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1. 发明授权

US5769985A Method of manufacturing a monolithic ceramic electronic device 失效
公开(公告)号：US5769985A
公开(公告)日：1998-06-23
申请号：US617177
申请日：1996-03-18
申请人： Hiroyuki Kawakami , Yoshiaki Kohno , Noriyuki Kubodera
发明人： Hiroyuki Kawakami , Yoshiaki Kohno , Noriyuki Kubodera
IPC分类号： H01G4/30 , H01L21/48 , H05K1/03 , H05K3/10 , H05K3/20 , H05K3/46 , B32B31/26
CPC分类号： H01G4/308 , H01L21/4857 , H05K3/108 , H05K3/205 , H05K1/0306 , H05K2203/0156 , H05K2203/0315 , H05K2203/1142 , H05K3/4611 , H05K3/4629 , Y10T29/49163
摘要： A method of manufacturing a monolithic ceramic electronic device includes the following steps: forming a first metal film on a PET film; forming a multilayered metal film by forming a second metal film on a part of the first metal film, the second metal film being thicker than the first metal film; forming a monolithic ceramic structure including the multilayered metal film; forming the first metal film, which is partially overlain by the second metal film in the monolithic ceramic structure, into an insulating structure in such a manner that metal components forming the first metal film are diffused into the ceramics; and firing the ceramics. Disclosed also is a monolithic ceramic electronic device manufactured by the method. As a result, a stepped portion between a portion in which the internal electrodes overlap one another and a portion in which the internal electrodes do not overlap can be prevented from being formed, and delamination can effectively be prevented, whereby a monolithic ceramic electronic device exhibiting stable characteristics and a method for manufacturing the monolithic ceramic electronic device can be obtained.

2. 发明授权

US5046236A Method of fabricating ceramic electronic component of multilayered type 失效
标题翻译：制造多层陶瓷电子元件的方法
公开(公告)号：US5046236A
公开(公告)日：1991-09-10
申请号：US595392
申请日：1990-10-10
申请人： Nobuyuki Wada , Yoshiaki Kohno , Noriyuki Kubodera
发明人： Nobuyuki Wada , Yoshiaki Kohno , Noriyuki Kubodera
IPC分类号： H01G4/12 , H01C7/102 , H01G4/005 , H01G4/30
CPC分类号： H01G4/005 , H01C7/102 , H01G4/30 , H01G4/308 , Y10T29/435 , Y10T29/49002 , Y10T29/49082
摘要： A method of fabricating an electronic component of multilayered type comprising the steps of sequentially forming and laminating a plurality of metal films respectively having different metal compositions for constituting the alloy composition of an inner electrode by the thin film forming process to obtain a laminated metal film, laminating a plurality of ceramic green sheets through laminated metal films such that the laminated metal film is arranged between the ceramic green sheets, sintering a laminated body thus obtained and alloying the laminated metal films to form a plurality of inner electrodes each composed of an alloy.
摘要翻译：一种制造多层型电子元件的方法，包括以下步骤：通过薄膜形成工艺顺序地形成和层压分别具有不同金属组成的金属膜，以构成内部电极的合金组成，以获得层压金属膜，通过层叠的金属膜层叠多个陶瓷生片，使得层叠的金属膜布置在陶瓷生片之间，烧结如此获得的层叠体并使层压的金属膜合金化，形成多个由合金构成的内电极。

3. 发明授权

US06255932B1 Electronic component having built-in inductor 失效
公开(公告)号：US06255932B1
公开(公告)日：2001-07-03
申请号：US08410052
申请日：1995-03-24
申请人： Noriyuki Kubodera , Yoshiaki Kohno
发明人： Noriyuki Kubodera , Yoshiaki Kohno
IPC分类号： H01F500
CPC分类号： H01F17/0006 , H01F41/046 , H01F41/16 , H01F2017/0066
摘要： A ceramic multilayer substrate (13) having a built-in inductance includes a conductor (15) which is arranged in a substrate consisting of a sintered body (14), and ferromagnetic metal films (6A, 6B) consisting of Ni which are arranged on both sides of the conductor (15).

