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1. 发明授权

US06214468B1 Flame retardant epoxy resin composition for printed board, and prepreg and metal foil clad laminate using the same 有权
标题翻译：用于印刷板的阻燃环氧树脂组合物和使用其的预浸料和金属箔覆层压板
公开(公告)号：US06214468B1
公开(公告)日：2001-04-10
申请号：US09238734
申请日：1999-01-28
申请人： Nozomu Takano , Michitoshi Arata , Hikari Murai , Yoshiyuki Takeda
发明人： Nozomu Takano , Michitoshi Arata , Hikari Murai , Yoshiyuki Takeda
IPC分类号： B32B2738
CPC分类号： H05K1/0326 , C08G59/08 , C08L63/04 , Y10T428/31529 , C08L61/04
摘要： A flame retardant epoxy resin composition which can improve heat resistance and exhibit an excellent adhesion strength and insulation reliability when applied to a printed circuit board or to a multilayered interconnection laminate is provided, and a prepreg and a metal foil clad laminate using the same composition are manufactured. This flame retardant epoxy resin composition consists of: (a) an epoxy resin containing a glicidylether compound which is a condensate of bisphenol A or bisphenol F with formaldehyde; (b) a condensate of bisphenol A with formaldehyde; (c) haloganated bisphenol A as a flame retardant agent; and (d) a hardening accelerator, wherein the haloganated bisphenol A is contained in 45 weight % or less of a total solid resin weight. A metal foil clad laminate is provided using this composition as a varnish, impregnating the same into a base material to obtain the prepreg, laminating the prepreg, depositing a metal foil on one or both surfaces thereof, and heating under pressure.
摘要翻译：提供一种阻燃环氧树脂组合物，其可以提高耐热性并且当应用于印刷电路板或多层互连层压体时具有优异的粘合强度和绝缘可靠性，并且使用相同组成的预浸料坯和覆盖金属箔的层压板制造。该阻燃环氧树脂组合物由以下组成：（a）含有双酚A或双酚F与甲醛的缩合物的缩水甘油醚化合物的环氧树脂; （b）双酚A与甲醛的缩合物; （c）作为阻燃剂的卤化双酚A; 和（d）硬化促进剂，其中所述卤素双酚A的含量为总固体树脂重量的45重量％以下。使用该组合物作为清漆，将其浸渍到基材中以获得预浸料，层压预浸料，在其一个或两个表面上沉积金属箔，并在加压下进行加热来提供覆盖金属箔的层压板。

2. 发明授权

US06692792B2 Prepreg for printed wiring boards, resin varnish, resin composition, and laminate for printed wiring boards produced by using these substances 有权
标题翻译：用于印刷线路板的预浸料，树脂清漆，树脂组合物和使用这些物质制造的印刷线路板的层压材料
公开(公告)号：US06692792B2
公开(公告)日：2004-02-17
申请号：US10425623
申请日：2003-04-30
申请人： Nozomu Takano , Shigeo Sase , Tomio Fukuda , Michitoshi Arata
发明人： Nozomu Takano , Shigeo Sase , Tomio Fukuda , Michitoshi Arata
IPC分类号： B05D136
CPC分类号： B32B27/04 , C03C25/40 , C08J5/06 , C08J5/08 , C08J5/24 , H05K1/0353 , Y02P20/582 , Y10S428/901 , Y10T428/24917 , Y10T428/2962 , Y10T428/2995 , Y10T428/31612 , Y10T428/31663
摘要： Printed wiring boards improved in the drilling processability and insulation properties are produced either by treating the surfaces of base materials or inorganic fillers with silicone oligomers having specified structures, particularly, a three-dimensionally crosslinked silicone oligomer, or by using resin varnish prepared by compounding such a silicone oligomer with a resin varnish for impregnation of the base materials, or by dipping the inorganic fillers in a solution of such a silicone oligomer for surface treatment and then directly compounding resin materials with the solution.
摘要翻译：通过用具有特定结构的硅酮低聚物，特别是三维交联的有机硅低聚物或使用通过混合制备的树脂清漆来处理基材或无机填料的表面，可以生产印刷布线板，具有用于浸渍基材的树脂清漆的硅氧烷低聚物，或通过将无机填料浸渍在这种用于表面处理的硅氧烷低聚物的溶液中，然后将树脂材料与溶液直接混合。

