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1. 发明授权

US08012331B2 Probe and method of making same 有权
标题翻译：探针及其制作方法
公开(公告)号：US08012331B2
公开(公告)日：2011-09-06
申请号：US11876180
申请日：2007-10-22
申请人： Oug-Ki Lee , Jung-Hoon Lee
发明人： Oug-Ki Lee , Jung-Hoon Lee
IPC分类号： C25D5/02
CPC分类号： G01R1/06744 , G01R1/06711 , G01R1/07307 , G01R1/07342 , G01R3/00
摘要： Disclosed herein are a probe and a method of making the same, and more particularly to a probe having a minute pitch, with which a probe card corresponding to arrangement of pads formed with a massed shape or other various shapes on a wafer is made, and a method of making the same. The probe having a prescribed thickness and formed in the shape of a flat plate. The probe comprises a body part bent at the middle thereof so that the body part is elastically tensioned or compressed when a tension force or a compression force is applied to the body part at the upper and lower ends thereof, a connection part integrally formed with the lower end of the body part, the connection part being fixed to a substrate, and a tip part integrally formed with the upper end of the body part, the tip part contacting a pad of an element.
摘要翻译：本文公开了一种探针及其制造方法，更具体地说，涉及一种具有微小间距的探针，其中形成了与晶片上形成有组合形状或其它各种形状的焊盘布置对应的探针卡，以及制作相同的方法。探针具有规定的厚度并形成为平板状。探头包括在其中间弯曲的主体部分，使得当在其上端和下端处对主体部分施加张力或压缩力时，主体部分被弹性张紧或压缩;与主体部分的上端和下端一体形成的连接部，主体部分的下端，连接部分固定到基底，以及与主体部分的上端一体形成的尖端部分，尖端部分接触元件的垫。

2. 发明申请

US20080035487A1 PROBE AND METHOD OF MAKING SAME 有权
标题翻译：探索和制作方法
公开(公告)号：US20080035487A1
公开(公告)日：2008-02-14
申请号：US11876180
申请日：2007-10-22
申请人： Oug-Ki Lee , Jung-Hoon Lee
发明人： Oug-Ki Lee , Jung-Hoon Lee
IPC分类号： C25D5/00
CPC分类号： G01R1/06744 , G01R1/06711 , G01R1/07307 , G01R1/07342 , G01R3/00
摘要： Disclosed herein are a probe and a method of making the same, and more particularly to a probe having a minute pitch, with which a probe card corresponding to arrangement of pads formed with a massed shape or other various shapes on a wafer is made, and a method of making the same. The probe having a prescribed thickness and formed in the shape of a flat plate. The probe comprises a body part bent at the middle thereof so that the body part is elastically tensioned or compressed when a tension force or a compression force is applied to the body part at the upper and lower ends thereof, a connection part integrally formed with the lower end of the body part, the connection part being fixed to a substrate, and a tip part integrally formed with the upper end of the body part, the tip part contacting a pad of an element.
摘要翻译：本文公开了一种探针及其制造方法，更具体地说，涉及一种具有微小间距的探针，其中形成了与晶片上形成有组合形状或其它各种形状的焊盘布置对应的探针卡，以及制作相同的方法。探针具有规定的厚度并形成为平板状。探头包括在其中间弯曲的主体部分，使得当在其上端和下端处对主体部分施加张力或压缩力时，主体部分被弹性张紧或压缩;与主体部分的上端和下端一体形成的连接部，主体部分的下端，连接部分固定到基底，以及与主体部分的上端一体形成的尖端部分，尖端部分接触元件的垫。