4. 发明授权

US5985068A Method of manufacturing a monolithic ceramic electronic device 失效
标题翻译：单片陶瓷电子器件的制造方法
公开(公告)号：US5985068A
公开(公告)日：1999-11-16
申请号：US807437
申请日：1997-02-28
申请人： Hiroyuki Kawakami , Yoshiaki Kohno , Noriyuki Kubodera
发明人： Hiroyuki Kawakami , Yoshiaki Kohno , Noriyuki Kubodera
IPC分类号： H01G4/30 , H01L21/48 , H05K1/03 , H05K3/10 , H05K3/20 , H05K3/46 , B32B31/26
CPC分类号： H01G4/308 , H01L21/4857 , H05K3/108 , H05K3/205 , H05K1/0306 , H05K2203/0156 , H05K2203/0315 , H05K2203/1142 , H05K3/4611 , H05K3/4629 , Y10T29/49163
摘要： A method of manufacturing a monolithic ceramic electronic device includes the following steps: forming a first metal film on a PET film; forming a multilayered metal film by forming a second metal film on a part of the first metal film, the second metal film being thicker than the first metal film; forming a monolithic ceramic structure including the multilayered metal film; forming the first metal film, which is partially overlain by the second metal film in the monolithic ceramic structure, into an insulating structure in such a manner that metal components forming the first metal film are diffused into the ceramics; and firing the ceramics. Disclosed also is a monolithic ceramic electronic device manufactured by the method. As a result, a stepped portion between a portion in which the internal electrodes overlap one another and a portion in which the internal electrodes do not overlap can be prevented from being formed, and delamination can effectively be prevented, whereby a monolithic ceramic electronic device exhibiting stable characteristics and a method for manufacturing the monolithic ceramic electronic device can be obtained.
摘要翻译：一种制造单片陶瓷电子器件的方法包括以下步骤：在PET膜上形成第一金属膜; 通过在所述第一金属膜的一部分上形成第二金属膜来形成多层金属膜，所述第二金属膜比所述第一金属膜厚; 形成包括所述多层金属膜的整体式陶瓷结构体; 将形成第一金属膜的金属成分扩散到陶瓷中的形成第一金属膜，该第一金属膜部分地被整块陶瓷结构体中的第二金属膜覆盖，形成绝缘结构; 并烧制陶瓷。还公开了通过该方法制造的单片陶瓷电子器件。结果，可以防止形成内部电极彼此重叠的部分和内部电极不重叠的部分之间的阶梯部分，并且可以有效地防止分层，从而形成具有可以获得稳定的特性和制造单片陶瓷电子器件的方法。

5. 发明授权

US06910473B1 Method of cutting ceramic green block 失效
标题翻译：切割陶瓷绿块的方法
公开(公告)号：US06910473B1
公开(公告)日：2005-06-28
申请号：US09348713
申请日：1999-06-30
申请人： Noriyuki Kubodera , Yasuto Inagaki
发明人： Noriyuki Kubodera , Yasuto Inagaki
IPC分类号： B28D5/02 , B32B37/00 , B28D1/02
CPC分类号： C04B35/63404 , B28D5/022 , B32B37/0046 , C04B35/63 , C04B35/632 , C04B35/634 , C04B2235/963
摘要： In order to enable cutting of a soft ceramic green block by a dicing saw having excellent cutting accuracy, heat treatment is performed on the ceramic green block to dissociate a plasticizer, thereby improving hardness of the ceramic green block. Then the ceramic green block is cut by the dicing saw.
摘要翻译：为了能够通过具有优良切割精度的切割锯切割软质陶瓷坯块，对陶瓷生坯块进行热处理以使增塑剂解离，从而提高陶瓷生坯块的硬度。然后陶瓷绿色块被切割锯切割。

6. 发明授权

US5700338A Method of manufacturing resistor integrated in sintered body and method of manufacturing multilayer ceramic electronic component 失效
标题翻译：制造集成在烧结体中的电阻的方法和制造多层陶瓷电子部件的方法
公开(公告)号：US5700338A
公开(公告)日：1997-12-23
申请号：US490089
申请日：1995-06-13
申请人： Noriyuki Kubodera , Yoshiaki Kouno
发明人： Noriyuki Kubodera , Yoshiaki Kouno
IPC分类号： C04B41/88 , H01C17/06 , H01C17/075 , H01C17/30 , H05K1/16 , B32B31/26 , B32B31/12 , H05K3/20
CPC分类号： H01C17/075 , Y10T29/49163
摘要： A method of manufacturing a resistor integrated in a sintered body, by patterning a plurality of metal thin films which are formed by a thin film forming method, thereafter transferring the patterned metal thin films onto a ceramic green sheet (11), stacking another ceramic green sheet and/or a ceramic green sheet stacked with another metal thin film thereon for obtaining a laminate, and firing the resulting laminate, thereby forming a resistor integrated in a sintered body which is structured by by alloying the plurality of metal thin films in a ceramic sintered body.
摘要翻译：通过对通过薄膜形成方法形成的多个金属薄膜进行构图来制造集成在烧结体中的电阻器的方法，然后将图案化的金属薄膜转移到陶瓷生片（11）上，将另一陶瓷绿片材和/或与其上的另一金属薄膜层叠的陶瓷生片，以获得层压体，并烧制所得的层压体，从而形成集成在烧结体中的电阻器，该烧结体通过将多个金属薄膜合金化在陶瓷烧结体。

7. 发明授权

US06526958B1 Method of cutting ceramic green block 失效
标题翻译：切割陶瓷绿块的方法
公开(公告)号：US06526958B1
公开(公告)日：2003-03-04
申请号：US08625008
申请日：1996-03-29
申请人： Noriyuki Kubodera , Yasuto Inagaki
发明人： Noriyuki Kubodera , Yasuto Inagaki
IPC分类号： B28D102
CPC分类号： B28D5/022 , B32B37/0046 , B32B38/0004 , C04B35/6264 , C04B35/63 , C04B35/632 , C04B35/634 , C04B35/63404 , C04B2235/3215 , C04B2235/3236 , C04B2235/963
摘要： In order to enable the cutting of a soft ceramic green block by a dicing saw with excellent cutting accuracy and at high speed, heat treatment is performed on the ceramic green block to dissociate a plasticizer, thereby improving the hardness of the ceramic green block. Thereafter the ceramic green block is cut by the dicing saw.
摘要翻译：为了能够通过切割精度高的切割锯切割软质陶瓷坯块，对陶瓷生坯块进行热处理以使增塑剂解离，从而提高陶瓷块的硬度。此后，陶瓷绿色块被切割锯切割。

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