专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08969490B2 Epoxy resin composition, resin sheet, prepreg, multilayer printed wiring board and semiconductor device 有权
标题翻译：环氧树脂组合物，树脂片，预浸料，多层印刷线路板和半导体器件
公开(公告)号：US08969490B2
公开(公告)日：2015-03-03
申请号：US12921401
申请日：2009-03-24
申请人： Noriyuki Ohigashi , Michio Kimura , Haruo Murakami
发明人： Noriyuki Ohigashi , Michio Kimura , Haruo Murakami
IPC分类号： B32B17/10 , B29C65/00 , C08F283/00 , H05K7/00 , H05K1/03 , C08G59/32 , C08G59/50 , C08J5/18 , C08J5/24 , C08L63/00 , C08L71/00 , C08K3/00 , C08K5/3445 , H05K3/46
CPC分类号： H05K1/0326 , C08G59/3218 , C08G59/5073 , C08G2650/56 , C08J5/18 , C08J5/24 , C08J2363/00 , C08K3/013 , C08K5/3445 , C08L63/00 , C08L71/00 , H05K3/4626 , Y10T156/10 , Y10T428/31525 , C08L2666/22
摘要： An object of the present invention is to provide an epoxy resin composition that provides, when used for an insulation layer of a multilayer printed wiring board, a multilayer printed wiring board which is excellent in plating adhesion, heat resistance and moisture resistance reliability and capable of forming fine wiring. Another object of the present invention is to provide a resin sheet, a prepreg, a method for producing a multilayer printed wiring board, a multilayer printed wiring board and a semiconductor device.These objects are achieved by an epoxy resin composition comprising (A) an epoxy resin, (B) a phenoxy resin having a specific bisphenol acetophenone structure and (C) a curing agent, wherein the content of the phenoxy resin (B) is 10 to 30% by weight of the total solid content of the resin composition.
摘要翻译：本发明的目的在于提供一种环氧树脂组合物，其用于多层印刷线路板的绝缘层时，具有优异的电镀粘附性，耐热性和耐湿可靠性的多层印刷线路板，并能够形成精细布线。本发明的另一个目的是提供一种树脂片，预浸料，多层印刷线路板的制造方法，多层印刷线路板和半导体器件。这些目的是通过包含（A）环氧树脂，（B）具有特定的双酚苯乙酮结构的苯氧基树脂和（C）固化剂）的环氧树脂组合物来实现的，其中苯氧基树脂（B）的含量为10〜 30重量％的树脂组合物的总固体含量。

2. 发明申请

US20110007489A1 EPOXY RESIN COMPOSITION, RESIN SHEET, PREPREG, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE 有权
标题翻译：环氧树脂组合物，树脂片，PREPREG，多层印刷线路板和半导体器件
公开(公告)号：US20110007489A1
公开(公告)日：2011-01-13
申请号：US12921401
申请日：2009-03-24
申请人： Noriyuki Ohigashi , Michio Kimura , Haruo Murakami
发明人： Noriyuki Ohigashi , Michio Kimura , Haruo Murakami
IPC分类号： H05K7/00 , C08L61/00 , C08L63/00 , C08K3/34 , C08K3/22 , B32B27/04 , H05K1/00
CPC分类号： H05K1/0326 , C08G59/3218 , C08G59/5073 , C08G2650/56 , C08J5/18 , C08J5/24 , C08J2363/00 , C08K3/013 , C08K5/3445 , C08L63/00 , C08L71/00 , H05K3/4626 , Y10T156/10 , Y10T428/31525 , C08L2666/22
摘要： An object of the present invention is to provide an epoxy resin composition that provides, when used for an insulation layer of a multilayer printed wiring board, a multilayer printed wiring board which is excellent in plating adhesion, heat resistance and moisture resistance reliability and capable of forming fine wiring. Another object of the present invention is to provide a resin sheet, a prepreg, a method for producing a multilayer printed wiring board, a multilayer printed wiring board and a semiconductor device.These objects are achieved by an epoxy resin composition comprising (A) an epoxy resin, (B) a phenoxy resin having a specific bisphenol acetophenone structure and (C) a curing agent, wherein the content of the phenoxy resin (B) is 10 to 30% by weight of the total solid content of the resin composition.
摘要翻译：本发明的目的在于提供一种环氧树脂组合物，其用于多层印刷线路板的绝缘层时，具有优异的电镀粘附性，耐热性和耐湿可靠性的多层印刷线路板，并能够形成精细布线。本发明的另一个目的是提供一种树脂片，预浸料，多层印刷线路板的制造方法，多层印刷线路板和半导体器件。这些目的是通过包含（A）环氧树脂，（B）具有特定的双酚苯乙酮结构的苯氧基树脂和（C）固化剂）的环氧树脂组合物来实现的，其中苯氧基树脂（B）的含量为10〜 30重量％的树脂组合物的总固体含量。

