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1. 发明授权

US08652878B2 Stress-engineered interconnect packages with activator-assisted molds 有权
标题翻译：具有活化剂辅助模具的应力设计互连封装
公开(公告)号：US08652878B2
公开(公告)日：2014-02-18
申请号：US13799168
申请日：2013-03-13
申请人： Palo Alto Research Center Incorporated
发明人： Christopher L. Chua , Bowen Cheng , Eugene M. Chow , Dirk De Bruyker
IPC分类号： H01L21/44
CPC分类号： H01L21/50 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/05568 , H01L2224/05599 , H01L2224/1111 , H01L2224/11334 , H01L2224/13005 , H01L2224/13016 , H01L2224/13027 , H01L2224/16105 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/81903 , H01L2224/83193 , H01L2224/83855 , H01L2224/83859 , H01L2224/83874 , H01L2224/83885 , H01L2224/9211 , H01L2924/00013 , H01L2924/00014 , H01L2924/0002 , H01L2924/01006 , H01L2924/01018 , H01L2924/01024 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/0132 , H01L2924/09701 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H05K3/321 , H05K3/4015 , H05K2201/0311 , H01L2224/81 , H01L2224/83 , H01L2224/13099 , H01L2224/05099 , H01L2924/01015 , H01L2924/01049 , H01L2924/01031 , H01L2224/13599 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552 , H01L2924/00
摘要： A method includes providing a pad chip having contact pads, providing a spring chip having micro-springs, applying a chemical activator to one of either the pad chip or the spring chip, applying an adhesive responsive to the chemical activator on the other of the pad chip or the spring chip, aligning the pad chip to the spring chip such that the micro-springs will contact the contact pads, and pressing the pad chip and the spring chip together such that the chemical activator at least partially cures the adhesive.
摘要翻译：一种方法包括提供具有接触焊盘的焊盘芯片，提供具有微弹簧的弹簧芯片，将化学活化剂施加到衬垫芯片或弹簧芯片中的一个上，在衬垫的另一个上施加响应于化学活化剂的粘合剂芯片或弹簧芯片，将焊盘芯片对准弹簧芯片，使得微弹簧将接触接触焊盘，并将焊盘芯片和弹簧芯片压在一起，使得化学活化器至少部分地固化粘合剂。

2. 发明申请

US20130196471A1 STRESS-ENGINEERED INTERCONNECT PACKAGES WITH ACTIVATOR-ASSISTED MOLDS 有权
标题翻译：具有激活器辅助功能的应力工程互连包
公开(公告)号：US20130196471A1
公开(公告)日：2013-08-01
申请号：US13799168
申请日：2013-03-13
申请人： Palo Alto Research Center Incorporated
发明人： Christopher L. Chua , Bowen Cheng , Eugene M. Chow , Dirk De Bruyker
IPC分类号： H01L21/50
CPC分类号： H01L21/50 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/05568 , H01L2224/05599 , H01L2224/1111 , H01L2224/11334 , H01L2224/13005 , H01L2224/13016 , H01L2224/13027 , H01L2224/16105 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/81903 , H01L2224/83193 , H01L2224/83855 , H01L2224/83859 , H01L2224/83874 , H01L2224/83885 , H01L2224/9211 , H01L2924/00013 , H01L2924/00014 , H01L2924/0002 , H01L2924/01006 , H01L2924/01018 , H01L2924/01024 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/0132 , H01L2924/09701 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H05K3/321 , H05K3/4015 , H05K2201/0311 , H01L2224/81 , H01L2224/83 , H01L2224/13099 , H01L2224/05099 , H01L2924/01015 , H01L2924/01049 , H01L2924/01031 , H01L2224/13599 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552 , H01L2924/00
摘要： A method includes providing a pad chip having contact pads, providing a spring chip having micro-springs, applying a chemical activator to one of either the pad chip or the spring chip, applying an adhesive responsive to the chemical activator on the other of the pad chip or the spring chip, aligning the pad chip to the spring chip such that the micro-springs will contact the contact pads, and pressing the pad chip and the spring chip together such that the chemical activator at least partially cures the adhesive.
摘要翻译：一种方法包括提供具有接触焊盘的焊盘芯片，提供具有微弹簧的弹簧芯片，将化学活化剂施加到衬垫芯片或弹簧芯片中的一个上，在衬垫的另一个上施加响应于化学活化剂的粘合剂芯片或弹簧芯片，将焊盘芯片对准弹簧芯片，使得微弹簧将接触接触焊盘，并将焊盘芯片和弹簧芯片压在一起，使得化学活化器至少部分地固化粘合剂。

