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1. 发明申请

US20180100992A1 SIX-ASPHERIC-SURFACE LENS 审中-公开
公开(公告)号：US20180100992A1
公开(公告)日：2018-04-12
申请号：US15286932
申请日：2016-10-06
申请人： OmniVision Technologies, Inc.
发明人： Chuen-Yi YIN , Jau-Jan DENG
IPC分类号： G02B13/00 , G02B9/64
CPC分类号： G02B13/0045 , G02B9/64 , G06K9/00604 , H04M1/026
摘要： A six-aspheric-surface lens has six coaxially aligned lenses including, in order, a positive first lens, a negative second lens, a negative third lens, a negative fourth lens, a negative fifth lens, and a plano-gull-wing sixth lens. The six-aspheric-surface lens also includes a first biplanar substrate between the first lens and the second lens, a second biplanar substrate between the third lens and the fourth lens, and a third biplanar substrate between the fifth lens and the sixth lens. The first lens may have an Abbe number exceeding 48, the second lens and the third lens each may have an Abbe number less than 35. The first lens may have a focal length f1 and the second lens may have a focal length f2 such that −0.27

2. 发明申请

US20200218043A1 IMAGING SYSTEM AND BIMODAL ZOOM LENS THEREOF 审中-公开
公开(公告)号：US20200218043A1
公开(公告)日：2020-07-09
申请号：US16243935
申请日：2019-01-09
申请人： OmniVision Technologies, Inc.
发明人： Tingyu CHENG , Jau-Jan DENG
IPC分类号： G02B15/177 , G02B15/20 , G02B23/24
摘要： A bimodal zoom lens includes three coaxially aligned lenses including a first lens, a third lens, and a second lens therebetween. The first lens is a negative lens, each of the second lens and the third lens is a positive lens. The three coaxially aligned lenses form (i) a first configuration when the second lens and the first lens are separated by an axial distance L11 and (ii) a second configuration when the second lens and the first lens are separated by an axial distance L12, which exceeds axial distance L11. The second configuration has a second effective focal length that exceeds a first effective focal length of the first configuration.

3. 发明申请

US20160004049A1 WAFER-LEVEL LENS SYSTEMS AND METHODS FOR MANUFACTURING THE SAME 有权
标题翻译：水平透镜系统及其制造方法
公开(公告)号：US20160004049A1
公开(公告)日：2016-01-07
申请号：US14323846
申请日：2014-07-03
申请人： OmniVision Technologies, Inc.
发明人： Chuen-Yi YIN , Jau-Jan DENG
IPC分类号： G02B13/00 , B29D11/00
CPC分类号： G02B13/0085 , B29D11/00307 , G02B9/12 , G02B13/0035 , G02B13/006
摘要： A wafer-level lens system includes one or more wafer-level lenses, each of the one or more wafer-level lenses having a substrate with opposing first and second surfaces, a first lens element of a first material and disposed on the first surface, and a second lens element of a second material and disposed on the second surface, wherein, for at least one of the one or more wafer-level lenses, the first material is different from the second material. Another wafer-level lens system includes three wafer-level lenses optically coupled in series with each other, each of the three wafer-level lenses having a substrate with opposing first and second surfaces, a first lens element disposed on the first surface and having an aspheric surface facing away from the first surface, and a second lens element disposed on the second surface and having an aspheric surface facing away from the second surface.
摘要翻译：晶片级透镜系统包括一个或多个晶片级透镜，所述一个或多个晶片级透镜中的每一个具有具有相对的第一和第二表面的基板，第一材料的第一透镜元件并且设置在第一表面上，以及第二材料的第二透镜元件，并且设置在所述第二表面上，其中，对于所述一个或多个晶片级透镜中的至少一个，所述第一材料与所述第二材料不同。另一个晶片级透镜系统包括三个晶片级透镜，它们彼此串联耦合，三个晶片级透镜中的每个透镜具有相对的第一和第二表面的基板，设置在第一表面上的第一透镜元件，面对第一表面的非球面表面和设置在第二表面上并且具有背离第二表面的非球面的第二透镜元件。