3. 发明申请

US20120111621A1 RESIN COMPOSITION, RESIN SHEET, PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：树脂组合物，树脂片，PREPREG，金属层压板，印刷线路板和半导体器件
公开(公告)号：US20120111621A1
公开(公告)日：2012-05-10
申请号：US13386135
申请日：2010-07-21
申请人： Noriyuki Ohigashi , Seiji Mori , Haruo Murakami , Akihiko Tobisawa , Hiroshi Obata , Takayoshi Masaki
发明人： Noriyuki Ohigashi , Seiji Mori , Haruo Murakami , Akihiko Tobisawa , Hiroshi Obata , Takayoshi Masaki
IPC分类号： H05K1/00 , C08L63/00 , C08K3/36 , B32B27/38 , B32B15/092 , B82Y30/00
CPC分类号： H05K1/0373 , B32B15/08 , B32B15/14 , B32B27/04 , C08K3/013 , C08K3/36 , H05K2201/0209 , H05K2201/0212 , H05K2201/0266 , Y10T428/25 , C08L63/00
摘要： An object of the present invention is to provide a resin composition having excellent impregnation property into a base material and capable of producing a prepreg, metal-clad laminate and printed wiring board excellent in properties such as low warpage, flame resistance, low thermal expansion properties, drill processability and desmear resistance. A first resin composition comprises an epoxy resin, an irregular-shaped first inorganic filler and a second inorganic filler having an average particle diameter of 10 to 100 nm which is different from that of the first inorganic filler. A second resin composition comprises an epoxy resin, silicone rubber particles having an average particle diameter of 1 μm to 10 μm, boehmite particles having an average particle diameter of 0.2 μm to 5 μm, and silica nanoparticles having an average particle diameter of 10 nm to 100 nm.
摘要翻译：本发明的目的在于提供一种在基材中具有优异的浸渍性能并且能够制备性能如低翘曲，阻燃性，低热膨胀性等优异的预浸料，覆金属层压板和印刷线路板的树脂组合物，钻孔加工性和耐去污性。第一树脂组合物包含环氧树脂，不规则形状的第一无机填料和平均粒径为10〜100nm的与第一无机填料不同的第二无机填料。第二树脂组合物包含环氧树脂，平均粒径为1μm〜10μm的硅橡胶粒子，平均粒径为0.2μm〜5μm的勃姆石粒子，平均粒径为10nm〜 100nm。

4. 发明申请

US20110014453A1 RESIN SHEET WITH COPPER FOIL, MULTILAYER PRINTED WIRING BOARD, METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE 失效
标题翻译：具有铜箔，多层印刷布线板的树脂片，制造多层印刷线路板和半导体器件的方法
公开(公告)号：US20110014453A1
公开(公告)日：2011-01-20
申请号：US12921567
申请日：2009-03-19
申请人： Noriyuki Ohigashi
发明人： Noriyuki Ohigashi
IPC分类号： B32B15/08 , B32B15/092 , H01L23/12 , H05K1/03 , B32B37/00
CPC分类号： H05K3/4655 , B32B3/266 , B32B5/022 , B32B5/024 , B32B5/147 , B32B7/06 , B32B7/12 , B32B15/14 , B32B15/20 , B32B2255/062 , B32B2255/205 , B32B2255/26 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2264/102 , B32B2307/30 , B32B2307/306 , B32B2307/50 , B32B2307/538 , B32B2307/734 , B32B2457/08 , H05K3/025 , H05K3/4652 , H05K2201/0358 , Y10T428/24917 , Y10T428/249921 , Y10T428/24994 , Y10T428/252 , Y10T428/265 , Y10T428/2839 , Y10T428/287
摘要： A resin sheet with a copper foil, comprising: a carrier layer; a copper foil layer having a thickness 0.5 to 5 μm provided over the carrier layer; and an insulating resin layer formed over the copper foil layer, wherein the insulating resin layer is once abutted with base material, and then the carrier layer is delaminated from the copper foil layer, and wherein the insulating resin layer contains a cyanate ester resin having phenolic novolac backbone and a polyfunctional epoxy resin.
摘要翻译：一种具有铜箔的树脂片，包括：载体层; 设置在载体层上的厚度为0.5〜5μm的铜箔层; 以及形成在铜箔层上的绝缘树脂层，其中绝缘树脂层一旦与基材接触，然后载体层从铜箔层分层，并且其中绝缘树脂层含有具有酚醛树脂的氰酸酯树脂酚醛清漆骨架和多官能环氧树脂。

