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1. 发明申请

US20110051793A1 SYSTEM AND METHOD FOR EVALUATING PERFORMANCE OF A MIMO ANTENNA SYSTEM 失效
标题翻译：用于评估MIMO天线系统性能的系统和方法
公开(公告)号：US20110051793A1
公开(公告)日：2011-03-03
申请号：US12633895
申请日：2009-12-09
申请人： PO-CHUAN HSIEH , CHUN-JEN CHEN , CHIEN-HUNG LIU , YU-CHANG PAI , SHOU-KUO HSU
发明人： PO-CHUAN HSIEH , CHUN-JEN CHEN , CHIEN-HUNG LIU , YU-CHANG PAI , SHOU-KUO HSU
IPC分类号： H04B17/00
CPC分类号： H04B17/0085 , H04B17/21 , H04B17/23 , H04B17/327 , H04L1/0668
摘要： A performance evaluation system for a multiple-input multiple-output (MIMO) antenna system receives simulation parameters from an input device, and simulates a MIMO antenna system accordingly. A method, also provided, further evaluates performance of the simulated MIMO antenna system when a series of radio frequency (RF) signals are transmitted through the MIMO antenna system, and displays a performance analysis result of the MIMO antenna system on a display device for evaluation of the performance of the simulated MIMO antenna system.
摘要翻译：用于多输入多输出（MIMO）天线系统的性能评估系统从输入设备接收模拟参数，并相应地模拟MIMO天线系统。还提供了一种方法，当通过MIMO天线系统传输一系列射频（RF）信号时，进一步评估模拟MIMO天线系统的性能，并且在用于评估的显示装置上显示MIMO天线系统的性能分析结果的模拟MIMO天线系统的性能。

2. 发明申请

US20110266046A1 ENCLOSURE OF ELECTRONIC DEVICE 有权
标题翻译：电子设备外壳
公开(公告)号：US20110266046A1
公开(公告)日：2011-11-03
申请号：US12841125
申请日：2010-07-21
申请人： PO-CHUAN HSIEH , YU-CHANG PAI , CHIEN-HUNG LIU , SHOU-KUO HSU
发明人： PO-CHUAN HSIEH , YU-CHANG PAI , CHIEN-HUNG LIU , SHOU-KUO HSU
IPC分类号： H05K9/00
CPC分类号： H05K9/0041 , H05K9/0024
摘要： An enclosure of an electronic device includes a plate. The plate defines a number of through holes. A number of shields extend from the plate corresponding to the through holes. Each shield extends outwards from the outer surface of the plate, surrounding and partly covering a corresponding through hole. The enclosure with the shields can shield the electronic device from EMI.
摘要翻译：电子设备的外壳包括板。该板限定了多个通孔。多个屏蔽件从对应于通孔的板延伸。每个护罩从板的外表面向外延伸，围绕并部分覆盖相应的通孔。带屏蔽的外壳可以屏蔽电子设备免受EMI影响。

3. 发明申请

US20110266047A1 ENCLOSURE OF ELECTRONIC DEVICE 失效
标题翻译：电子设备外壳
公开(公告)号：US20110266047A1
公开(公告)日：2011-11-03
申请号：US12849939
申请日：2010-08-04
申请人： YU-CHANG PAI , CHIEN-HUNG LIU , PO-CHUAN HSIEH , SHOU-KUO HSU
发明人： YU-CHANG PAI , CHIEN-HUNG LIU , PO-CHUAN HSIEH , SHOU-KUO HSU
IPC分类号： H05K9/00
CPC分类号： H05K9/0024 , H05K9/0041
摘要： An enclosure includes a plate. The plate defines a number of through holes. A first shield extends from an edge bounding each through hole. A second shield extends from the edge bounding each through hole, opposite to the first shields. Each through hole is partially covered by a corresponding first shield and a corresponding second shield. The enclosure with the shields can shield the electronic device from electromagnetic interference.
摘要翻译：外壳包括一个板。该板限定了多个通孔。第一个屏蔽从每个通孔的边缘延伸。第二个屏蔽件从边界与每个通孔的边缘相延伸，与第一个屏蔽件相对。每个通孔被相应的第一屏蔽和对应的第二屏蔽部分地覆盖。带屏蔽的外壳可以屏蔽电子设备免受电磁干扰。

