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1. 发明申请

US20050121133A1 Method of manufacturing a magnetic head and magnetic head manufacturing apparatus 有权
标题翻译：制造磁头和磁头制造装置的方法
公开(公告)号：US20050121133A1
公开(公告)日：2005-06-09
申请号：US10996432
申请日：2004-11-26
申请人： Kazuaki Takanuki , Osamu Shindo , Akimasa Nakao , Satoshi Yamaguchi
发明人： Kazuaki Takanuki , Osamu Shindo , Akimasa Nakao , Satoshi Yamaguchi
IPC分类号： G11B5/60 , G05G15/00 , G11B5/187 , G11B21/21 , B32B31/00
CPC分类号： G11B5/4826
摘要： After photographing a surface on which an ABS is formed, and the outer shape of a slider, the ABS and an engraved region formed within the ABS are identified from a photographed image. A reference that becomes a guide for attaching to a suspension is then computed, and a positional relationship between the reference and the outer shape of the slider is stored as association information. Next, the outer shape of the slider is measured, and measured values are compared to the association information and a reference is read out when attaching the slider to the suspension. An adhesive is discharged, from below, onto a suspension attachment surface of the slider based on the reference. The slider may then be attached to the suspension while holding the slider in a state where the ABS is positioned on an upper side of the slider.
摘要翻译：在拍摄形成有ABS的表面和滑块的外部形状之后，从拍摄的图像中识别形成在ABS内的ABS和雕刻区域。然后计算成为附接到悬架的引导件的参考，并且存储滑块的基准和外部形状之间的位置关系作为关联信息。接下来，测量滑块的外形，并将测量值与关联信息进行比较，并且当将滑块附接到悬架时读出基准。基于参考，粘合剂从下方排出到滑块的悬挂附件表面上。然后可以将滑块附接到悬架，同时将滑块保持在ABS位于滑块的上侧的状态。

2. 发明申请

US20050106506A1 Method of manufacturing magnetic head 有权
标题翻译：制造磁头的方法
公开(公告)号：US20050106506A1
公开(公告)日：2005-05-19
申请号：US10976916
申请日：2004-11-01
申请人： Kazuaki Takanuki , Osamu Shindo , Akimasa Nakao , Masaaki Kaneko , Satoshi Yamaguchi
发明人： Kazuaki Takanuki , Osamu Shindo , Akimasa Nakao , Masaaki Kaneko , Satoshi Yamaguchi
IPC分类号： G11B5/60 , G11B5/48 , G11B21/21
CPC分类号： G11B5/4826 , G11B5/3169 , G11B5/455 , G11B5/6005 , Y10T29/49027 , Y10T29/4903 , Y10T29/49037
摘要： Provided is a method of manufacturing a magnetic head with which bonding of a slider and a suspension can be performed by taking an ABS pattern, which determines flying characteristics, as a reference, with no special fabrication required on the slider or the suspension. The method relates to a method of manufacturing a magnetic head for attaching a slider, on which an air bearing surface (ABS) is formed, to a suspension. A surface of the slider on which the ABS is formed is photographed, and the ABS and an engraved region formed within the ABS are identified from the photographed image. Then, a reference that serves as a guide in attaching the suspension is computed, and the slider is attached to the suspension based on the reference. It thus becomes possible for positive pressure and negative pressure that occur in the ABS to be well balanced centered about the suspension, making it possible to stabilize flying attitude and electrical characteristics.
摘要翻译：本发明提供一种制造磁头的方法，通过在滑块或悬架上不需要特别制造的情况下，通过以确定飞行特性的ABS图案作为参考，可以进行滑块和悬架的结合。该方法涉及一种制造磁头的方法，该磁头用于将形成有空气轴承表面（ABS）的滑块附接到悬架。拍摄形成有ABS的滑块的表面，并且从拍摄图像中识别形成在ABS内的ABS和雕刻区域。然后，计算作为附接悬架的引导件的基准，并且基于参考将滑块附接到悬架。因此，在ABS中发生的正压力和负压能够以悬架为中心良好地平衡，使得可以稳定飞行姿态和电气特性。

