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1. 发明授权

US06478920B1 Chip-type circuit component and method of manufacturing the same 失效
标题翻译：片式电路元件及其制造方法
公开(公告)号：US06478920B1
公开(公告)日：2002-11-12
申请号：US08905145
申请日：1997-08-01
申请人： Osamu Kanoh , Masahiko Kawaguchi , Masahiro Bando , Atsuo Senda
发明人： Osamu Kanoh , Masahiko Kawaguchi , Masahiro Bando , Atsuo Senda
IPC分类号： B32B3100
CPC分类号： H01L27/016 , Y10T29/49126 , Y10T29/49155 , Y10T156/1052 , Y10T428/24926
摘要： A chip-type circuit component comprising a chip body which is formed by bonding first and second substrates with each other. A polyimide adhesion layer is provided between the first and second substrates and a thin film circuit pattern is formed on at least one of a pair of main surfaces of the first and second substrates which are opposite each other, while an external electrode is formed on an end surface of the chip body to be electrically connected with the thin film circuit pattern.
摘要翻译：一种芯片型电路部件，包括通过将第一和第二基板彼此接合而形成的芯片体。在第一和第二基板之间提供聚酰亚胺粘合层，并且在第一和第二基板的彼此相对的一对主表面中的至少一个上形成薄膜电路图案，而外部电极形成在芯片体的端面与薄膜电路图案电连接。

2. 发明授权

US5307045A High-frequency inductor and manufacturing method thereof 失效
标题翻译：高频电感及其制造方法
公开(公告)号：US5307045A
公开(公告)日：1994-04-26
申请号：US634724
申请日：1990-12-27
申请人： Atsuo Senda , Osamu Kanoh , Yutaka Sasaki
发明人： Atsuo Senda , Osamu Kanoh , Yutaka Sasaki
IPC分类号： H01F17/00 , H01F41/04 , H01F27/30
CPC分类号： H01F41/042 , H01F17/0006 , Y10T29/4902
摘要： A high-frequency inductor comprising an insulating substrate; and a conductive land formed on the insulating substrate, the conductive land comprising at least two thin films formed of different compositions of metals, each of the metals is to be etched by such an etching agent that substantially never removes the other metals, the thin films being accumulated vertically.
摘要翻译：一种包括绝缘基板的高频电感器; 以及形成在所述绝缘基板上的导电焊盘，所述导电焊盘包括由不同组成的金属形成的至少两个薄膜，每个所述金属将被所述蚀刻剂蚀刻，所述蚀刻剂基本上不会去除其它金属，所述薄膜垂直累积

3. 发明授权

US5874125A Activating catalytic solution for electroless plating and method of electroless plating 失效
标题翻译：化学镀活性催化剂和化学镀方法
公开(公告)号：US5874125A
公开(公告)日：1999-02-23
申请号：US39091
申请日：1998-03-13
申请人： Osamu Kanoh , Atsuo Senda, deceased
发明人： Osamu Kanoh , Atsuo Senda, deceased
IPC分类号： C23C18/14 , C23C18/16 , C23C18/30 , H05K3/10 , H05K3/18 , B05D5/12
CPC分类号： C23C18/1612 , C23C18/1608 , C23C18/30 , H05K3/105 , H05K3/185
摘要： There is provided a method of forming a conductive film having a predetermined pattern in hybrid ICs, high frequency dielectric filters and the like which makes it possible to safely and efficiently perform a series of the steps of preparing an activating catalytic solution for forming a photoreactive film on a base, forming the photoreactive film through the application of the activating catalytic solution, producing an activating catalyst by exposing particular regions of the photoreactive film, developing by flushing away the photoreactive film in unexposed regions, and immersing the base in an electroless plating bath without using an organic solvent and which allows the formation of a plating film having high electrical conductivity and high strength of adherence. A hydrophilic activating catalytic solution is used which is obtained by dissolving copper oxalate, a palladium salt such as palladium chloride into an alkaline solution such as ammonia. Since the activating catalytic solution itself does not include any organic solvent, the photoreactive film can be flushed away in unexposed regions using water at the developing step, which allows immediate immersion into an electroless plating bath.
摘要翻译：提供了在混合IC中形成具有预定图案的导电膜的方法，高频介质滤波器等，这使得可以安全有效地执行一系列制备用于形成光反应膜的活化催化剂溶液的步骤在基体上通过施加活化催化剂溶液形成光反应膜，通过暴露光反应膜的特定区域产生活化催化剂，通过冲洗未曝光区域中的光反应膜，将基底浸入化学镀浴中不使用有机溶剂，并且能够形成具有高导电性和高粘附强度的镀膜。使用通过将草酸铜，钯盐如氯化钯溶解在碱性溶液如氨中而获得的亲水活化催化剂溶液。由于活化催化剂本身不包括任何有机溶剂，因此可以在显影步骤中使用水在未曝光区域冲洗光反应膜，这使得立即浸入化学镀浴中。