5. 发明申请

US20100101843A1 INSULATING RESIN SHEET LAMINATE AND MULTI-LAYER PRINTED CIRCUIT BOARD INCLUDING INSULATING RESIN SHEET LAMINATE 失效
标题翻译：绝缘树脂层压板和多层印刷电路板，包括绝缘树脂片层压板
公开(公告)号：US20100101843A1
公开(公告)日：2010-04-29
申请号：US12523127
申请日：2008-01-16
申请人： Hiroaki Wakabayashi , Noriyuki Ohigashi
发明人： Hiroaki Wakabayashi , Noriyuki Ohigashi
IPC分类号： H05K1/00 , B32B15/08 , B32B27/30 , B32B27/38 , B32B17/06 , B32B27/36 , B32B15/04 , B32B5/00
CPC分类号： H05K3/4655 , C08F220/18 , C08L33/064 , H05K3/4652 , H05K2201/0358 , H05K2203/066 , Y10T428/12 , Y10T428/264 , Y10T428/31511 , Y10T428/31529 , Y10T428/31681 , Y10T428/31699 , Y10T428/31786 , Y10T428/31935
摘要： Disclosed is an insulating resin sheet laminate (an insulating resin sheet with a film or a metal foil) including an insulating resin layer with a uniform thickness that is formed without repulsion or unevenness in a process of forming the insulating resin layer on a film or a metal foil, and a multi-layer printed circuit board that includes the insulating resin sheet laminate and possesses high insulating reliability. The present invention provides an insulating resin sheet laminate (an insulating resin sheet with a film or a metal foil) obtained by forming an insulating resin layer made of a resin composition on a film or a metal foil, and the resin composition includes an acrylic surfactant.
摘要翻译：公开了一种绝缘树脂片层叠体（具有膜或金属箔的绝缘树脂片），其包括在膜上形成绝缘树脂层的过程中不产生排斥或不均匀的具有均匀厚度的绝缘树脂层金属箔和包含绝缘树脂片层叠体并具有高绝缘可靠性的多层印刷电路板。本发明提供一种通过在膜或金属箔上形成由树脂组合物制成的绝缘树脂层而获得的绝缘树脂片层叠体（具有膜或金属箔的绝缘树脂片），并且该树脂组合物包括丙烯酸类表面活性剂。

6. 发明授权

US08357859B2 Insulating resin sheet laminate and multi-layer printed circuit board including insulating resin sheet laminate 失效
标题翻译：绝缘树脂板层压板和包括绝缘树脂板层压板的多层印刷电路板
公开(公告)号：US08357859B2
公开(公告)日：2013-01-22
申请号：US12523127
申请日：2008-01-16
申请人： Hiroaki Wakabayashi , Noriyuki Ohigashi
发明人： Hiroaki Wakabayashi , Noriyuki Ohigashi
IPC分类号： H05K1/00
CPC分类号： H05K3/4655 , C08F220/18 , C08L33/064 , H05K3/4652 , H05K2201/0358 , H05K2203/066 , Y10T428/12 , Y10T428/264 , Y10T428/31511 , Y10T428/31529 , Y10T428/31681 , Y10T428/31699 , Y10T428/31786 , Y10T428/31935
摘要： Disclosed is an insulating resin sheet laminate (an insulating resin sheet with a film or a metal foil) including an insulating resin layer with a uniform thickness that is formed without repulsion or unevenness in a process of forming the insulating resin layer on a film or a metal foil, and a multi-layer printed circuit board that includes the insulating resin sheet laminate and possesses high insulating reliability. The present invention provides an insulating resin sheet laminate (an insulating resin sheet with a film or a metal foil) obtained by forming an insulating resin layer made of a resin composition on a film or a metal foil, and the resin composition includes an acrylic surfactant.
摘要翻译：公开了一种绝缘树脂片层叠体（具有膜或金属箔的绝缘树脂片），其包括在膜上形成绝缘树脂层的过程中不产生排斥或不均匀的具有均匀厚度的绝缘树脂层金属箔和包含绝缘树脂片层叠体并具有高绝缘可靠性的多层印刷电路板。本发明提供一种通过在膜或金属箔上形成由树脂组合物制成的绝缘树脂层而获得的绝缘树脂片层叠体（具有膜或金属箔的绝缘树脂片），并且该树脂组合物包括丙烯酸类表面活性剂。