3. 发明申请

US20050045701A1 Solder ball supplying method and supplying device 有权
标题翻译：焊球供料方式及供料装置
公开(公告)号：US20050045701A1
公开(公告)日：2005-03-03
申请号：US10933389
申请日：2004-09-03
申请人： Osamu Shindo , Toru Mizuno , Youichi Andoh , Satoshi Yamaguchi
发明人： Osamu Shindo , Toru Mizuno , Youichi Andoh , Satoshi Yamaguchi
IPC分类号： H05K3/34 , B23K3/06 , B23K35/12
CPC分类号： B23K3/0623 , H05K3/3478
摘要： After introducing a solder ball from a hopper into a receiving hole of a ball separator, the ball separator is slid between blocks, and the solder ball is sent out to a portion outside of the blocks. By suctioning the solder ball from within a projected region on a lower block which is situated inside of the receiving hole at a time when the solder ball is taken into the receiving hole and surrounds a rolling trajectory of the solder ball that has been taken into the receiving hole, the solder ball is forcibly introduced into the receiving hole.
摘要翻译：在将料斗中的焊球引入球分离器的接收孔中之后，球分离器在块之间滑动，并将焊球送出到块外部的部分。通过在焊球被放入接收孔中并且包围已经被引入到接收孔中的焊球的滚动轨迹时，从位于接收孔内部的下部块上的投影区域内吸入焊球接收孔，焊球被强制引入接收孔。

4. 发明授权

US07649152B2 Conductive ball bonding method and conductive ball bonding apparatus 有权
标题翻译：导电球接合法和导电球接合装置
公开(公告)号：US07649152B2
公开(公告)日：2010-01-19
申请号：US11233090
申请日：2005-09-23
申请人： Osamu Shindo , Toru Mizuno , Satoshi Yamaguchi
发明人： Osamu Shindo , Toru Mizuno , Satoshi Yamaguchi
IPC分类号： B23K26/00 , B23K3/00
CPC分类号： B23K3/0623 , B23K1/0056 , H01L2224/742 , H05K3/3442 , H05K3/3478 , H05K3/3494 , H05K2203/0195 , H05K2203/041 , H05K2203/082 , H05K2203/107
摘要： The present invention provides a solder ball bonding method and a solder ball bonding apparatus, which can enhance efficiency of bonding processing and in which plural electrodes formed on objects to be bonded are bonded to each other by melting a solder ball. In the present invention, the solder balls are picked up by a pick-up nozzle having a plurality of pick-up openings corresponding to electrode areas on the objects to be bonded and the solder balls are conveyed on the electrode areas. A laser radiating unit disposed independently above the pick-up nozzle is shifted along an arrangement direction of the pick-up openings and a laser beam from the laser radiating unit is irradiated onto the solder ball through a transparent member of the pick-up nozzle and through the pick-up opening of the pick-up nozzle, thereby melting the solder ball on the electrode area.
摘要翻译：本发明提供一种焊球接合方法和焊球接合装置，其可以提高接合处理的效率，并且通过熔化焊球将形成在待接合物体上的多个电极彼此接合。在本发明中，焊球由具有对应于待接合物体上的电极区域的多个拾取开口的拾取喷嘴拾取，并且焊球在电极区域上传送。独立于拾取喷嘴上方设置的激光辐射单元沿着拾取开口的排列方向移动，并且来自激光辐射单元的激光束通过拾取喷嘴的透明构件照射到焊球上，通过拾取喷嘴的拾取开口，从而熔化电极区域上的焊球。

5. 发明授权

US07371488B2 Method of manufacturing magnetic head 有权
标题翻译：制造磁头的方法
公开(公告)号：US07371488B2
公开(公告)日：2008-05-13
申请号：US10976916
申请日：2004-11-01
申请人： Kazuaki Takanuki , Osamu Shindo , Akimasa Nakao , Masaaki Kaneko , Satoshi Yamaguchi
发明人： Kazuaki Takanuki , Osamu Shindo , Akimasa Nakao , Masaaki Kaneko , Satoshi Yamaguchi
IPC分类号： G11B21/21
CPC分类号： G11B5/4826 , G11B5/3169 , G11B5/455 , G11B5/6005 , Y10T29/49027 , Y10T29/4903 , Y10T29/49037
摘要： Provided is a method of manufacturing a magnetic head with which bonding of a slider and a suspension can be performed by taking an ABS pattern, which determines flying characteristics, as a reference, with no special fabrication required on the slider or the suspension. The method relates to a method of manufacturing a magnetic head for attaching a slider, on which an air bearing surface (ABS) is formed, to a suspension. A surface of the slider on which the ABS is formed is photographed, and the ABS and an engraved region formed within the ABS are identified from the photographed image. Then, a reference that serves as a guide in attaching the suspension is computed, and the slider is attached to the suspension based on the reference. It thus becomes possible for positive pressure and negative pressure that occur in the ABS to be well balanced centered about the suspension, making it possible to stabilize flying attitude and electrical characteristics.
摘要翻译：本发明提供一种制造磁头的方法，通过在滑块或悬架上不需要特别制造的情况下，通过以确定飞行特性的ABS图案作为参考，可以进行滑块和悬架的结合。该方法涉及一种制造磁头的方法，该磁头用于将形成有空气轴承表面（ABS）的滑块附接到悬架。拍摄形成有ABS的滑块的表面，并且从拍摄图像中识别形成在ABS内的ABS和雕刻区域。然后，计算用作附着悬架的引导件的引用，并且基于参考将滑块附接到悬架。因此，在ABS中发生的正压力和负压能够以悬架为中心良好地平衡，使得可以稳定飞行姿态和电气特性。