4. 发明申请

US20110094786A1 PRINTED CIRCUIT BOARD 有权
标题翻译：印刷电路板
公开(公告)号：US20110094786A1
公开(公告)日：2011-04-28
申请号：US12646888
申请日：2009-12-23
申请人： CHIEN-HUNG LIU , SHOU-KUO HSU , YU-CHANG PAI , PO-CHUAN HSIEH
发明人： CHIEN-HUNG LIU , SHOU-KUO HSU , YU-CHANG PAI , PO-CHUAN HSIEH
IPC分类号： H05K1/11
CPC分类号： H05K1/0251 , H05K1/0222 , H05K3/429 , H05K2201/09309 , H05K2201/09636
摘要： A printed circuit board includes a number of signal layers, a number of ground layers, a first transmission line, a second transmission line, a first via, and a second via. The first transmission is located on one of the number of signal layers. The second transmission line is located on another of the number of signal layers. The first and second vias pass through the printed circuit board. The first via is electrically coupled to the first and second transmission lines, and is isolated from the number of ground layers. The second via is electrically coupled to one or more of the number of ground layers, and is isolated from the other of the number of ground layers to increase an inductance, thus compensating capacitive nature of an open stub and improving signal integrity.
摘要翻译：印刷电路板包括多个信号层，多个接地层，第一传输线，第二传输线，第一通孔和第二通孔。第一个传输位于多个信号层之一上。第二传输线位于多个信号层的另一个上。第一和第二通孔穿过印刷电路板。第一通孔电耦合到第一和第二传输线，并且与接地层的数量隔离。第二通孔电耦合到多个接地层中的一个或多个，并与多个接地层中的另一个隔离，以增加电感，从而补偿开路短路的电容特性并提高信号完整性。

5. 发明申请

US20100237961A1 DIFFERENTIAL SIGNAL TRANSMISSION CABLE AND METHOD FOR COMPENSATING LENGTH OFFSET THEREOF 失效
标题翻译：差分信号传输电缆及其长度偏移补偿方法
公开(公告)号：US20100237961A1
公开(公告)日：2010-09-23
申请号：US12430132
申请日：2009-04-27
申请人： YU-CHANG PAI , CHIEN-HUNG LIU , PO-CHUAN HSIEH , PEI-CHUN LIN , SHOU-KUO HSU
发明人： YU-CHANG PAI , CHIEN-HUNG LIU , PO-CHUAN HSIEH , PEI-CHUN LIN , SHOU-KUO HSU
IPC分类号： H01P3/08
CPC分类号： H05K1/024 , H05K1/0245 , H05K1/0248 , H05K3/28 , H05K2201/0187 , H05K2201/0989
摘要： A compensation method compensates for a length offset between a first transmission line and a second transmission line of a differential signal transmission. The compensation method includes calculating a transmission speed of a first signal in the first transmission line, measuring lengths of the first and second transmission lines, calculating a transmission time of the first signal in the first transmission line, and calculating a relationship between permittivity values of the first and second transmission lines. The compensation method further changes the permittivity values of the first and second transmission lines according to the relationship.
摘要翻译：补偿方法补偿差分信号传输的第一传输线和第二传输线之间的长度偏移。所述补偿方法包括计算第一传输线中的第一信号的传输速度，测量第一和第二传输线的长度，计算第一传输线中的第一信号的传输时间，以及计算第一传输线的介电常数值之间的关系第一和第二传输线。补偿方法根据关系进一步改变第一和第二传输线的介电常数值。