7. 发明申请

US20130105200A1 PREPREG, WIRING BOARD, AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译： PREPREG，接线板和半导体器件
公开(公告)号：US20130105200A1
公开(公告)日：2013-05-02
申请号：US13807254
申请日：2011-06-29
申请人： Noriyuki Ohigashi , Tadasuke Endo
发明人： Noriyuki Ohigashi , Tadasuke Endo
IPC分类号： B32B19/02 , H05K1/02
CPC分类号： B32B19/02 , B32B17/04 , C08J5/24 , C08J2363/00 , H01L2224/16227 , H05K1/02 , H05K1/0366 , H05K3/4602 , H05K3/4655 , H05K2201/0129 , H05K2201/0195 , H05K2201/0209 , H05K2201/029 , H05K2201/0358 , Y10T428/24355 , Y10T428/2495 , Y10T428/252
摘要： An object of the invention is to provide a prepreg which can be thinner, and has both surfaces which have different application, function, performance or properties to each other, one of which has excellent adhesion to the conductive layer, and the conductive layer which is in contact with the one surface of the prepreg can form a fine circuit, and the present invention provides a prepreg including a core layer containing a fibrous base, a first resin layer which is formed on one surface of the core layer, a second layer which is formed on the other surface of the core layer, and a carrier film which is selected from the group consisting of a metal foil and a resin film and which is laminated on at least one of the surfaces of the first resin layer and the second resin layer, wherein the first resin layer contains a first epoxy resin composition containing silica nanoparticles having an average particle diameter of 1 to 100 nm; a thermoplastic resin selected from the group consisting of a polyimide resin, a polyamide resin, a phenoxy resin, a polyphenylene oxide resin, and a polyether sulfone resin; and an epoxy resin, and the first resin layer is in contact with the fibrous base or a part of the first resin layer is infiltrated into the fibrous base; the second resin layer contains a second epoxy resin composition containing an inorganic filler, and an epoxy resin, and a part of the second resin layer is infiltrated into the fibrous base.
摘要翻译：本发明的目的是提供一种可以更薄的预浸料，并且具有彼此具有不同应用，功能，性能或性质的两个表面，其中一个对导电层具有优异的粘附性，导电层是与预浸料坯的一个表面接触可以形成微细电路，本发明提供一种预浸料坯，其包括含有纤维基材的芯层，形成在芯层的一个表面上的第一树脂层，第二层，形成在芯层的另一个表面上，并且载体膜选自金属箔和树脂膜，并且层压在第一树脂层和第二树脂的至少一个表面上层，其中所述第一树脂层含有含有平均粒径为1〜100nm的二氧化硅纳米粒子的第一环氧树脂组合物; 选自聚酰亚胺树脂，聚酰胺树脂，苯氧基树脂，聚苯醚树脂和聚醚砜树脂的热塑性树脂; 和环氧树脂，所述第一树脂层与所述纤维基部接触，或者所述第一树脂层的一部分渗透到所述纤维基材中; 第二树脂层含有含有无机填料的第二环氧树脂组合物和环氧树脂，第二树脂层的一部分渗透到纤维基材中。

