申请
    • Substrate having properties of mammalian skin
    • 基质具有哺乳动物皮肤的特性
    • US20080167398A1
    • 2008-07-10
    • US11650919
    • 2007-01-08
    • Pankaj Yadav PatilRichard TweddellSaswati Datta
    • Pankaj Yadav PatilRichard TweddellSaswati Datta
    • A61F2/10A61B5/00A61F2/50B23B3/12C12Q1/02G01N19/02G01N33/44G12B13/00
    • B32B27/40B32B7/02B32B27/08Y10T428/24512Y10T436/10
    • Substrate comprising a discrete first layer comprising a first surface, an opposing second surface and a polymeric first material, wherein the first layer has a thickness of from about 1 micron to about 1000 microns and a hardness of from about 10 to about 80 on the Shore A scale; a discrete second layer comprising a first surface, an opposing second surface, and a second material, wherein the second layer has a hardness of from about 1 to about 70 on the Shore OOO scale and a thickness of from about 0.001 cm to about 2.0 cm; a discrete third layer comprising a first surface and a third material, wherein the third layer has a hardness of from about 0 to about 90 on the Shore D scale; and wherein the second surface of the first layer is in substantially fixed and continuous contact with the first surface of the second layer; the second surface of the second layer is in substantially fixed and continuous contact with the first surface of the third layer; and wherein the ratio of the average thickness of the second layer to the average thickness of the third layer is from about 4:96 to about 25:75.
    • 基底,其包括离散的第一层,其包括第一表面,相对的第二表面和聚合物第一材料,其中第一层的厚度为约1微米至约1000微米,硬度为约10至约80, 规模; 离散的第二层,包括第一表面,相对的第二表面和第二材料,其中所述第二层在肖氏OOO刻度上具有约1至约70的硬度,并且厚度为约0.001cm至约2.0cm ; 离散的第三层,包括第一表面和第三材料,其中所述第三层在肖氏D刻度上具有约0至约90的硬度; 并且其中所述第一层的所述第二表面与所述第二层的所述第一表面基本上固定和连续地接触; 第二层的第二表面与第三层的第一表面基本固定和连续接触; 并且其中所述第二层的平均厚度与所述第三层的平均厚度之比为约4:96至约25:75。
    • 9. 发明授权
    • Laser repair process for printed wiring boards
    • 印刷线路板激光修复工艺
    • US6046429A
    • 2000-04-04
    • US873682
    • 1997-06-12
    • Saswati Datta
    • Saswati Datta
    • B23K26/00H01L21/48H05K3/02H05K3/22
    • H05K3/225B23K26/351H01L21/485H05K3/027
    • A method of repairing wiring shorts on a surface of an organic layer. The organic layer, which is preferably a SLC/ASM layer, may be a surface layer of a Printed Circuit (PC) board. The absorption spectrum of the organic layer is examined. Based on that absorption spectrum, a laser is selected with a wavelength such that the surface layer slightly absorbs, 1-10%, laser energy striking it. Thus, the laser removes metal on the surface, while slightly etching the surface layer and without effect on any metal buried in or beneath the surface layer. Preferably, the laser is an Nd:YAG laser having a wavelength in a range where the ASM layer absorption is between 2-5%, and the copper ablation rate is high.
    • 修复有机层表面上的布线短路的方法。 优选为SLC / ASM层的有机层可以是印刷电路板(PC)的表面层。 检查有机层的吸收光谱。 基于该吸收光谱,选择具有使得表面层稍微吸收1-10%的激光能量的波长的激光。 因此,激光去除表面上的金属,同时轻微蚀刻表面层,而不影响埋在表面层或其下的任何金属。 优选地,激光器是具有波长在ASM层吸收在2-5%之间的波长并且铜烧蚀速率高的Nd:YAG激光器。