4. 发明授权

US5746809A Activating catalytic solution for electroless plating 失效
标题翻译：活化催化剂用于化学镀
公开(公告)号：US5746809A
公开(公告)日：1998-05-05
申请号：US839432
申请日：1997-04-10
申请人： Osamu Kanoh , Yasushi Yoshida , Atsuo Senda, deceased
发明人： Osamu Kanoh , Yasushi Yoshida , Atsuo Senda, deceased
IPC分类号： C04B41/45 , C04B41/52 , C04B41/81 , C04B41/89 , C23C18/16 , C23C18/30 , H05K3/18 , C23C18/28
CPC分类号： C04B41/009 , C04B41/4541 , C04B41/52 , C04B41/81 , C04B41/89 , C23C18/1608 , C23C18/1612 , C04B2111/00844 , H05K3/185
摘要： Disclosed is an activating catalytic solution for electroless plating which makes possible carrying out successive processes efficiently, without using organic solvent, involving preparation of activating catalytic solution for forming substrate film, formation of a photo-sensitive film by providing the activating catalytic solution, creation of activating catalyst by exposure of specific areas of the photo-sensitive film to light, development by rinsing unexposed portions of the photo-sensitive film, and immersion of the substrate in an electroless plating bath. The activating catalyst can be created with high sensitivity to light at small energy of radiation. The activating catalytic solution preferably contains zinc oxalate, a copper salt, palladium salt such as palladium chloride, and an alkaline solution such as an ammonia water. The activating catalytic solution is used for forming a photo-sensitive film on a substrate to be subjected to electroless plating.
摘要翻译：公开了一种无电镀的活化催化剂溶液，其可以有效地进行连续的方法，而不使用有机溶剂，包括制备用于形成底物膜的活化催化剂溶液，通过提供活化催化剂溶液形成感光膜，通过将感光膜的特定区域暴露于光而活化催化剂，通过漂洗感光膜的未曝光部分显影，以及将基材浸入化学镀浴中。活化催化剂可以在较小的辐射能量下对光产生高灵敏度。活化催化剂溶液优选含有草酸锌，铜盐，氯化钯等钯盐，氨水等碱性溶液。活化催化剂溶液用于在要进行化学镀的基材上形成感光膜。

5. 发明授权

US4554209A Corrosion inhibiting coating comprising layer of organic corrosion inhibitor and layer of fluoridized acrylate 失效
标题翻译：防腐蚀涂层包括有机腐蚀抑制剂层和氟化丙烯酸层
公开(公告)号：US4554209A
公开(公告)日：1985-11-19
申请号：US618123
申请日：1984-06-07
申请人： Osamu Kanoh , Atsuo Senda
发明人： Osamu Kanoh , Atsuo Senda
IPC分类号： B32B15/082 , B05D7/14 , C23F11/00 , H01B3/18 , H01B3/44 , H01P7/04 , B32B27/00
CPC分类号： B05D7/14 , H01B3/18 , H01B3/447 , H01P7/04 , Y10T428/263 , Y10T428/3154 , Y10T428/31544 , Y10T428/31678 , Y10T428/31681 , Y10T428/31725
摘要： A corrosion inhibiting coating for a metal surface, especially useful for electrical conductors, where the surface of the metal is covered with an organic corrosion inhibitor and an exterior layer of an inactive fluoric material thereon.
摘要翻译：用于金属表面的腐蚀抑制涂层，特别适用于电导体，其中金属的表面被有机腐蚀抑制剂覆盖，其上的非活性氟材料的外层被覆盖。

