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    • 4. 发明申请
    • METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    • 制造半导体器件的方法
    • US20110129999A1
    • 2011-06-02
    • US13020534
    • 2011-02-03
    • Osamu NUKAGASatoshi YAMAMOTO
    • Osamu NUKAGASatoshi YAMAMOTO
    • H01L21/441
    • H01L21/76898H01L21/76831
    • Provided is a method for manufacturing a semiconductor device including: an electrode formation step of forming an electrode on one surface of a semiconductor substrate; a through hole formation step of forming a through hole starting from a position on the other surface corresponding to the position of the electrode; a first insulating layer formation step of forming a first insulating layer on at least an inner circumferential surface, a periphery of an opening, and a bottom surface of the through hole; a modifying step of reforming a first portion of the first insulating layer formed on the bottom surface of the through hole; a modified region removal step of removing the modified region; and a conductive layer formation step of forming a conductive layer on the electrode exposed inside the through hole and on the first insulating layer such that the conductive layer is electrically connected with the electrode.
    • 提供一种半导体器件的制造方法,包括:电极形成步骤,在半导体衬底的一个表面上形成电极; 通孔形成步骤,从对应于电极位置的另一表面的位置开始形成通孔; 第一绝缘层形成步骤,在至少内周面,开口周边和通孔的底面上形成第一绝缘层; 改性步骤,对形成在通孔底面上的第一绝缘层的第一部分进行重整; 修改区域去除步骤,去除修饰区域; 以及导电层形成步骤,在暴露在通孔内部的电极和第一绝缘层上形成导电层,使得导电层与电极电连接。