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    • 3. 发明授权
    • Pickup cable for stringed instrument
    • 用于弦乐器的拾音电缆
    • US08692102B2
    • 2014-04-08
    • US13916658
    • 2013-06-13
    • Kazuhisa KondoPen-Hao MaYoshiaki Abe
    • Kazuhisa KondoPen-Hao MaYoshiaki Abe
    • G10H3/12
    • G10H3/143G10H3/186
    • A pickup cable for a stringed instrument can switch between the output of the direct vibrational sound of strings and the output of the sound from the stringed instrument body generated by the vibrations of the strings and can also simultaneously output both the sound components. The pickup cable for a stringed instrument includes an input terminal to be inserted in a jack of the stringed instrument; a microphone to collect and convert sound of an internal space of the stringed instrument into collected-sound electrical signals; and an output terminal to output the collected-sound electrical signals. The microphone is incorporated in the input terminal.
    • 用于弦乐器的拾取电缆可以在弦的直接振动声音的输出和弦乐器产生的弦乐器主体的声音输出之间切换,并且还可以同时输出声音分量。 用于弦乐器的拾取电缆包括插入弦乐器的插孔中的输入端子; 用于收集和转换弦乐器的内部空间的声音到收集的声音电信号中的麦克风; 以及输出端子,用于输出收集的声音电信号。 麦克风被并入输入端。
    • 5. 发明授权
    • Method of capacity controlling of multistage compressor and apparatus
therefor
    • 多级压缩机及其设备的容量控制方法
    • US4770602A
    • 1988-09-13
    • US941639
    • 1986-12-15
    • Haruo MiuraToshio KanekoYoshiaki AbeHiroshi Ohmachi
    • Haruo MiuraToshio KanekoYoshiaki AbeHiroshi Ohmachi
    • F04D27/00F04D27/02F01D17/00
    • F04D27/0246
    • The invention relates to a capacity control method for controlling the capacity of a multistage compressor in response to a flow rate signal by varying the openings of vanes at individual stages. The relationships of the openings of the vanes of the individual stages are made to vary in response to the flow rate signal from the multistage compressor. Thus, when the flow rate of the multistage compressor is far from the anti-surge capacity within the operable range thereof, it is possible to select vane opening relationships which provide the highest efficiency for the multistage compressor. When the flow rate of the multistage compressor drops to either a value near the anti-surge capacity or the inoperable range, on the other hand, it is possible to select vane opening relationships which provide an enlargement of the operating range of the multistage compressor, before the flow rate enters that inoperable range.
    • 本发明涉及一种容量控制方法,用于通过改变各级叶片的开口来响应流量信号来控制多级压缩机的容量。 各级的叶片的开口的关系响应于来自多级压缩机的流量信号而变化。 因此,当多级压缩机的流量远远超过其在可操作范围内的防喘振能力时,可以选择为多级压缩机提供最高效率的叶片开度关系。 另一方面,当多级压缩机的流量下降到接近防喘振能力或不可操作范围的值时,可以选择提供多级压缩机的工作范围的叶片开度关系, 在流量进入不可操作的范围之前。
    • 8. 发明授权
    • Chip-type semiconductor ceramic electronic component
    • 芯片式半导体陶瓷电子元器件
    • US08164178B2
    • 2012-04-24
    • US12845271
    • 2010-07-28
    • Takayo KatsukiYoshiaki Abe
    • Takayo KatsukiYoshiaki Abe
    • H01L23/00
    • H01C1/142H01C7/02H01C7/04H01C7/10
    • A chip-type semiconductor ceramic electronic component including a ceramic body made of a semiconductor ceramic, first external electrodes formed on opposite end surfaces of the ceramic body, and second external electrodes extending to cover surfaces of the first external electrodes and part of side surfaces of the ceramic body. A curvature radius of a corner portion of the ceramic body is R (μm), a maximum thickness of a layer of the first external electrode layer, which is in contact with the ceramic body, measured from the end surface of the ceramic body is y (μm), and a minimum thickness of a layer of the second external electrode, which is in contact with the side surface of the ceramic body, measured from an apex of the corner portion of the ceramic body is x (μm), and 20≦R≦50, −0.4 x+0.6≦y≦0.4 is satisfied when 0.5≦x≦1.1, and −0.0076 x+0.16836≦y≦0.4 is satisfied when 1.1≦x≦9.0.
    • 一种芯片型半导体陶瓷电子元件,包括由半导体陶瓷制成的陶瓷体,形成在陶瓷体的相对端面上的第一外部电极和第二外部电极,该第二外部电极延伸至第一外部电极和第二外部电极的侧面的一部分 陶瓷体。 陶瓷体的角部的曲率半径为R(μm),从陶瓷体的端面测定的与陶瓷体接触的第一外部电极层的层的最大厚度为y (μm),并且从陶瓷体的角部的顶点测量的与陶瓷体的侧面接触的第二外部电极的层的最小厚度为x(μm),并且20< 当1.1≦̸ x≦̸ 9.0时,满足0.5≤nlE; x≦̸ 1.1和-0.0076×+ 0.16836≦̸ y≦̸ 0.4; R<
    • 10. 发明授权
    • Method of producing thermistor chips
    • 制造热敏电阻芯片的方法
    • US06311390B1
    • 2001-11-06
    • US09415450
    • 1999-10-08
    • Yoshiaki AbeTakahiko KawaharaToshiharu Hirota
    • Yoshiaki AbeTakahiko KawaharaToshiharu Hirota
    • H01C702
    • H01C7/021H01C17/006Y10T29/49085
    • Thermistor chips are produced by first obtaining elongated strips made of a sintered ceramic plate having a specified resistance-temperature characteristic and having thereon a plurality of mutually parallel grooves extending perpendicularly to its direction of elongation. On each of these strips, ohmic electrodes are formed, one extending continuously from one of its main surfaces to one of its side surfaces and another extending continuously from the other oppositely facing main surface to the opposite side surface. This may done by covering the strip completely with an electrically conductive film and separating it into two areal parts by forming a longitudinally extending slit on each of the main surfaces. These strips are then stacked one on top of another by aligning the grooves on each of these strips and adhesively attached together with a glass paste in between. The layered structure thus obtained is broken up along the aligned grooves to obtain individual units of which newly exposed surfaces may later be covered by an electrically insulating material.
    • 通过首先获得由具有规定的电阻温度特性的烧结陶瓷板制成的长条,并且在其上具有垂直于其延伸方向延伸的多个相互平行的槽来制造热敏电阻芯片。 在这些条带中的每一条上,形成欧姆电极,一个从其主表面之一连续地延伸到其一个侧表面,另一个从另一个相对的主表面连续延伸到相对的侧表面。 这可以通过用导电膜完全覆盖条带并通过在每个主表面上形成纵向延伸的狭缝将其分离成两个区域来完成。 然后通过对准这些条带中的每一个上的凹槽并且用玻璃糊粘合在一起,将这些条状物叠置在另一个之上。 由此获得的层状结构沿着对准的沟槽被分解,以获得其中新露出的表面稍后可被电绝缘材料覆盖的单独的单元。