6. 发明授权

US06255037B1 Method for producing monolithic electronic parts 失效
标题翻译：单片电子零件的制造方法
公开(公告)号：US06255037B1
公开(公告)日：2001-07-03
申请号：US08842432
申请日：1997-04-24
申请人： Osamu Kanoh , Yasushi Yoshida , Atsuo Senda , Yukio Sakabe
发明人： Osamu Kanoh , Yasushi Yoshida , Atsuo Senda , Yukio Sakabe
IPC分类号： G03F700
CPC分类号： H01G4/308
摘要： Inexpensive methods for producing small-sized monolithic electronic parts with improved functions by which an electroconductive film can be formed uniformly, thin, and in fine patterns on a ceramic green sheet, a carrier film, or a resin film, for example. A plurality of such ceramic green sheets, etc., each having the electroconductive film formed thereon, are laminated to give a ceramic laminate, which is then sintered. The electroconductive film is formed on each ceramic green sheet, etc., by the steps of: applying a hydrophilic liquid containing an activating catalyst comprising copper oxide, a palladium salt and an alkaline solution, for example, to thereby form a photosensitive film comprising said liquid containing said activating catalyst, exposing the photosensitive predetermined regions to thereby deposit palladium catalyst on said regions, washing out the non-exposed regions of the photosensitive film with water or a liquid consisting essentially of water, and dipping the ceramic green sheet having palladium catalyst deposited thereon in an electroless plating bath to thereby form the intended electroconductive film by electroless plating.
摘要翻译：用于制造具有改进功能的小尺寸单片电子部件的廉价方法，通过该方法可以在例如陶瓷生片，载体膜或树脂膜上均匀，薄且精细地形成导电膜。将多个形成有导电膜的陶瓷生片等层叠，得到陶瓷层叠体，然后烧结。导电膜通过以下步骤形成在每个陶瓷生片上：例如，施加含有包含氧化铜，钯盐和碱性溶液的活化催化剂的亲水性液体，从而形成包含所述含有所述活化催化剂的液体，曝光光敏预定区域，从而在所述区域上沉积钯催化剂，用水或基本上由水组成的液体冲洗感光膜的未曝光区域，并浸渍具有钯催化剂的陶瓷生片在化学镀浴中沉积，从而通过无电镀形成预期的导电膜。

7. 发明授权

US5810913A Activating catalytic solution for electroless plating and method of electroless plating 失效
公开(公告)号：US5810913A
公开(公告)日：1998-09-22
申请号：US729952
申请日：1996-10-15
申请人： Osamu Kanoh , Atsuo Senda, deceased
发明人： Osamu Kanoh , Atsuo Senda, deceased
IPC分类号： C23C18/14 , C23C18/16 , C23C18/30 , H05K3/10 , H05K3/18 , C23C18/18
CPC分类号： C23C18/1612 , C23C18/1608 , C23C18/30 , H05K3/105 , H05K3/185
摘要： There is provided a method of forming a conductive film having a predetermined pattern in hybrid ICs, high frequency dielectric filters and the like which makes it possible to safely and efficiently perform a series of the steps of preparing an activating catalytic solution for forming a photoreactive film on a base, forming the photoreactive film through the application of the activating catalytic solution, producing an activating catalyst by exposing particular regions of the photoreactive film, developing by flushing away the photoreactive film in unexposed regions, and immersing the base in an electroless plating bath without using an organic solvent and which allows the formation of a plating film having high electrical conductivity and high strength of adherence. A hydrophilic activating catalytic solution is used which is obtained by dissolving copper oxalate, a palladium salt such as palladium chloride into an alkaline solution such as ammonia. Since the activating catalytic solution itself does not include any organic solvent, the photoreactive film can be flushed away in unexposed regions using water at the developing step, which allows immediate immersion into an electroless plating bath.

