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    • 1. 发明授权
    • Highly uniform silicon carbide epitaxial layers
    • 高度均匀的碳化硅外延层
    • US06297522B1
    • 2001-10-02
    • US09502612
    • 2000-02-11
    • Olle Claes Erik KordinaKenneth George IrvineMichael James Paisley
    • Olle Claes Erik KordinaKenneth George IrvineMichael James Paisley
    • H01L310312
    • C23C16/325C30B25/02C30B29/36Y10S148/148
    • An improved chemical vapor deposition method is disclosed that increases the uniformity of silicon carbide epitaxial layers and that is particularly useful for obtaining thicker epitaxial layers. The method comprises heating a reactor to a temperature at which silicon carbide source gases will form an epitaxial layer of silicon carbide on a substrate in the reactor; and then directing a flow of source and carrier gases through the heated reactor to form an epitaxial layer of silicon carbide on the substrate with the carrier gases comprising a blend of hydrogen and a second gas in which the second gas has a thermal conductivity that is less than the thermal conductivity of hydrogen so that the source gases deplete less as they pass through the reactor than they would if hydrogen is used as the sole carrier gas.
    • 公开了改进的化学气相沉积方法,其提高了碳化硅外延层的均匀性,并且对于获得较厚的外延层特别有用。 该方法包括将反应器加热到碳化硅源气体将在反应器中的基底上形成碳化硅外延层的温度; 然后引导源和载气流通过加热的反应器,以在衬底上形成碳化硅的外延层,其中载气包含氢和第二气体的共混物,其中第二气体的导热系数较小 比氢气的导热性好,这样当源气体通过反应器时,如果氢气用作唯一的载气,源气体就会消耗更少的气体。