3. 发明授权

US07285966B2 Probe and method of making same 有权
标题翻译：探针及其制作方法
公开(公告)号：US07285966B2
公开(公告)日：2007-10-23
申请号：US10549335
申请日：2004-03-16
申请人： Oug-Ki Lee , Jung-Hoon Lee
发明人： Oug-Ki Lee , Jung-Hoon Lee
IPC分类号： G01R31/02
CPC分类号： G01R1/06744 , G01R1/06711 , G01R1/07307 , G01R1/07342 , G01R3/00
摘要： Disclosed herein are a probe and a method of making the same, and more particularly to a probe having a minute pitch, with which a probe card corresponding to arrangement of pads formed with a massed shape or other various shapes on a wafer is made, and a method of making the same. The probe having a prescribed thickness and formed in the shape of a flat plate. The probe comprises a body part bent at the middle thereof so that the body part is elastically tensioned or compressed when a tension force or a compression force is applied to the body part at the upper and lower ends thereof, a connection part integrally formed with the lower end of the body part, the connection part being fixed to a substrate, and a tip part integrally formed with the upper end of the body part, the tip part contacting a pad of an element.
摘要翻译：本文公开了一种探针及其制造方法，更具体地说，涉及一种具有微小间距的探针，其中形成了与晶片上形成有组合形状或其它各种形状的焊盘布置对应的探针卡，以及制作相同的方法。探针具有规定的厚度并形成为平板状。探头包括在其中间弯曲的主体部分，使得当在其上端和下端处对主体部分施加张力或压缩力时，主体部分被弹性张紧或压缩;与主体部分的上端和下端一体形成的连接部，主体部分的下端，连接部分固定到基底，以及与主体部分的上端一体形成的尖端部分，尖端部分接触元件的垫。

4. 发明授权

US07592565B2 Probe positioning and bonding device and probe bonding method 失效
标题翻译：探头定位和接合装置和探头接合方法
公开(公告)号：US07592565B2
公开(公告)日：2009-09-22
申请号：US10549418
申请日：2004-03-16
申请人： Oug-Ki Lee , Jung-Hoon Lee
发明人： Oug-Ki Lee , Jung-Hoon Lee
IPC分类号： B23K26/00
CPC分类号： G01R3/00 , B23K26/0861 , G01R1/06711 , G01R1/07342 , G01R31/2887
摘要： Disclosed herein are a probe positioning and bonding device and a probe bonding method, and more particularly a probe positioning and bonding device used to fix probes to prescribed positions on a substrate so that a probe card used for semiconductor integrated circuit testing equipment is manufactured, and a probe bonding method using the same. The probe positioning and bonding device comprises a stage unit disposed on a working table, a microscope disposed above the stage unit while being supported by means of a first supporting member disposed on the working table, a probe fixing unit disposed above the stage unit and below the microscope while being supported by means of a second supporting member disposed on the working table, and a light source unit supported by means of a third supporting member disposed on the working table. The light source unit is disposed toward the upper part of the stage unit.
摘要翻译：这里公开了探针定位和接合装置和探针接合方法，更具体地，涉及用于将探针固定到基板上的规定位置的探针定位和接合装置，从而制造用于半导体集成电路检测设备的探针卡，以及使用其的探针接合方法。探针定位和接合装置包括设置在工作台上的台单元，设置在平台单元上方的显微镜，同时由设置在工作台上的第一支撑构件支撑;探针固定单元，设置在平台单元上方和下方显微镜同时由设置在工作台上的第二支撑构件支撑，以及由设置在工作台上的第三支撑构件支撑的光源单元。光源单元朝向台单元的上部设置。

5. 发明申请

US20060171425A1 Probe and method of making same 有权
标题翻译：探针及其制作方法
公开(公告)号：US20060171425A1
公开(公告)日：2006-08-03
申请号：US10549335
申请日：2004-03-16
申请人： Oug-Ki Lee , Jung-Hoon Lee
发明人： Oug-Ki Lee , Jung-Hoon Lee
IPC分类号： H01S3/00
CPC分类号： G01R1/06744 , G01R1/06711 , G01R1/07307 , G01R1/07342 , G01R3/00
摘要： Disclosed herein are a probe and a method of making the same, and more particularly to a probe having a minute pitch, with which a probe card corresponding to arrangement of pads formed with a massed shape or other various shapes on a wafer is made, and a method of making the same. The probe having a prescribed thickness and formed in the shape of a flat plate. The probe comprises a body part bent at the middle thereof so that the body part is elastically tensioned or compressed when a tension force or a compression force is applied to the body part at the upper and lower ends thereof, a connection part integrally formed with the lower end of the body part, the connection part being fixed to a substrate, and a tip part integrally formed with the upper end of the body part, the tip part contacting a pad of an element.
摘要翻译：本文公开了一种探针及其制造方法，更具体地说，涉及一种具有微小间距的探针，其中形成了与晶片上形成有组合形状或其它各种形状的焊盘布置对应的探针卡，以及制作相同的方法。探针具有规定的厚度并形成为平板状。探头包括在其中间弯曲的主体部分，使得当在其上端和下端处对主体部分施加张力或压缩力时，主体部分被弹性张紧或压缩;与主体部分的上端和下端一体形成的连接部，主体部分的下端，连接部分固定到基底，以及与主体部分的上端一体形成的尖端部分，尖端部分接触元件的垫。