3. 发明授权

US06329474B1 Epoxidized phenol-hydroxybenzaldehyde condensate, bisphenol-formaldehyde condensate and masked imidazole 失效
标题翻译：环氧苯酚 - 羟基苯甲醛缩合物，双酚 - 甲醛缩合物和掩蔽咪唑
公开(公告)号：US06329474B1
公开(公告)日：2001-12-11
申请号：US09541515
申请日：2000-04-03
申请人： Michitoshi Arata , Shigeo Sase , Nozomu Takano , Tomio Fukuda
发明人： Michitoshi Arata , Shigeo Sase , Nozomu Takano , Tomio Fukuda
IPC分类号： E32B2704
CPC分类号： H05K1/0373 , C08G59/3218 , C08G59/5073 , C08L61/06 , C08L61/12 , C08L63/00 , C08L63/04 , H01B3/40 , H01L23/145 , H01L2924/0002 , H05K1/0326 , H05K2201/012 , Y10T428/2915 , C08L2666/22 , C08L61/04 , H01L2924/00
摘要： An epoxy resin composition for printed wiring boards which comprises as the essential components (a) an epoxy resin obtained by epoxidizing a condensation product of a phenol with hydroxybenzaldehyde, (b) a condensation product of bisphenol A with formaldehyde, (c) a flame retardant, and (d) a curing accelerator, and a laminate for printed wiring boards which has a low hygroscopicity, a high heat resistance, good high-temperature characteristics, a high resistance against electrolytic corrosion, a high resistance against color change due to heating, and a high Tg.
摘要翻译：一种用于印刷线路板的环氧树脂组合物，其包含作为主要组分（a）通过苯酚与羟基苯甲醛的缩合产物环氧化获得的环氧树脂，（b）双酚A与甲醛的缩合产物，（c）阻燃剂，和（d）固化促进剂和印刷线路板的层压体，其具有低吸湿性，高耐热性，高温特性，高耐电腐蚀性，耐高温耐色变色性，和高Tg。

4. 发明授权

US06696155B1 Prepreg for printed wiring boards, resin varnish, resin composition and laminate for printed wiring boards produced by using these substances 失效
标题翻译：用于印刷线路板的预浸料，树脂清漆，树脂组合物和使用这些物质制造的印刷线路板的层压材料
公开(公告)号：US06696155B1
公开(公告)日：2004-02-24
申请号：US08981570
申请日：1997-12-23
申请人： Nozomu Takano , Shigeo Sase , Tomio Fukuda , Michitoshi Arata
发明人： Nozomu Takano , Shigeo Sase , Tomio Fukuda , Michitoshi Arata
IPC分类号： B32B900
CPC分类号： B32B27/04 , C03C25/40 , C08J5/06 , C08J5/08 , C08J5/24 , H05K1/0353 , Y02P20/582 , Y10S428/901 , Y10T428/24917 , Y10T428/2962 , Y10T428/2995 , Y10T428/31612 , Y10T428/31663
摘要： Printed wiring boards improved in the drilling processability and insulation properties are produced either by treating the surfaces of base materials or inorganic fillers with silicone oligomers having specified structures, particularly, a three-dimensionally crosslinked silicone oligomer, or by using resin varnish prepared by compounding such a silicone oligomer with a resin varnish for impregnation of the base materials, or by dipping the inorganic fillers in a solution of such a silicone oligomer for surface treatment and then directly compounding resin materials with the solution.
摘要翻译：通过用具有特定结构的硅酮低聚物，特别是三维交联的有机硅低聚物或使用通过混合制备的树脂清漆来处理基材或无机填料的表面，可以生产印刷布线板，具有用于浸渍基材的树脂清漆的硅氧烷低聚物，或通过将无机填料浸渍在这种用于表面处理的硅氧烷低聚物的溶液中，然后将树脂材料与溶液直接混合。

5. 发明授权

US06572968B2 Method of producing prepreg for printed wiring boards, glass fiber material treated with silicone oligomer, and laminate for printed wiring boards 有权
标题翻译：制造印刷电路板用预浸料的方法，用硅氧烷低聚物处理的玻璃纤维材料和印刷线路板用层压体
公开(公告)号：US06572968B2
公开(公告)日：2003-06-03
申请号：US09849219
申请日：2001-05-07
申请人： Nozomu Takano , Shigeo Sase , Tomio Fukuda , Michitoshi Arata
发明人： Nozomu Takano , Shigeo Sase , Tomio Fukuda , Michitoshi Arata
IPC分类号： B32B900
CPC分类号： B32B27/04 , C03C25/40 , C08J5/06 , C08J5/08 , C08J5/24 , H05K1/0353 , Y02P20/582 , Y10S428/901 , Y10T428/24917 , Y10T428/2962 , Y10T428/2995 , Y10T428/31612 , Y10T428/31663
摘要： Printed wiring boards improved in the drilling processability and insulation properties are produced either by treating the surfaces of base materials or inorganic fillers with silicone oligomers having specified structures, particularly, a three-dimensionally crosslinked silicone oligomer, or by using resin varnish prepared by compounding such a silicone oligomer with a resin varnish for impregnation of the base materials, or by dipping the inorganic fillers in a solution of such a silicone oligomer for surface treatment and then directly compounding resin materials with the solution.
摘要翻译：通过用具有特定结构的硅酮低聚物，特别是三维交联的有机硅低聚物或使用通过混合制备的树脂清漆来处理基材或无机填料的表面，可以生产印刷布线板，具有用于浸渍基材的树脂清漆的硅氧烷低聚物，或通过将无机填料浸渍在这种用于表面处理的硅氧烷低聚物的溶液中，然后将树脂材料与溶液直接混合。