6. 发明申请

US20060065642A1 Bonding apparatus using conductive material 审中-公开
标题翻译：使用导电材料的接合装置
公开(公告)号：US20060065642A1
公开(公告)日：2006-03-30
申请号：US11234191
申请日：2005-09-26
申请人： Osamu Shindo , Satoshi Yamaguchi
发明人： Osamu Shindo , Satoshi Yamaguchi
IPC分类号： B23K26/20
CPC分类号： H05K3/3478 , B23K1/0016 , B23K1/0056 , B23K3/0623 , B23K2101/42 , H01L2224/742 , H05K3/3442 , H05K3/3494 , H05K2203/0195 , H05K2203/041 , H05K2203/082 , H05K2203/107
摘要： The present invention provides a bonding apparatus in which solder is conveyed onto a predetermined electrode, and the solder is melted by irradiation of a laser beam and is bonded to the electrode and has an object to prevent the solder from adhering to a solder conveying system of the apparatus. To achieve the above object, in the bonding apparatus, a film having low wettability to the solder and having a predetermined thickness such as a DLC film is coated on a region and a neighborhood of a solder holding and conveying member, which is contacted with the solder.
摘要翻译：本发明提供一种接合装置，其中将焊料输送到预定电极上，并且焊料通过激光束的照射而熔化并且结合到电极上，并且目的是防止焊料粘附到焊料输送系统该装置。为了实现上述目的，在接合装置中，在与焊料接触的焊料保持和输送部件的区域和附近涂覆对焊料具有低的润湿性并具有预定厚度的诸如DLC膜的膜，焊接。

7. 发明申请

US20060065641A1 Conductive ball bonding method and conductive ball bonding apparatus 有权
标题翻译：导电球接合法和导电球接合装置
公开(公告)号：US20060065641A1
公开(公告)日：2006-03-30
申请号：US11233090
申请日：2005-09-23
申请人： Osamu Shindo , Toru Mizuno , Satoshi Yamaguchi
发明人： Osamu Shindo , Toru Mizuno , Satoshi Yamaguchi
IPC分类号： B23K26/20
CPC分类号： B23K3/0623 , B23K1/0056 , H01L2224/742 , H05K3/3442 , H05K3/3478 , H05K3/3494 , H05K2203/0195 , H05K2203/041 , H05K2203/082 , H05K2203/107
摘要： The present invention provides a solder ball bonding method and a solder ball bonding apparatus, which can enhance efficiency of bonding processing and in which plural electrodes formed on objects to be bonded are bonded to each other by melting a solder ball. In the present invention, the solder balls are picked up by a pick-up nozzle having a plurality of pick-up openings corresponding to electrode areas on the objects to be bonded and the solder balls are conveyed on the electrode areas. A laser radiating unit disposed independently above the pick-up nozzle is shifted along an arrangement direction of the pick-up openings and a laser beam from the laser radiating unit is irradiated onto the solder ball through a transparent member of the pick-up nozzle and through the pick-up opening of the pick-up nozzle, thereby melting the solder ball on the electrode area.
摘要翻译：本发明提供一种焊球接合方法和焊球接合装置，其可以提高接合处理的效率，并且通过熔化焊球将形成在待接合物体上的多个电极彼此接合。在本发明中，焊球由具有对应于待接合物体上的电极区域的多个拾取开口的拾取喷嘴拾取，并且焊球在电极区域上传送。独立于拾取喷嘴上方设置的激光辐射单元沿着拾取开口的排列方向移动，并且来自激光辐射单元的激光束通过拾取喷嘴的透明构件照射到焊球上，通过拾取喷嘴的拾取开口，从而熔化电极区域上的焊球。