6. 发明申请

US20120000700A1 PRINTED CIRCUIT BOARD 失效
标题翻译：印刷电路板
公开(公告)号：US20120000700A1
公开(公告)日：2012-01-05
申请号：US12837487
申请日：2010-07-15
申请人： CHIEN-HUNG LIU , PO-CHUAN HSIEH , YU-CHANG PAI , SHOU-KUO HSU
发明人： CHIEN-HUNG LIU , PO-CHUAN HSIEH , YU-CHANG PAI , SHOU-KUO HSU
IPC分类号： H05K1/11
CPC分类号： H05K1/162 , H05K1/0239 , H05K2201/0397 , H05K2201/10015 , H05K2201/1034
摘要： A printed circuit board includes a first signal layer, a second signal layer, and a dielectric layer sandwiched between the first signal layer and the second signal layer. The first signal layer includes two pads. The second signal layer includes two conducting pieces connected to two signal traces. The shape and material of the pads are the same as the shape and material of the conducting pieces. The projections of the pads on the second signal layer are overlapping with the conducting pieces.
摘要翻译：印刷电路板包括第一信号层，第二信号层和夹在第一信号层和第二信号层之间的电介质层。第一信号层包括两个焊盘。第二信号层包括连接到两个信号迹线的两个导电片。垫的形状和材料与导电片的形状和材料相同。第二信号层上的焊盘的突起与导电片重叠。

7. 发明申请

US20100271149A1 HIGH-FREQUECY MODULE FOR WIRELESS COMMUNICATIONS 审中-公开
标题翻译：用于无线通信的高频模块
公开(公告)号：US20100271149A1
公开(公告)日：2010-10-28
申请号：US12471339
申请日：2009-05-22
申请人： PO-CHUAN HSIEH , SHOU-KUO HSU , YU-CHANG PAI , CHIEN-HUNG LIU
发明人： PO-CHUAN HSIEH , SHOU-KUO HSU , YU-CHANG PAI , CHIEN-HUNG LIU
IPC分类号： H03H7/38
CPC分类号： H04B1/0458 , H01P3/003
摘要： A high-frequency module includes an antenna, an impedance matching circuit, and a transmission wire. The transmission wire is connected between the antenna and the impedance matching circuit. The transmission wire includes a dielectric layer, a signal layer, and two ground layers. The signal layer and the ground layers are located on the dielectric layer. The ground layers are located at opposite sides of the signal layer respectively. A space is formed between a signal and each ground layer.
摘要翻译：高频模块包括天线，阻抗匹配电路和传输线。传输线连接在天线和阻抗匹配电路之间。传输线包括电介质层，信号层和两个接地层。信号层和接地层位于电介质层上。接地层分别位于信号层的相对侧。在信号和每个接地层之间形成空间。

8. 发明申请

US20110025434A1 SIGNAL TRANSMISSION APPARATUS 有权
标题翻译：信号传输装置
公开(公告)号：US20110025434A1
公开(公告)日：2011-02-03
申请号：US12620558
申请日：2009-11-17
申请人： PO-CHUAN HSIEH , YU-CHANG PAI , SHOU-KUO HSU
发明人： PO-CHUAN HSIEH , YU-CHANG PAI , SHOU-KUO HSU
IPC分类号： H01P1/203 , H01P3/08
CPC分类号： H01P1/2039 , H01P3/085
摘要： A signal transmission apparatus includes two circuit layers. First and second ground sheets each has a rectangular area are arranged in the two circuit layers respectively. A third ground sheet is arranged between the two circuit layers. A differential pair includes a transmission line arranged between the first and third ground sheets and a transmission line arranged between the second and third ground sheets. The first to third ground sheets have same electric potential. Projections of the two rectangular areas on a surface where the third ground sheet in only have one common border with the third ground sheet. The third ground sheet is formed by extending the common border along a signal transmission direction. The differential pair includes a number of section pairs each composed of two sections arranged in the two transmission lines symmetrically. Every two adjacent section pairs are equivalent to a capacitor and an inductor.
摘要翻译：信号传输装置包括两个电路层。分别在两个电路层中布置有具有矩形区域的第一和第二接地片。第三接地片布置在两个电路层之间。差动对包括布置在第一和第三接地片之间的传输线和布置在第二和第三接地片之间的传输线。第一至第三接地片具有相同的电位。在第三接地片与第三接地片只有一个共同边界的表面上的两个矩形区域的投影。第三接地片通过沿着信号传输方向延伸公共边界而形成。差分对包括多个部分对，每个部分对由两个对称布置在两个传输线中的部分组成。每两个相邻的部分对相当于一个电容和一个电感。