6. 发明授权

US06558797B1 Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the same 失效
标题翻译：粘合剂涂覆的铜箔和覆铜层压板以及印刷电路板均采用相同的方法
公开(公告)号：US06558797B1
公开(公告)日：2003-05-06
申请号：US09869050
申请日：2001-06-22
申请人： Michitoshi Arata , Nozomu Takano , Kazuhito Kobayashi
发明人： Michitoshi Arata , Nozomu Takano , Kazuhito Kobayashi
IPC分类号： B32B2738
CPC分类号： H05K3/4655 , C08G59/621 , C08L61/04 , C08L2666/36 , C09J7/28 , C09J163/00 , C09J2463/00 , H05K3/386 , H05K3/4652 , H05K2201/0355 , H05K2201/0358 , H05K2203/124 , Y10S428/901 , Y10T428/24331 , Y10T428/31511 , Y10T428/31529 , Y10T428/31547
摘要： An adhesive-coated copper foil which comprises a copper foil and disposed on one side thereof a layer of an adhesive composition comprising (a) an epoxy resin, (b) a polyfunctional phenol, (c) a curing accelerator as an optional ingredient, and (d) a compound having a triazine ring or isocyanuric ring. The adhesive layer has low hygroscopicity, excellent heat resistance, and satisfactory adhesion to copper foils. By using the adhesive-coated copper foil, a copper-clad laminate and a printed circuit board both having excellent properties can be obtained.
摘要翻译：一种粘合剂涂覆的铜箔，其包括铜箔，并且在其一侧上设置一层粘合剂组合物，所述粘合剂组合物包含（a）环氧树脂，（b）多官能酚，（c）作为任选成分的固化促进剂和（d）具有三嗪环或异氰脲酸环的化合物。粘合剂层具有低吸湿性，优异的耐热性和对铜箔的令人满意的粘合性。通过使用粘合剂涂覆的铜箔，可以获得具有优异性能的覆铜层压板和印刷电路板。

7. 发明授权

US06462147B1 Epoxy resin compositions for printed circuit board and printed circuit board using the same 有权
标题翻译：用于印刷电路板的环氧树脂组合物和使用其的印刷电路板
公开(公告)号：US06462147B1
公开(公告)日：2002-10-08
申请号：US09274100
申请日：1999-03-23
申请人： Michitoshi Arata , Nozomu Takano , Tomio Fukuda , Kenichi Tomioka
发明人： Michitoshi Arata , Nozomu Takano , Tomio Fukuda , Kenichi Tomioka
IPC分类号： C08F28300
CPC分类号： H05K1/0326 , C08G59/4028 , C08G59/5086 , C08G59/621 , C08L63/00 , Y10S428/901 , Y10T428/31511 , Y10T428/31522 , C08L2666/16 , C08L2666/20
摘要： An epoxy resin composition for a printed circuit board includes an epoxy resin; a multi-functional phenol group; a hardening accelerator; and at least one of a compound having a triazine or isocyanurate ring, and a compound containing less than 60 weight percent nitrogen, but not containing a urea derivative. A printed circuit board comprising the epoxy resin composition has low water absorption, excellent heat endurance, and a good adhesion with copper foil.
摘要翻译：用于印刷电路板的环氧树脂组合物包括环氧树脂; 多功能酚基; 硬化促进剂; 和具有三嗪或异氰脲酸酯环的化合物和含有少于60重量％的氮但不含脲衍生物的化合物中的至少一种。包含该环氧树脂组合物的印刷电路板具有低吸水性，优异的耐热性和与铜箔的良好粘合性。