6. 发明申请

US20060169678A1 Probe positioning and bonding device and probe bonding method 失效
公开(公告)号：US20060169678A1
公开(公告)日：2006-08-03
申请号：US10549418
申请日：2004-03-16
申请人： Oug-Ki Lee , Jung-Hoon Lee
发明人： Oug-Ki Lee , Jung-Hoon Lee
IPC分类号： B23K26/00 , B23K26/02
CPC分类号： G01R3/00 , B23K26/0861 , G01R1/06711 , G01R1/07342 , G01R31/2887
摘要： Disclosed herein are a probe positioning and bonding device and a probe bonding method, and more particularly a probe positioning and bonding device used to fix probes to prescribed positions on a substrate so that a probe card used for semiconductor integrated circuit testing equipment is manufactured, and a probe bonding method using the same. The probe positioning and bonding device comprises a stage unit disposed on a working table, a microscope disposed above the stage unit while being supported by means of a first supporting member disposed on the working table, a probe fixing unit disposed above the stage unit and below the microscope while being supported by means of a second supporting member disposed on the working table, and a light source unit supported by means of a third supporting member disposed on the working table. The light source unit is disposed toward the upper part of the stage unit.

7. 发明授权

US07804312B2 Silicon wafer for probe bonding and probe bonding method using thereof 有权
标题翻译：用于探针接合的硅晶片和使用其的探针接合方法
公开(公告)号：US07804312B2
公开(公告)日：2010-09-28
申请号：US11569839
申请日：2005-06-14
申请人： Jung-Hoon Lee
发明人： Jung-Hoon Lee
IPC分类号： G01R31/02
CPC分类号： G01R3/00 , G01R1/07342
摘要： Disclosed herein are a silicon wafer for probe bonding and a probe bonding method using the same. The silicon wafer for probe bonding is improved in structure to facilitate probe bonding on a probe substrate. The probe bonding method involves bonding supporting beams on the silicon wafer to bumps on the probe substrate. The silicon wafer is formed at a surface thereof with probe tips and supporting beams on an end of each probe tip to have a redetermined arrangement pattern. The silicon wafer is further formed with openings from an upper surface to a lower surface thereof. A portion of each supporting beam opposite to the probe tips protrudes is exposed to the outside through the openings.
摘要翻译：这里公开了用于探针接合的硅晶片和使用该硅晶片的探针接合方法。用于探针接合的硅晶片在结构上得到改善以便于在探针基底上的探针接合。探针接合方法包括将硅晶片上的支撑束粘合到探针基板上的凸起。硅晶片在其表面处形成有探针尖端和支撑梁，每个探针尖端的端部具有重新确定的布置图案。硅晶片还形成有从上表面到下表面的开口。与探针尖端相反的每个支撑梁的一部分突出通过开口暴露于外部。

8. 发明授权

US07560764B2 SONOS memory device having curved surface and method for fabricating the same 有权
标题翻译：具有曲面的SONOS记忆装置及其制造方法
公开(公告)号：US07560764B2
公开(公告)日：2009-07-14
申请号：US11424524
申请日：2006-06-15
申请人： Byung-Gook Park , Jung-Hoon Lee
发明人： Byung-Gook Park , Jung-Hoon Lee
IPC分类号： H01L23/62
CPC分类号： H01L29/792 , H01L21/28282 , H01L29/1033 , H01L29/4232 , H01L29/66833 , H01L29/7854
摘要： A new SONOS memory device is provided, in which a conventional planar surface of multi-dielectric layers (ONO layers) is instead formed with a curved surface such as a cylindrical shape, and included is a method for fabricating the same.A radius of curvature of the upper surface of a blocking oxide can be designed to be larger than that of the lower surface of a tunneling oxide, which restrains electrons from passing through the blocking oxide by back-tunneling on erasing. As a result, a SONOS memory device shows an improvement in erasing speed.
摘要翻译：提供了一种新的SONOS存储器件，其中多个电介质层（ONO层）的常规平面表面替代地形成有诸如圆柱形的弯曲表面，并且包括其制造方法。阻挡氧化物的上表面的曲率半径可以被设计为大于隧道氧化物的下表面的曲率半径，其阻止电子在擦除时通过反向隧道穿过阻塞氧化物。结果，SONOS存储器件显示出擦除速度的改进。

