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    • 3. 发明授权
    • Front passenger seat air bag apparatus
    • 前排座椅气囊装置
    • US07959184B2
    • 2011-06-14
    • US12550606
    • 2009-08-31
    • Osamu FukawataseTomotaka KurodaMuneo Akashio
    • Osamu FukawataseTomotaka KurodaMuneo Akashio
    • B60R21/16B60R21/276
    • B60R21/239B60R21/205B60R21/2338B60R2021/23388
    • A passenger seat air bag apparatus includes an air bag which is housed folded inside an instrument panel, and inflates toward a passenger who is seated in a front passenger seat with a supply of gas during a frontal collision, and which has a vent hole that can be opened and closed; a first strap which is connected to both an area around the vent hole and a rear lower portion of a base cloth of the air bag in the longitudinal direction of the vehicle, and which closes the vent hole as the air bag inflates; and a second strap which is connected to an edge portion of the vent hole, and pulls on the edge portion of the vent hole and on the first strap around the vent hole so as to open the vent hole when the passenger who is wearing a seatbelt is restrained by the air bag.
    • 乘客座椅安全气囊装置包括:一个安全气囊,该气囊被折叠在仪表板内部,并且在正面碰撞期间向座椅前排乘客座椅充气,并且具有通气孔 打开和关闭; 第一带子,其沿着车辆的长度方向连接到通气孔周围的区域和气囊的基布的后下部,并且当气囊膨胀时关闭通气孔; 以及连接到通气孔的边缘部分的第二带,并且在穿着安全带的乘客的同时将通气孔的边缘部分和围绕通气孔的第一带拉出以打开通气孔 被气囊所限制。
    • 9. 发明申请
    • ELECTRONIC DEVICES FOR SURFACE MOUNT
    • 用于表面安装的电子设备
    • US20080253102A1
    • 2008-10-16
    • US12101020
    • 2008-04-10
    • Tomotaka Kuroda
    • Tomotaka Kuroda
    • H05K1/11H05K3/36
    • H05K3/3442H05K1/0243H05K3/368H05K2201/09036H05K2201/10083Y02P70/613Y10T29/49126
    • Electronic devices are disclosed that allow for surface-mounting using solder while preventing solder from overflowing between external terminals of the electronic device, or between pads on a circuit board to which the external terminals are soldered. An exemplary electronic device has a base board made of an insulating material and having an outer surface comprising at least one external terminal for surface mounting of the device to the circuit board. A groove is defined at least part way around the external terminal on the outer surface. The groove accommodates overflowed solder and thus prevents unintended spread flow of the solder to locations that otherwise could cause short circuits and the like. The electronic device can include a resin board containing a thermoset resin, wherein the groove is formed by thermal or mechanical processing.
    • 公开了允许使用焊料进行表面安装的电子器件,同时防止焊料在电子器件的外部端子之间或焊接在外部端子的电路板上的焊盘之间溢出。 示例性电子设备具有由绝缘材料制成的基板,并且具有包括至少一个外部端子的外表面的外部端子,用于将装置表面安装到电路板。 凹槽至少部分地围绕外表面的外部端子限定。 凹槽容纳溢出的焊料,从而防止焊料意外扩散到可能导致短路等的位置。 电子设备可以包括含有热固性树脂的树脂板,其中通过热或机械加工形成凹槽。
    • 10. 发明授权
    • Electronic devices for surface mount
    • 用于表面贴装的电子设备
    • US08064221B2
    • 2011-11-22
    • US12101020
    • 2008-04-10
    • Tomotaka Kuroda
    • Tomotaka Kuroda
    • H01L41/08
    • H05K3/3442H05K1/0243H05K3/368H05K2201/09036H05K2201/10083Y02P70/613Y10T29/49126
    • Electronic devices are disclosed that allow for surface-mounting using solder while preventing solder from overflowing between external terminals of the electronic device, or between pads on a circuit board to which the external terminals are soldered. An exemplary electronic device has a base board made of an insulating material and having an outer surface comprising at least one external terminal for surface mounting of the device to the circuit board. A groove is defined at least part way around the external terminal on the outer surface. The groove accommodates overflowed solder and thus prevents unintended spread flow of the solder to locations that otherwise could cause short circuits and the like. The electronic device can include a resin board containing a thermoset resin, wherein the groove is formed by thermal or mechanical processing.
    • 公开了允许使用焊料进行表面安装的电子器件,同时防止焊料在电子器件的外部端子之间或焊接在外部端子的电路板上的焊盘之间溢出。 示例性电子设备具有由绝缘材料制成的基板,并且具有包括至少一个外部端子的外表面的外部端子,用于将装置表面安装到电路板。 凹槽至少部分地围绕外表面的外部端子限定。 凹槽容纳溢出的焊料,从而防止焊料意外扩散到可能导致短路等的位置。 电子设备可以包括含有热固性树脂的树脂板,其中通过热或机械加工形成凹槽。