8. 发明授权

US08318292B2 Resin sheet with copper foil, multilayer printed wiring board, method for manufacturing multilayer printed wiring board and semiconductor device 失效
标题翻译：具有铜箔的树脂片，多层印刷线路板，多层印刷线路板和半导体器件的制造方法
公开(公告)号：US08318292B2
公开(公告)日：2012-11-27
申请号：US12921567
申请日：2009-03-19
申请人： Noriyuki Ohigashi
发明人： Noriyuki Ohigashi
IPC分类号： B32B3/00
CPC分类号： H05K3/4655 , B32B3/266 , B32B5/022 , B32B5/024 , B32B5/147 , B32B7/06 , B32B7/12 , B32B15/14 , B32B15/20 , B32B2255/062 , B32B2255/205 , B32B2255/26 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2264/102 , B32B2307/30 , B32B2307/306 , B32B2307/50 , B32B2307/538 , B32B2307/734 , B32B2457/08 , H05K3/025 , H05K3/4652 , H05K2201/0358 , Y10T428/24917 , Y10T428/249921 , Y10T428/24994 , Y10T428/252 , Y10T428/265 , Y10T428/2839 , Y10T428/287
摘要： A resin sheet with a copper foil, comprising: a carrier layer; a copper foil layer having a thickness 0.5 to 5 μm provided over the carrier layer; and an insulating resin layer formed over the copper foil layer, wherein the insulating resin layer is once abutted with base material, and then the carrier layer is delaminated from the copper foil layer, and wherein the insulating resin layer contains a cyanate ester resin having phenolic novolac backbone and a polyfunctional epoxy resin.
摘要翻译：一种具有铜箔的树脂片，包括：载体层; 设置在载体层上的厚度为0.5〜5μm的铜箔层; 以及形成在铜箔层上的绝缘树脂层，其中绝缘树脂层一旦与基材接触，然后载体层从铜箔层分层，并且其中绝缘树脂层含有具有酚醛树脂的氰酸酯树脂酚醛清漆骨架和多官能环氧树脂。

9. 发明申请

US20110308848A1 RESIN COMPOSITION FOR WIRING BOARD, RESIN SHEET FOR WIRING BOARD, COMPOSITE BODY, METHOD FOR PRODUCING COMPOSITE BODY, AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：接线板用树脂组合物，导线板用树脂片，复合体，生产复合体的方法及半导体器件
公开(公告)号：US20110308848A1
公开(公告)日：2011-12-22
申请号：US13148774
申请日：2010-02-08
申请人： Yuka Ito , Kenichi Kaneda , Yasuaki Mitsui , Iji Onozuka , Noriyuki Ohigashi , Hideki Hara
发明人： Yuka Ito , Kenichi Kaneda , Yasuaki Mitsui , Iji Onozuka , Noriyuki Ohigashi , Hideki Hara
IPC分类号： H05K1/18 , H05K3/00 , B32B3/00
CPC分类号： H05K3/045 , H05K3/107 , H05K3/281 , H05K3/421 , H05K3/465 , H05K2201/0209 , H05K2201/09509 , H05K2201/09563 , Y10T29/49124 , Y10T428/24355
摘要： Disclosed are a composite body, a method for producing the composite body and a semiconductor device, the composite body comprising a resin layer and a fine wiring and/or via hole being formed in the resin layer, having high adhesion and high reliability, and being capable of high frequencies. Also disclosed are a resin composition and a resin sheet, both of which can provide such a composite body.The composite body comprises a resin layer and an electroconductive layer, wherein a groove having a maximum width of 1 μm or more and 10 μm or less is on a surface of the resin layer; the electroconductive layer is inside the groove; and a surface of the resin layer being in contact with the electroconductive layer has an arithmetic average roughness (Ra) of 0.05 μm or more and 0.45 μm or less, and/or wherein the resin layer has a via hole having a diameter of 1 μm or more and 25 μm or less; the electroconductive layer is inside the via hole; and a surface of the resin layer of the inside of the via hole has an arithmetic average roughness (Ra) of 0.05 μm or more and 0.45 μm or less. The resin composition comprises an inorganic filler and a thermosetting resin, wherein the inorganic filler contains coarse particles having a diameter of more than 2 μm in an amount of 500 ppm or less. The resin sheet comprises a resin layer and a substrate, wherein the resin layer is on the substrate and comprises the resin composition.
摘要翻译：公开了一种复合体，该复合体的制造方法以及半导体装置，该复合体包括树脂层和在该树脂层中形成的精细布线和/或通孔，具有高粘合性和高可靠性，并且能够高频率。还公开了树脂组合物和树脂片，两者都可以提供这种复合体。复合体包括树脂层和导电层，其中在树脂层的表面上具有最大宽度为1μm以上且10μm以下的槽; 导电层在槽内; 并且与导电层接触的树脂层的表面的算术平均粗糙度（Ra）为0.05μm以上且0.45μm以下，和/或其中树脂层具有直径为1μm的通孔以上且25μm以下; 导电层在通孔内; 通孔内侧的树脂层的表面的算术平均粗糙度（Ra）为0.05μm以上且0.45μm以下。树脂组合物包含无机填料和热固性树脂，其中无机填料含有直径大于2μm的粗颗粒的量在500ppm以下。树脂片包括树脂层和基材，其中树脂层在基材上并包含树脂组合物。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式