4. 发明申请

US20230118866A1 Endoscope Tip Assembly Using Truncated Trapezoid Cavity Interposer To Allow Coplanar Camera And LEDs in Small-Diameter Endoscopes 有权
公开(公告)号：US20230118866A1
公开(公告)日：2023-04-20
申请号：US17747803
申请日：2022-05-18
申请人： OmniVision Technologies, Inc.
发明人： Teng-Sheng CHEN , Wei-Ping CHEN , Wei-Feng LIN , Jau-Jan DENG
IPC分类号： A61B1/05 , A61B1/06 , A61B1/00
摘要： A cavity interposer has a cavity, first bondpads adapted to couple to a chip-type camera cube disposed within a base of the cavity at a first level, the first bondpads coupled through feedthroughs to second bondpads at a base of the interposer at a second level; and third bondpads adapted to couple to a light-emitting diode (LED), the third bondpads at a third level. The third bondpads coupled to fourth bondpads at the base of the interposer at the second level; and the second and fourth bondpads couple to conductors of a cable with the first, second, and third level different. An endoscope optical includes the cavity interposer an LED, and a chip-type camera cube electrically bonded to the first bondpads; the LED is bonded to the third bondpads; and a top of the chip-type camera cube and a top of the LED are at a same level.

5. 发明申请

US20180196227A1 Four-Surface Near-Infrared Wafer-Level Lens Systems 审中-公开
公开(公告)号：US20180196227A1
公开(公告)日：2018-07-12
申请号：US15402523
申请日：2017-01-10
申请人： OmniVision Technologies, Inc.
发明人： Tingyu CHENG , Jau-Jan DENG
IPC分类号： G02B13/00 , G02B27/00
CPC分类号： G02B13/003 , G02B13/008 , G02B13/0085
摘要： A four-surface, near-infrared wafer-level lens system for imaging a scene onto an image plane includes (a) a first wafer-level lens having a first convex lens surface facing the scene and a second concave lens surface facing the image plane, and (b) a second wafer-level lens disposed between the first wafer-level lens and the image plane and including a third concave lens surface facing the scene and a fourth aspheric convex lens surface facing the image plane. The four-surface, near-infrared wafer-level lens system is further characterized by an image resolution corresponding to at least 60% contrast of 2 line pairs per millimeter in object plane across a scene portion having at least 10 millimeters extent in the object plane.

6. 发明申请

US20220230011A1 THIN, MULTI-LENS, OPTICAL FINGERPRINT SENSOR ADAPTED TO IMAGE THROUGH CELL PHONE DISPLAYS 有权
公开(公告)号：US20220230011A1
公开(公告)日：2022-07-21
申请号：US17150827
申请日：2021-01-15
申请人： OmniVision Technologies, Inc.
发明人： Tsung-Wei WAN , Wei-Ping CHEN , Jau-Jan DENG , Kuang-ju WANG
IPC分类号： G06K9/00 , G02B3/00 , G02B5/00
摘要： A multiple-lens optical fingerprint reader for reading fingerprints through a display has an image sensor integrated circuit with photosensor array(s); a spacer; and multiple lenses in a microlens array, each lens of multiple lenses focuses light arriving at that lens from a finger adjacent the display through the spacer to form an image on associated photosensors on a photosensor array of the integrated circuit. A method of verifying identity of a user includes illuminating a finger of the user with an OLED display; focusing light from the fingerprint through arrayed microlenses onto a photosensor array of an integrated circuit, reading the array to overlapping electronic fingerprint images; extracting features from the overlapping electronic fingerprint images or from a stitched fingerprint image, and comparing the features to features of at least one user in a library of features and associated with one or more fingers of one or more authorized users.

