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1. 发明授权

US4817708A Ventilating unit for drawing and exhausting air 失效
标题翻译：用于抽吸和排出空气的通风单元
公开(公告)号：US4817708A
公开(公告)日：1989-04-04
申请号：US166840
申请日：1988-02-25
申请人： Nobuyuki Ono , Toshikazu Ogata
发明人： Nobuyuki Ono , Toshikazu Ogata
IPC分类号： F24F7/013 , F24F12/00 , F24H3/02
CPC分类号： F24F7/013 , F24F12/006 , Y02B30/563
摘要： A ventilator has a body in which an air-intake passage for introducing outdoor-air indoors and an air-discharge passage for introducing indoor-air outdoors are defined. An air-intake fan and an air-discharge fan are arranged in the passages, respectively. A filter is provided in the air-intake passage to filtrate air flowing through the air-intake passage. The flow resistance in the air-discharge passage is set higher than that in the air-intake passage.
摘要翻译：通风机具有：室内引入室外空气的进气通道和室外引入室内空气排出通道的主体。通道中分别设有进风扇和排风扇。在进气通道中设置过滤器，以滤出通过进气通道的空气。空气排出通道中的流动阻力设定得高于进气通道中的流动阻力。

2. 发明授权

US5068156A Semiconductor package 失效
标题翻译：半导体封装
公开(公告)号：US5068156A
公开(公告)日：1991-11-26
申请号：US584092
申请日：1990-09-18
申请人： Toshikazu Ogata
发明人： Toshikazu Ogata
IPC分类号： H01L23/40 , H01L23/373 , H01L23/492
CPC分类号： H01L23/4924 , H01L23/3735 , H01L2924/0002 , Y10T428/12528 , Y10T428/12535 , Y10T428/12611
摘要： A semiconductor package in which a ceramic substrate is joined to a copper stud by brazing. Between the substrate and the stud, first and second members are each fixed in place with a brazing material. The first member has a thermal expansion coefficient intermediate those of the copper stud and the ceramic substrate for reducing the thermal stress generated in the ceramic substrate. The second member prevents the ceramic substrate from being deformed by thermal stress. If the first member is, e.g., a Cu-W alloy used as the neck on the copper stud, it is possible to reduce the compressive stress generated in the ceramic substrate during cooling after the brazing. Further, the influence on the substrate by bimetallic deformation as a result of the combination of the copper stud and the Cu-W alloy is mitigated by a flexible second member, e.g., a copper foil. Thus, the ceramic substrate is brazed without involving any substantial stress thereon.
摘要翻译：一种半导体封装，其中通过钎焊将陶瓷基板连接到铜螺柱。在基板和螺柱之间，第一和第二构件各自用钎焊材料固定就位。第一部件具有与铜螺柱和陶瓷基板的热膨胀系数相等的热膨胀系数，用于降低在陶瓷基板中产生的热应力。第二部件防止陶瓷基体由于热应力而变形。如果第一构件是例如在铜螺柱上用作颈部的Cu-W合金，则可以减少在钎焊之后的冷却期间在陶瓷衬底中产生的压应力。此外，通过铜柱和Cu-W合金的组合的结合，双金属变形对基板的影响通过诸如铜箔的柔性第二构件来减轻。因此，陶瓷衬底被钎焊而不会对其施加任何显着的应力。

3. 发明授权

US5055911A Semiconductor device package utilizing a solder flow prevention wall 失效
标题翻译：半导体器件封装采用防流焊壁
公开(公告)号：US5055911A
公开(公告)日：1991-10-08
申请号：US558467
申请日：1990-07-27
申请人： Toshikazu Ogata
发明人： Toshikazu Ogata
IPC分类号： H01L21/52 , H01L21/60 , H01L23/057 , H01L23/498
CPC分类号： H01L24/85 , H01L23/057 , H01L23/49805 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/056 , H01L2224/26175 , H01L2224/291 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48175 , H01L2224/48227 , H01L2224/48237 , H01L2224/48472 , H01L2224/49109 , H01L2224/49175 , H01L2224/73265 , H01L2224/81801 , H01L2224/8319 , H01L2224/83801 , H01L2224/85444 , H01L24/45 , H01L2924/00014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/15153 , H01L2924/1517 , H01L2924/19107 , H01L2924/351
摘要： A semiconductor package includes a base body, metallized layers formed on the base body and having a die-pad area and a wire bonding area, a solder flow prevention wall which is formed on the metallized layers between the die-pad area and a wire bonding area preventing solder from flowing to the wire bonding area while a semiconductor chip is being soldered to the die-pad area.
摘要翻译：半导体封装包括基体，形成在基体上的金属化层，具有管芯焊盘区域和引线接合区域，焊料防止壁，形成在金属化层之间的焊盘区域和引线接合之间在将半导体芯片焊接到芯片焊盘区域的同时防止焊料流入引线接合区域。

4. 发明授权

US4953784A Ventilator drive system 失效
标题翻译：呼吸机驱动系统
公开(公告)号：US4953784A
公开(公告)日：1990-09-04
申请号：US334819
申请日：1989-04-10
申请人： Hitoshi Yasufuku , Toshikazu Ogata
发明人： Hitoshi Yasufuku , Toshikazu Ogata
IPC分类号： F24F7/007 , F24F11/00 , G05D22/02
CPC分类号： G05D22/02 , F24F11/0001 , F24F11/0015
摘要： A ventilator drive system includes a fan for exhausting an indoor air to the outdoors and introducing an outdoor air to an indoor side, an electric motor for driving the fan, a humidity sensor having a humidity sensing element which abuts against an indoor side surface of a room wall as close as possible or which is located so that heat is transferred from the room wall, and a control circuit for comparing a signal from the humidity sensor with a reference signal. The motor is energized when the relative humidity is increased to a reference level or above.
摘要翻译：一种呼吸机驱动系统，包括用于将室内空气排放到室外并将室外空气引入室内的风扇，用于驱动风扇的电动机，具有湿度感测元件的湿度传感器，该湿度传感元件抵接在室内侧面房间壁尽可能靠近或位于使得热量从房间壁传递;以及控制电路，用于将来自湿度传感器的信号与参考信号进行比较。当相对湿度增加到参考水平或以上时，电机通电。

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