9. 发明申请

US20070018237A1 Non-volatile memory device having fin-type channel region and method of fabricating the same 审中-公开
标题翻译：具有鳍型沟道区的非易失性存储器件及其制造方法
公开(公告)号：US20070018237A1
公开(公告)日：2007-01-25
申请号：US11489445
申请日：2006-07-20
申请人： Won-Joo Kim , Suk-Pil Kim , Yoon-Dong Park , Eun-Hong Lee , Jae-Woong Hyun , Sung-Jae Byun , Jung-Hoon Lee
发明人： Won-Joo Kim , Suk-Pil Kim , Yoon-Dong Park , Eun-Hong Lee , Jae-Woong Hyun , Sung-Jae Byun , Jung-Hoon Lee
IPC分类号： H01L29/792
CPC分类号： H01L29/7881 , G11C16/0483 , H01L27/115 , H01L27/11521 , H01L27/11568 , H01L29/40114 , H01L29/40117 , H01L29/7851 , H01L29/792
摘要： A non-volatile memory device with improved integration and/or improved performance by reducing an area per bit and controlling a body bias, and a method of fabricating the same. The non-volatile memory device may use surface portions of the outer side surfaces and/or the upper surfaces of at least one pair of fins protruding from a body and extending, spaced from each other along one direction, as at least one pair of channel regions. At least one control gate electrode may be formed across the channel regions, and at least one pair of storage nodes may be interposed in at least one portion between the control gate electrode and the channel regions.
摘要翻译：具有通过减少每位面积和控制体偏置而具有改进的集成度和/或改善性能的非易失性存储器件及其制造方法。非挥发性存储装置可以使用从主体突出的至少一对翅片的外侧表面和/或上表面的表面部分，并且沿着一个方向彼此间隔开，作为至少一对通道地区。可以在沟道区域之间形成至少一个控制栅电极，并且可以在控制栅电极和沟道区域之间的至少一个部分中插入至少一对存储节点。

10. 发明申请

US20060175565A1 Electric motor driven valve assembly having stator sealing 审中-公开
标题翻译：具有定子密封的电机驱动阀组件
公开(公告)号：US20060175565A1
公开(公告)日：2006-08-10
申请号：US11346792
申请日：2006-02-03
申请人： Roy Nungesser , Bill Fleischer , Andrew Kim , Jung-Hoon Lee , Sun-Tae Kim
发明人： Roy Nungesser , Bill Fleischer , Andrew Kim , Jung-Hoon Lee , Sun-Tae Kim
IPC分类号： F16K31/02
CPC分类号： F16K31/041 , F16K27/0254 , F16K27/029
摘要： An electrically driven stepmotor valve assembly including separable annular stator and rotor-valve assemblies. The rotor-like assembly having a cylindrical housing adapted to slip fit inside a central, domed, stator cavity, with alignable locking members on these assemblies permitting rotary interlocking upon the slip fit assembly thereof. A sealing arrangement, in the vicinity of the open end of the stator assembly, peripherally seals the stator and rotor-valve assemblies relative to each other, when assembled, with the rotor housing having a locating plate ring portion which, in turn, supports an elastic sealing member that fits into a groove in a bottom wall of the stator housing. A plurality of differing sealing arrangement designs and structures, including sealing member reinforcing structures, are set forth for the sealing of the interlocked stator and rotor-valve assemblies relative to each other.
摘要翻译：一种电驱动步进电机阀组件，包括可分离的环形定子和转子 - 阀组件。转子类组件具有圆柱形壳体，其适于滑动配合在中心圆顶定子腔体内，在这些组件上具有对准的锁定构件，允许在其滑动配合组件上进行旋转互锁。在组装时，在定子组件的开口端附近的密封装置周向地密封定子和转子 - 阀组件，转子壳体具有定位板环部分，该定位板环部分依次支撑弹性密封构件，其配合到定子壳体的底壁中的槽中。提出了多个不同的密封装置设计和结构，包括密封构件加强结构，用于相互之间的互锁的定子和转子 - 阀组件的密封。

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