8. 发明授权

US06180250B2 Epoxy composition for printed circuit boards 失效
标题翻译：印刷电路板用环氧组合物
公开(公告)号：US06180250B2
公开(公告)日：2001-01-30
申请号：US08994967
申请日：1997-12-19
申请人： Michitoshi Arata , Shigeo Sase , Nozomu Takano , Tomio Fukuda
发明人： Michitoshi Arata , Shigeo Sase , Nozomu Takano , Tomio Fukuda
IPC分类号： B32B1504
CPC分类号： H05K1/0373 , B32B15/08 , C08G59/08 , C08G59/3218 , C08K5/0008 , C08L63/04 , H01L23/145 , H01L2924/0002 , H05K2201/012 , H05K2203/122 , Y10T428/31678 , C08L61/04 , H01L2924/00
摘要： To provide an epoxy resin composition for printed circuit boards which demonstrates little tendency to absorb moisture, high heat-resistance, favorable high temperature properties, resistance to metal migration, favorable anti-fade property at high temperatures, high Tg, high electric insulating performance and resistance against peeling of the copper foil when formed into a printed circuit board, there is provided epoxy resin composition for printed circuit boards, comprising: (a) epoxy resin obtained by glycidyl etherifying a condensation product of a phenol and hydroxybenzaldehyde; (b) a condensation product of bisphenol A and formaldehyde; (c) a flame retardant; (d) a curing agent; (e) one or both of a phenol antioxidant and an organic sulfur compound antioxidant; and (f) a urea derivative. This composition is highly suitable as a material for manufacturing epoxy resin prepreg in general and printed circuit boards.
摘要翻译：本发明提供一种印刷电路板用环氧树脂组合物，其耐湿性，耐热性，耐高温性，耐金属迁移性，耐高温下的抗褪色性，高Tg，高绝缘性，提供了形成印刷电路板时的铜箔的剥离性，提供了用于印刷电路板的环氧树脂组合物，其包含：（a）通过缩水甘油醚醚化苯酚和羟基苯甲醛的缩合产物得到的环氧树脂; （b）双酚A和甲醛的缩合产物; （c）阻燃剂; （d）固化剂; （e）苯酚抗氧化剂和有机硫化合物抗氧化剂中的一种或两种; 和（f）尿素衍生物。该组合物作为一般制造环氧树脂预浸料和印刷电路板的材料是非常适合的。

9. 发明授权

US07208539B2 Thermosetting resin composition, and prepreg and laminated board using the same 有权
标题翻译：热固性树脂组合物，以及使用其的预浸料和层压板
公开(公告)号：US07208539B2
公开(公告)日：2007-04-24
申请号：US10511102
申请日：2003-04-16
申请人： Shinji Tsuchikawa , Michitoshi Arata , Kenichi Tomioka , Kazuhito Kobayashi
发明人： Shinji Tsuchikawa , Michitoshi Arata , Kenichi Tomioka , Kazuhito Kobayashi
IPC分类号： B32B27/30 , B32B27/38 , C08L67/00 , C08L25/08 , C08L25/14 , C08L35/00 , C08L45/00
CPC分类号： H05K1/0373 , C08J5/24 , C08K5/5313 , H05K2203/121 , Y10S428/901 , Y10T428/31511 , Y10T428/31522 , Y10T428/31855 , C08L25/18
摘要： The present invention relates to a thermosetting resin composition comprising: (1) a metal salt of a disubstituted phosphinic acid, and (2) a resin having a dielectric constant of 2.9 or less at a frequency of 1 GHz or more, and a prepreg and a laminated board using the same.
摘要翻译：本发明涉及一种热固性树脂组合物，其包含：（1）二取代次膦酸的金属盐，和（2）在1GHz以上的频率下介电常数为2.9以下的树脂，以及预浸料使用其的层压板。

10. 发明申请

US20050234173A1 Thermosetting resin composition and prepreg and laminated sheet using the same 有权
标题翻译：热固性树脂组合物和使用其的预浸料和层压片材
公开(公告)号：US20050234173A1
公开(公告)日：2005-10-20
申请号：US10511102
申请日：2003-04-16
申请人： Shinji Tsuchikawa , Michitoshi Arata , Kenichi Tomioka , Kazuhito Kobayashi
发明人： Shinji Tsuchikawa , Michitoshi Arata , Kenichi Tomioka , Kazuhito Kobayashi
IPC分类号： C08J5/24 , C08K5/5313 , H05K1/03 , C08L1/00
CPC分类号： H05K1/0373 , C08J5/24 , C08K5/5313 , H05K2203/121 , Y10S428/901 , Y10T428/31511 , Y10T428/31522 , Y10T428/31855 , C08L25/18
摘要： The present invention relates to a thermosetting resin composition comprising: (1) a metal salt of a disubstituted phosphinic acid, and (2) a resin having a dielectric constant of 2.9 or less at a frequency of 1 GHz or more, and a prepreg and a laminated board using the same.
摘要翻译：本发明涉及一种热固性树脂组合物，其包含：（1）二取代次膦酸的金属盐，和（2）在1GHz以上的频率下介电常数为2.9以下的树脂，以及预浸料使用其的层压板。

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