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1. 发明授权

US09547190B2 Component mounting apparatus 有权
标题翻译：组件安装设备
公开(公告)号：US09547190B2
公开(公告)日：2017-01-17
申请号：US14471469
申请日：2014-08-28
申请人： Panasonic Corporation
发明人： Yasuhiro Okada , Chihiro Igarashi , Toshihiko Tsujikawa
IPC分类号： B29C65/00 , G02F1/1333
CPC分类号： G02F1/133308
摘要： A component mounting apparatus includes a tape attaching unit, a component mounting unit and a component compression unit provided in this order. A time measuring unit measures time having passed after attachment of the adhesive tape in the tape attaching unit. When a predetermined time has passed after the start of measurement performed by the time measuring unit, the substrate, to which the adhesive tape of a measuring target is attached, is forcibly transferred to the downstream side, and the component is compressed to the substrate in the component compression unit.
摘要翻译：一种部件安装装置，包括按此顺序设置的带安装单元，部件安装单元和部件压缩单元。时间测量单元测量在胶带附着单元中粘贴胶带之后经过的时间。当在时间测量单元执行的测量开始之后经过预定时间时，将安装了测量对象的胶带的基板强制转移到下游侧，并将该部件压缩到基板组件压缩单元。

2. 发明授权

US10058019B2 Bonding apparatus 有权
公开(公告)号：US10058019B2
公开(公告)日：2018-08-21
申请号：US14498002
申请日：2014-09-26
申请人： Panasonic Corporation
发明人： Yasutaka Tsuboi , Akira Yamada , Toshihiko Tsujikawa
IPC分类号： H05K13/08 , H05K13/04
CPC分类号： H05K13/0469 , H05K13/0812
摘要： A bonding apparatus includes: a backup unit including a light-transmissive transmission member having a support surface which supports at least a bonding region of a light-transmissive board from below; a pressure-bonding unit which presses an electronic component placed on the bonding region via a photo-curable adhesive agent; and a light irradiation unit which irradiates the supporting surface with light which promotes hardening of the adhesive agent. The electronic component is bonded to the board by pressing the electronic component mounted on a top surface of the adhesive agent in a state in which light from the light irradiation unit is incident upon the adhesive agent through the supporting surface. The bonding apparatus further includes a light distribution measuring unit which measures a distribution of light from the light irradiation portion in the supporting surface.

3. 发明申请

US20150096687A1 BONDING APPARATUS 审中-公开
标题翻译：绑定装置
公开(公告)号：US20150096687A1
公开(公告)日：2015-04-09
申请号：US14498002
申请日：2014-09-26
申请人： Panasonic Corporation
发明人： Yasutaka Tsuboi , Akira Yamada , Toshihiko Tsujikawa
IPC分类号： H05K13/04 , B32B38/00 , B32B41/00 , H05K13/08
CPC分类号： H05K13/0469 , H05K13/08
摘要： A bonding apparatus includes: a backup unit including a light-transmissive transmission member having a support surface which supports at least a bonding region of a light-transmissive board from below; a pressure-bonding unit which presses an electronic component placed on the bonding region via a photo-curable adhesive agent; and a light irradiation unit which irradiates the supporting surface with light which promotes hardening of the adhesive agent. The electronic component is bonded to the board by pressing the electronic component mounted on a top surface of the adhesive agent in a state in which light from the light irradiation unit is incident upon the adhesive agent through the supporting surface. The bonding apparatus further includes a light distribution measuring unit which measures a distribution of light from the light irradiation portion in the supporting surface.
摘要翻译：接合装置包括：备用单元，包括具有支撑表面的透光传输构件，所述支撑表面至少从下方支撑透光板的接合区域; 压接单元，其通过光固化型粘合剂挤压放置在接合区域上的电子部件; 以及利用促进粘合剂硬化的光照射支撑面的光照射单元。在来自光照射单元的光通过支撑表面入射到粘合剂的状态下，通过按压安装在粘合剂的顶表面上的电子部件将电子部件粘合到板上。接合装置还包括光分布测量单元，其测量来自支撑表面中的光照射部分的光的分布。

4. 发明授权

US09673165B2 Component mounting apparatus 有权
公开(公告)号：US09673165B2
公开(公告)日：2017-06-06
申请号：US14472614
申请日：2014-08-29
申请人： Panasonic Corporation
发明人： Yasuhiro Okada , Chihiro Igarashi , Toshihiko Tsujikawa
IPC分类号： B32B41/00 , H01L23/00
CPC分类号： H01L24/75 , H01L24/83 , H01L2224/27436 , H01L2224/2929 , H01L2224/293 , H01L2224/743 , H01L2224/75745 , H01L2224/83192 , H01L2224/83201 , H01L2224/83851 , H01L2924/00014
摘要： A component mounting apparatus includes a tape attaching unit, a component mounting unit and a component compression unit provided in this order. A time measuring unit measures time having passed after completion of predetermined work performed on all the substrates transferred to the tape attaching unit, the component mounting unit, and the component compression unit, respectively. When preparation for transferring the substrates to the tape attaching unit is not completed within a predetermined time after the start of measurement performed by the time measuring unit, the respective substrates, which wait in the tape attaching unit, the component mounting unit, and the component compression unit, are forcibly transferred to the downstream sides and predetermined work is performed on the respective substrates that are forcibly transferred to the component mounting unit and the component compression unit.

5. 发明授权

US09703129B2 Component mounting apparatus 有权
公开(公告)号：US09703129B2
公开(公告)日：2017-07-11
申请号：US14473171
申请日：2014-08-29
申请人： Panasonic Corporation
发明人： Akira Yamada , Yasuhiro Narikiyo , Yasutaka Tsuboi , Toshihiko Tsujikawa
IPC分类号： B23P19/00 , G02F1/13
CPC分类号： G02F1/1303 , Y10T29/53178
摘要： A component mounting apparatus that compresses a component to a transparent substrate on which the component is placed with a photocurable resin interposed therebetween. The component mounting apparatus includes: a receiving unit that includes a base member and a transparent member provided on an upper surface of the base member and receives a surface of the substrate, which is positioned below the component, on an upper surface of the transparent member; a pressing unit that presses the component against the substrate received by the receiving unit; and a light irradiation unit that irradiates the photocurable resin with light through the transparent member.

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