9. 发明申请

US20120197583A1 ELECTRONIC DEVICE AND METHOD FOR AUTOMATICALLY TESTING PRINTED CIRCUIT BOARDS 审中-公开
标题翻译：电子设备和自动测试印刷电路板的方法
公开(公告)号：US20120197583A1
公开(公告)日：2012-08-02
申请号：US13290143
申请日：2011-11-07
申请人： HSIEN-CHUAN LIANG , SHEN-CHUN LI , PO-CHUAN HSIEH , YU-CHANG PAI , SHOU-KUO HSU
发明人： HSIEN-CHUAN LIANG , SHEN-CHUN LI , PO-CHUAN HSIEH , YU-CHANG PAI , SHOU-KUO HSU
IPC分类号： G06F19/00
CPC分类号： G01R31/2801 , G01R31/2812 , G01R31/2834
摘要： A method of testing a printed circuit board (PCB) acquires test points from a wiring diagram of the PCB. Frequency domain tested items for each test point and a standard value of each frequency domain tested item are preset. A distance between a preset fiducial point and each test point is computed to create a testing order of the test points according to the distances. The frequency domain tested items of each test point are computed according to the testing order. A pass or a failure of each test point is displayed according to a determination of if each of the computed frequency domain tested items within the corresponding standard value, and a test result of the PCB is output according to the passes or the failures.
摘要翻译：测试印刷电路板（PCB）的方法从PCB接线图获取测试点。每个测试点的频域测试项目和每个频域测试项目的标准值都是预设的。计算预设基准点与每个测试点之间的距离，以根据距离创建测试点的测试顺序。每个测试点的频域测试项目根据测试顺序计算。根据是否根据通过或故障输出每个计算出的频域测试项目在相应的标准值内以及PCB的测试结果的确定来显示每个测试点的通过或失败。

10. 发明申请

US20100328181A1 SIGNAL TRANSMISSION APPARATUS 有权
标题翻译：信号传输装置
公开(公告)号：US20100328181A1
公开(公告)日：2010-12-30
申请号：US12620559
申请日：2009-11-17
申请人： PO-CHUAN HSIEH , HSIAO-YUN SU , YU-CHANG PAI , SHOU-KUO HSU
发明人： PO-CHUAN HSIEH , HSIAO-YUN SU , YU-CHANG PAI , SHOU-KUO HSU
IPC分类号： H01Q1/48 , H01Q1/38
CPC分类号： H01Q13/08
摘要： A signal transmission apparatus includes two circuit layers. First and second ground sheets are arranged in the two circuit layers respectively. A third ground sheet is arranged between the two circuit layers. A differential pair includes a transmission line arranged between the first and third ground sheets and a transmission line arranged between the second and third ground sheets. The first to third ground sheets have same electric potential. Projections of the first and second ground sheets on the third ground sheet superpose a border of the third ground sheet. The third ground sheet is formed by extending the border along a signal transmission direction. A vertical distance between the first and second transmission lines is twice as each of a vertical distance from the first ground sheet to the first transmission line and a vertical distance from the second ground sheet to the second transmission line
摘要翻译：信号传输装置包括两个电路层。第一和第二接地片分别布置在两个电路层中。第三接地片布置在两个电路层之间。差动对包括布置在第一和第三接地片之间的传输线和布置在第二和第三接地片之间的传输线。第一至第三接地片具有相同的电位。第三接地片上的第一和第二接地片的投影叠加第三接地片的边界。第三接地片是沿着信号传输方向延伸边界而形成的。第一和第二传输线之间的垂直距离是从第一接地片到第一传输线的垂直距离和从第二接地片到第二传输线的垂直距离的两倍

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