8. 发明申请

US20050067395A1 Solder bonding method and solder bonding device 有权
标题翻译：焊接方法和焊接接合装置
公开(公告)号：US20050067395A1
公开(公告)日：2005-03-31
申请号：US10947294
申请日：2004-09-23
申请人： Osamu Shindo , Toru Mizuno , Satoshi Yamaguchi
发明人： Osamu Shindo , Toru Mizuno , Satoshi Yamaguchi
IPC分类号： B23K1/005 , H05K3/34
CPC分类号： H05K3/3494 , B23K1/0056 , H01L2224/11003 , H01L2224/742 , H05K3/3442 , H05K2203/041 , H05K2203/107
摘要： A solder bonding method and a solder bonding device are provided, in which solder is melted, and heating of electrode portions is performed by irradiating laser light to an inner side of a region where electrodes portions are provided, making the temperature difference between the electrode portions and the melted solder smaller to improve the wettability of the solder and increase bonding reliability. The solder bonding method and the solder bonding device perform bonding of the electrode portions that are formed on an object to be bonded by melting the solder. After supplying the solder onto the electrode portions before melting, a laser is irradiated to the solder and to the electrode portions in the periphery of the solder. The solder melts, and the electrode portions are heated. The wettability of the solder with respect to the electrode portions thus improves, and the reliability of an electrical connection between the electrode portions can be increased.
摘要翻译：提供焊料接合方法和焊接接合装置，其中焊料熔化，并且通过向设置有电极部分的区域的内侧照射激光来进行电极部分的加热，使得电极部分之间的温度差并且熔化的焊料更小以改善焊料的润湿性并增加焊接可靠性。焊接接合方法和焊接接合装置通过熔化焊料进行形成在待接合物体上的电极部分的接合。在熔融之前将焊料供应到电极部分之后，激光照射到焊料和焊料周围的电极部分。焊料熔化，电极部分被加热。因此焊料相对于电极部的润湿性提高，可以提高电极部之间的电连接的可靠性。

9. 发明授权

US07357295B2 Solder ball supplying method and supplying device 有权
标题翻译：焊球供料方式及供料装置
公开(公告)号：US07357295B2
公开(公告)日：2008-04-15
申请号：US10933389
申请日：2004-09-03
申请人： Osamu Shindo , Toru Mizuno , Youichi Andoh , Satoshi Yamaguchi
发明人： Osamu Shindo , Toru Mizuno , Youichi Andoh , Satoshi Yamaguchi
IPC分类号： B23K31/02 , B23K37/00
CPC分类号： B23K3/0623 , H05K3/3478
摘要： After introducing a solder ball from a hopper into a receiving hole of a ball separator, the ball separator is slid between blocks, and the solder ball is sent out to a portion outside of the blocks. By suctioning the solder ball from within a projected region on a lower block which is situated inside of the receiving hole at a time when the solder ball is taken into the receiving hole and surrounds a rolling trajectory of the solder ball that has been taken into the receiving hole, the solder ball is forcibly introduced into the receiving hole.
摘要翻译：在将料斗中的焊球引入球分离器的接收孔中之后，球分离器在块之间滑动，并将焊球送出到块外部的部分。通过在焊球被放入接收孔中并且包围已经被引入到接收孔中的焊球的滚动轨迹时，从位于接收孔内部的下部块上的投影区域内吸入焊球接收孔，焊球被强制引入接收孔。

10. 发明授权

US07335272B2 Method of manufacturing a magnetic head and magnetic head manufacturing apparatus 有权
标题翻译：制造磁头和磁头制造装置的方法
公开(公告)号：US07335272B2
公开(公告)日：2008-02-26
申请号：US10996432
申请日：2004-11-26
申请人： Kazuaki Takanuki , Osamu Shindo , Akimasa Nakao , Satoshi Yamaguchi
发明人： Kazuaki Takanuki , Osamu Shindo , Akimasa Nakao , Satoshi Yamaguchi
IPC分类号： B32B41/00
CPC分类号： G11B5/4826
摘要： After photographing a surface on which an ABS is formed, and the outer shape of a slider, the ABS and an engraved region formed within the ABS are identified from a photographed image. A reference that becomes a guide for attaching to a suspension is then computed, and a positional relationship between the reference and the outer shape of the slider is stored as association information. Next, the outer shape of the slider is measured, and measured values are compared to the association information and a reference is read out when attaching the slider to the suspension. An adhesive is discharged, from below, onto a suspension attachment surface of the slider based on the reference. The slider may then be attached to the suspension while holding the slider in a state where the ABS is positioned on an upper side of the slider.
摘要翻译：在拍摄形成有ABS的表面和滑块的外部形状之后，从拍摄的图像中识别形成在ABS内的ABS和雕刻区域。然后计算成为附接到悬架的引导件的参考，并且存储滑块的基准和外部形状之间的位置关系作为关联信息。接下来，测量滑块的外形，并将测量值与关联信息进行比较，并且当将滑块附接到悬架时读出基准。基于参考，粘合剂从下方排出到滑块的悬挂附件表面上。然后可以将滑块附接到悬架，同时将滑块保持在ABS位于滑块的上侧的状态。

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