8. 发明授权

US5699025A Thin film chip-type filter with an external electrode formed on an adhesion layer 失效
标题翻译：具有形成在粘合层上的外部电极的薄膜芯片型过滤器
公开(公告)号：US5699025A
公开(公告)日：1997-12-16
申请号：US632735
申请日：1996-04-15
申请人： Osamu Kanoh , Masahiko Kawaguchi , Masahiro Bando , Atsuo Senda
发明人： Osamu Kanoh , Masahiko Kawaguchi , Masahiro Bando , Atsuo Senda
IPC分类号： H01F5/00 , H01F17/04 , H01F27/28 , H01F41/04 , H01L27/01 , H03H7/01 , H03H7/09
CPC分类号： H01L27/016 , Y10T156/1052 , Y10T29/49126 , Y10T29/49155 , Y10T428/24926
摘要： A chip-type circuit component comprising a chip body which is formed by bonding first and second substrates with each other. A polyimide adhesion layer is provided between the first and second substrates and a thin film circuit pattern is formed on at least one of a pair of main surfaces of the first and second substrates which are opposite each other, while an external electrode is formed on an end surface of the chip body to be electrically connected with the thin film circuit pattern.
摘要翻译：一种芯片型电路部件，包括通过将第一和第二基板彼此接合而形成的芯片体。在第一和第二基板之间提供聚酰亚胺粘合层，并且在第一和第二基板的彼此相对的一对主表面中的至少一个上形成薄膜电路图案，而外部电极形成在芯片体的端面与薄膜电路图案电连接。

9. 发明授权

US06495456B1 Method of manufacturing chip type electronic parts 失效
标题翻译：芯片型电子零件的制造方法
公开(公告)号：US06495456B1
公开(公告)日：2002-12-17
申请号：US09416294
申请日：1999-10-14
申请人： Osamu Kanoh , Yasushi Yoshida , Yoshifumi Ogiso
发明人： Osamu Kanoh , Yasushi Yoshida , Yoshifumi Ogiso
IPC分类号： H01L2144
CPC分类号： H01F41/042 , H05K3/185
摘要： A method of manufacturing chip type electronic parts, comprises the steps of: applying a photo-active catalyst liquid to chip substrates to form a photo-sensitive film consisting of the photo-active catalyst liquid on the chip substrates; arranging the chip substrates with respect to a light source in a manner such that portions of the chip substrates on which electrodes are to be formed will become light irradiation portions; irradiating the chip substrates with a light so as to activate irradiated portions of the photo-sensitive film; dipping the chip substrates in an electroless plating bath and precipitating a plating metal on said activated portions.
摘要翻译：制造芯片型电子部件的方法包括以下步骤：将光活性催化剂液体施加到芯片基板上以在芯片基板上形成由光活性催化剂液体构成的感光膜; 以使得要形成电极的芯片基板的部分成为光照射部的方式相对于光源布置芯片基板; 用光照射芯片基板，激活感光膜的照射部分; 将芯片基板浸入化学镀浴中并使所述活化部分上的电镀金属沉淀。

10. 发明授权

US06686256B2 Method of manufacturing chip type electronic parts including forming a photo-sensitive film on the chips and irradiating the end surfaces with light 失效
标题翻译：制造芯片型电子部件的方法，包括在芯片上形成感光膜并用光照射端面
公开(公告)号：US06686256B2
公开(公告)日：2004-02-03
申请号：US09998450
申请日：2001-11-30
申请人： Osamu Kanoh , Yasushi Yoshida , Yoshifumi Ogiso
发明人： Osamu Kanoh , Yasushi Yoshida , Yoshifumi Ogiso
IPC分类号： H01L2146
CPC分类号： H01F41/042 , H05K3/185
摘要： A method of manufacturing chip type electronic parts, comprises the steps of: applying a photo-active catalyst liquid to chip substrates to form a photo-sensitive film consisting of the photo-active catalyst liquid on the chip substrates; arranging the chip substrates with respect to a light source in a manner such that portions of the chip substrates on which electrodes are to be formed will become light irradiation portions; irradiating the chip substrates with a light so as to activate irradiated portions of the photo-sensitive film; dipping the chip substrates in an electroless plating bath and precipitating a plating metal on said activated portions.
摘要翻译：制造芯片型电子部件的方法包括以下步骤：将光活性催化剂液体施加到芯片基板上以在芯片基板上形成由光活性催化剂液体构成的感光膜; 以使得要形成电极的芯片基板的部分成为光照射部的方式相对于光源布置芯片基板; 用光照射芯片基板，激活感光膜的照射部分; 将芯片基板浸入化学镀浴中并使所述活化部分上的电镀金属沉淀。

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