3. 再颁专利

USRE47570E1 Stressed substrates for transient electronic systems 有权
公开(公告)号：USRE47570E1
公开(公告)日：2019-08-13
申请号：US15726944
申请日：2017-10-06
申请人： Palo Alto Research Center Incorporated
发明人： Scott J. H. Limb , Gregory L. Whiting , Sean R. Garner , JengPing Lu , Dirk De Bruyker
IPC分类号： H01L21/64 , H01L21/71 , H01L23/14 , H01L27/00 , H03K19/177
摘要： A stressed substrate for transient electronic systems (i.e., electronic systems that visually disappear when triggered to do so) that includes one or more stress-engineered layers that store potential energy in the form of a significant internal stress. An associated trigger mechanism is also provided that, when triggered, causes an initial fracture in the stressed substrate, whereby the fracture energy nearly instantaneously travels throughout the stressed substrate, causing the stressed substrate to shatter into multiple small (e.g., micron-sized) pieces that are difficult to detect. The internal stress is incorporated into the stressed substrate through strategies similar to glass tempering (for example through heat or chemical treatment), or by depositing thin-film layers with large amounts of stress. Patterned fracture features are optionally provided to control the final fractured particle size. Electronic systems built on the substrate are entirely destroyed and dispersed during the transience event.

4. 发明授权

US09110354B2 Steerable illumination source for a compact camera 有权
标题翻译：用于紧凑型相机的可导向照明源
公开(公告)号：US09110354B2
公开(公告)日：2015-08-18
申请号：US13623786
申请日：2012-09-20
申请人： Palo Alto Research Center Incorporated
发明人： Philipp Helmut Schmaelzle , Dirk De Bruyker , Timothy Stowe
IPC分类号： G03B15/02 , G03B15/03 , G02B26/08 , H04M1/22
CPC分类号： G03B15/02 , G02B26/0841 , G02B26/085 , G03B15/03 , G03B2215/0528 , G03B2215/0585 , H04M1/22
摘要： A subsystem is disclosed providing a steerable-beam light source. An array of micromechanical reflectors may be disposed to selectively direct portions of light from a light source to selected targets in a scene, such as for providing composed illumination for still or video photography. The array of reflectors may be continuously steerable, thereby achieving more than the mere inefficient patterning of illumination light available from prior art projection approaches, but instead efficiently redirecting light to the desired regions of the scene. The subsystem may be sufficiently compact so as to permit integration with a compact camera into a cellular telephone, a tablet computer, a laptop computer, a digital still-image camera, a digital video-image camera, and so on. The array may be operated in conjunction with a camera controller to selectively illuminate one or more targets of focus or zoom, omit illumination of undesirable image regions, etc.
摘要翻译：公开了一种提供可转向光束光源的子系统。可以设置微机电反射器的阵列以选择性地将来自光源的光的一部分引导到场景中的选定目标，例如用于为静止或视频摄影提供合成照明。反射器阵列可以是连续可控的，从而实现比现有技术投影方法可获得的照明光的低效图案化，而是有效地将光重定向到场景的期望区域。子系统可以足够紧凑，以便允许将小型相机集成到蜂窝电话，平板计算机，膝上型计算机，数字静态图像相机，数字视频图像相机等中。阵列可以与照相机控制器一起操作以选择性地照亮一个或多个对焦或变焦目标，省略不期望的图像区域的照明等。

5. 再颁专利

USRE49059E1 Stressed substrates for transient electronic systems 有权
公开(公告)号：USRE49059E1
公开(公告)日：2022-05-03
申请号：US16537258
申请日：2019-08-09
申请人： Palo Alto Research Center Incorporated
发明人： Scott J. H. Limb , Gregory L. Whiting , Sean R. Garner , JengPing Lu , Dirk De Bruyker
IPC分类号： H01L21/64 , H01L21/71 , H01L23/14 , H01L27/00 , H03K19/177 , H03K19/17768
摘要： A stressed substrate for transient electronic systems (i.e., electronic systems that visually disappear when triggered to do so) that includes one or more stress-engineered layers that store potential energy in the form of a significant internal stress. An associated trigger mechanism is also provided that, when triggered, causes an initial fracture in the stressed substrate, whereby the fracture energy nearly instantaneously travels throughout the stressed substrate, causing the stressed substrate to shatter into multiple small (e.g., micron-sized) pieces that are difficult to detect. The internal stress is incorporated into the stressed substrate through strategies similar to glass tempering (for example through heat or chemical treatment), or by depositing thin-film layers with large amounts of stress. Patterned fracture features are optionally provided to control the final fractured particle size. Electronic systems built on the substrate are entirely destroyed and dispersed during the transience event.

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