7. 发明申请

US20200322507A1 LIGHT-FIELD CAMERA AND METHOD USING WAFER-LEVEL INTEGRATION PROCESS 审中-公开
公开(公告)号：US20200322507A1
公开(公告)日：2020-10-08
申请号：US16377391
申请日：2019-04-08
申请人： OmniVision Technologies, Inc.
发明人： Teng-Sheng Chen , Jau-Jan DENG , Chia-Yang CHANG , Wei-Feng LIN
IPC分类号： H04N5/225 , G02B27/09 , H04N5/232 , H01L27/146
摘要： A camera module has light-field camera(s) and high resolution camera(s), the light-field camera(s) have multiple-lens arrays above an image sensor. The light-field camera(s) have a lens element at a same level as a lens element of the high resolution camera, the lens elements bearing apertures. The multiple-lens array of the light-field camera is above the image sensor at a same level as a flat transparent plate of the high resolution camera. The cameras lens cubes are made simultaneously by bonding molded lens plates and spacer plates, the lens plates and spacer plates including an upper lens plate having upper light-field camera lens elements and upper high resolution camera lens elements with applied apertures, multiple spacer plates, a microlens plate bearing an array of microlenses in the light-field cameras, the microlens plate being flat and transparent in areas of the high resolution camera.

8. 发明申请

US20180252846A1 ATHERMAL DOUBLET LENS WITH LARGE THERMO-OPTIC COEFFICIENTS 审中-公开
公开(公告)号：US20180252846A1
公开(公告)日：2018-09-06
申请号：US15450891
申请日：2017-03-06
申请人： OmniVision Technologies, Inc.
发明人： Chuen-Yi YIN , Jau-Jan DENG
IPC分类号： G02B3/00 , G02B7/00 , G02B13/00 , G02B1/04 , B29D11/00
CPC分类号： G02B3/00 , B29D11/00307 , B29D11/00403 , B29D11/00442 , B29K2995/0031 , G02B1/041 , G02B7/008 , G02B13/006
摘要： An athermal lens system includes a converging lens element having a negative first thermo-optic coefficient, and a diverging lens element having a second thermo-optic coefficient more negative than the first thermo-optic coefficient, wherein the diverging lens element is coupled with the converging lens element to form a converging athermal doublet lens.

9. 发明申请

US20230131591A1 THIN, MULTI-LENS, OPTICAL FINGERPRINT SENSOR ADAPTED TO IMAGE THROUGH CELL PHONE DISPLAYS 有权
公开(公告)号：US20230131591A1
公开(公告)日：2023-04-27
申请号：US17512106
申请日：2021-10-27
申请人： OmniVision Technologies, Inc.
发明人： Jau-Jan DENG , Kuang-Ju WANG , Chun-Jen WEI
IPC分类号： G06K9/00 , G06K9/46 , G02B3/00 , G02B5/00 , G02B5/20
摘要： A multiple-lens optical fingerprint reader for reading fingerprints through a display has a spacer; and multiple microlenses with concave and convex surfaces in a microlens array, each microlens of multiple lenses focuses light arriving at that microlens from a finger adjacent the display through the spacer forms an image on associated photosensors on a photosensor array of an image sensor integrated circuit. A method of verifying identity of a user includes illuminating a finger of the user with an OLED display; focusing light from the finger through arrayed microlenses onto a photosensor array, reading the array into overlapping electronic fingerprint images; extracting features from the overlapping fingerprint images or from a stitched fingerprint image, and comparing the features to features of at least one user in a library of features and associated with one or more fingers of one or more authorized users.

10. 发明申请

US20230122722A1 Endoscope Tip Assembly Using Cavity Interposer To Allow Coplanar Camera And LEDs 有权
公开(公告)号：US20230122722A1
公开(公告)日：2023-04-20
申请号：US17504105
申请日：2021-10-18
申请人： OmniVision Technologies, Inc.
发明人： Teng-Sheng CHEN , Wei-Ping CHEN , Jau-Jan DENG , Wei-Feng LIN , Chun-Sheng FAN
IPC分类号： A61B1/05 , A61B1/06 , A61B1/00
摘要： A cavity interposer has a cavity, first bondpads adapted to couple to a chip-type camera cube disposed within a base of the cavity at a first level, the first bondpads coupled through feedthroughs to second bondpads at a base of the interposer at a second level; and third bondpads adapted to couple to a light-emitting diode (LED), the third bondpads at a third level. The third bondpads coupled to fourth bondpads at the base of the interposer at the second level; and the second and fourth bondpads couple to conductors of a cable with the first, second, and third level different. An endoscope optical includes the cavity interposer an LED, and a chip-type camera cube electrically bonded to the first bondpads; the LED is bonded to the third bondpads; and a top of the chip-type camera cube and a top of the LED are at a same level.

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