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1. 发明授权

US06683373B1 Method of modifying connecting leads and thinning bases of encapsulated modular electronic components to obtain a high-density module, and a module obtained thereby 有权
标题翻译：修改封装的模块化电子部件的连接引线和变薄基底以获得高密度模块的方法，以及由此获得的模块
公开(公告)号：US06683373B1
公开(公告)日：2004-01-27
申请号：US10048582
申请日：2002-05-10
申请人： Olivier Vendier , Norbert Venet , Philippe Calvel , Stéphane Albinet , Jean-Cyril Esther , Marc Huan
发明人： Olivier Vendier , Norbert Venet , Philippe Calvel , Stéphane Albinet , Jean-Cyril Esther , Marc Huan
IPC分类号： H01L2302
CPC分类号： H01L21/56 , H01L25/105 , H01L2225/1029 , H01L2225/1064 , H01L2225/1094 , H01L2924/0002 , H01L2924/00
摘要： A method of obtaining a module (4), and the module obtained, from modular electronic components encapsulated in flat monoblock packages (1A) in which elements constituting the components are buried and from which project laterally conductive connecting leads (3A), the packages being stacked and buried in an insulative block corresponding to at least one module and the projecting connecting leads of the stacked packages being flush with a surface of the block, on at least one face of said block on which are formed conductive interconnection tracks and/or contacts for connecting the leads with connecting means external to the module. The method includes, before stacking the packages, an operation of modifying the connecting leads of the packages in order to reduce their overall size and an operation of reducing the height of the packages by thinning their respective bases.
摘要翻译：一种获得模块（4）的方法，以及从封装在其中构成元件的元件的单个扁平封装（1A）中的模块化电子元件获得的模块，并且从该突出部分突出出横向导电连接引线（3A），封装为堆叠并埋置在对应于至少一个模块的绝缘块中，并且所述堆叠封装的突出连接引线与所述块的表面齐平，在所述块的至少一个表面上形成有导电互连轨道和/或触点用于将引线与模块外部的连接装置连接。该方法包括在堆叠包装之前，修改包装的连接引线以减小其整体尺寸的操作以及通过使其各自的底部变薄来降低包装的高度的操作。

2. 发明授权

US06754405B2 Electronic assembly having high interconnection density 有权
标题翻译：具有高互连密度的电子组件
公开(公告)号：US06754405B2
公开(公告)日：2004-06-22
申请号：US09865720
申请日：2001-05-29
申请人： Olivier Vendier , Marc Huan , Sylvain Paineau
发明人： Olivier Vendier , Marc Huan , Sylvain Paineau
IPC分类号： G02B612
CPC分类号： H01L23/427 , G02B6/4214 , G02B6/43 , H01L2924/0002 , H01L2924/00
摘要： An electronic assembly comprising an electronic module provided with optical interconnection and heat removal means, the heat removal means comprising a soleplate dedicated to removing heat on which the module is mounted. The interconnection means is independent of the soleplate and preferably comprises a printed circuit and an optical fiber included in the printed circuit. The optical fiber has an end put accurately in register with an optical contact of the module by a BGA type mounting of the printed circuit on the module. A BGA type mounting consists in placing with precision firstly balls on the module and secondly areas on the circuit, and then in bringing the balls and areas face to face so that the balls center themselves automatically with the areas by capillarity.
摘要翻译：一种电子组件，包括具有光学互连和散热装置的电子模块，所述除热装置包括专用于去除所述模块所安装的热量的底板。互连装置独立于底板，并且优选地包括印刷电路和包括在印刷电路中的光纤。通过模块上的印刷电路的BGA型安装，光纤的端部准确地与模块的光学接触对准。 BGA型安装包括将模具上的第一球精准放置在电路上的第二个区域上，然后将球和区域面对面地放置，使得球自动地与毛细管区域对中。

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