会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Shielding for multicore shielded wire
    • 屏蔽多芯屏蔽线
    • US06674007B2
    • 2004-01-06
    • US10128355
    • 2002-04-24
    • Tetsuro IdeAkira MitaNobuyuki Asakura
    • Tetsuro IdeAkira MitaNobuyuki Asakura
    • H01R400
    • H01B7/0861H01B11/1091H01B13/22
    • A plurality of shielded core wires has a first diameter. A conductive cover member covers the shielded core wires. A first insulating sheath covers the conductive cover member. A pair of resin members, each formed with a groove having a semi-ellipsoidal shape are thermally integrated with each other for forming an ellipsoidal through hole while accommodating the first insulating sheath therein. A major axis length of a cross section of the ellipsoidal through hole is substantially identical with a length obtained by adding each first diameter, twice a thickness of the conductive cover member and twice a thickness of the first insulating sheath. A minor axis length of a cross section of the ellipsoidal through hole is substantially identical with by adding the first diameter, twice the thickness of the conductive cover member and twice the thickness of the first insulating sheath.
    • 多根屏蔽芯线具有第一直径。 导电盖构件覆盖屏蔽芯线。 第一绝缘护套覆盖导电盖构件。 每个形成有具有半椭圆形状的凹槽的树脂构件彼此热结合,以形成椭圆通孔,同时容纳第一绝缘护套。 椭圆形通孔的横截面的长轴长度与通过将每个第一直径相加的长度与导电盖构件的厚度的两倍和第二绝缘护套的厚度的两倍大致相同。 椭圆形通孔的横截面的短轴长度通过增加第一直径,导电盖构件的厚度的两倍和第一绝缘护套的厚度的两倍而基本相同。
    • 2. 发明授权
    • Covered wire connection method and structure
    • 覆盖线连接方法和结构
    • US5925202A
    • 1999-07-20
    • US867420
    • 1997-06-02
    • Tetsuro IdeNobuyuki Asakura
    • Tetsuro IdeNobuyuki Asakura
    • H01R43/00H01R4/02H01R4/70H01R43/02B32B31/16
    • H01R4/70H01R43/0207H01R43/0228
    • Two covered wires are conductively connected to each other by overlapping with each other at connection portions. The overlapped connection portions are pinched by a pair of resin chips. By melting cover portions and pressing resin chips from outside, the conductive wire portions of the covered wires are conductively contacted with each other at the connection portions. The pair of the resin chips are melt-fixed to each other to seal the connection portions. A crossing angle .theta. of the two covered wires at the connection portion is set to no less than 45.degree. and greater than 135.degree.. Thus, the covered wires can be conductively connected with each other inexpensively and easily. Further, a connecting state having an excellent electrical characteristic can be obtained stably.
    • 两条被覆线通过在连接部分彼此重叠而彼此导电连接。 重叠的连接部分被一对树脂芯片夹住。 通过熔化覆盖部分并从外部挤压树脂芯片,被覆线的导线部分在连接部分处彼此导电接触。 一对树脂片彼此熔融固定以密封连接部。 连接部分处的两根​​被覆线的交叉角θ设定为45度以上且135度以上。 因此,可以廉价且容易地将被覆线彼此导电连接。 此外,可以稳定地获得具有优异电特性的连接状态。
    • 4. 发明授权
    • Connection structure of a covered wire with resin encapsulation
    • 带树脂封装的包线的连接结构
    • US6004170A
    • 1999-12-21
    • US956941
    • 1997-10-23
    • Tetsuo KatoNobuyuki AsakuraAkira ShinchiTetsuro Ide
    • Tetsuo KatoNobuyuki AsakuraAkira ShinchiTetsuro Ide
    • H01R4/02H01R4/70H01R13/52H01R43/02
    • H01R4/021H01R13/5216H01R4/023H01R4/70H01R43/0207Y10T29/49201
    • A covered wire connection structure is formed by the steps of: pinching a covered wire with a pair of resin chips; pressing and exciting a cover portion of the wire by ultrasonic vibration so as to conductively connect conductive portions of both the covered wires at the connection portion; and melting a pair of the resin chips so as to seal the connection portion. The resin chip comprises main melting portions for pinching the connection portion which are melted to a mating resin chip so as to seal the connection portion, and auxiliary melting portions which are formed of material compatible with the cover portion of the covered wire introduced from the main melting portions and pinch the cover portion such that they are melted to the mating resin chip. The auxiliary melting portions and cover portion of the covered wire are melted together and integrated so as to seal an introductive portion of the covered wire from the resin chips. As a result, a reliability in connecting the covered wires by ultrasonic vibration is maintained and waterproofness in the connection portion is improved.
    • 包覆线连接结构通过以下步骤形成:用一对树脂芯片夹住包线; 通过超声波振动来挤压和激发线的覆盖部分,以便在连接部分处导电地连接两根被覆线的导电部分; 并熔化一对树脂芯片以密封连接部分。 树脂芯片包括用于夹持连接部分的主熔化部分,其熔化到配合树脂芯片上以便密封连接部分,以及辅助熔化部分,其由与从主体引入的包线的盖部分相容的材料形成 熔化部分并夹住盖部分使得它们熔化到配合树脂芯片。 包线的辅助熔化部分和覆盖部分熔化在一起并整合在一起,以将包线的引入部分与树脂片密封起来。 结果,保持了通过超声波振动连接被覆线的可靠性,并且提高了连接部分的防水性。
    • 5. 发明授权
    • Covered wire connection structure
    • 包线连接结构
    • US5922993A
    • 1999-07-13
    • US867845
    • 1997-06-03
    • Tetsuro IdeNobuyuki Asakura
    • Tetsuro IdeNobuyuki Asakura
    • H01R4/24H01R4/26H01R43/02H01R4/00
    • H01R43/0228H01R43/0207
    • Two covered wires conductively connected with each other are overlapped with each other at connection portions. The overlapped connection portions are pinched by a pair of resin chips. Cover portions are melted and pressurized from the outside of resin chips capable of obtaining a sealing condition and providing an excellent melting operation efficiency so as to connect conductive wire portions conductively at the connection portions. Then, the pair of the resin chips are melted together to seal the connection portions. In introducing end portions in which a covered wire is introduced out of the resin chips, between a melting surface relative to a mating resin chip and an outer peripheral surface, a round corner having a curvature continuously changing smoothly is provided. Thus, it is possible to obtain a sealing condition securely and an excellent melting operation efficiency.
    • 导电连接的两根被覆线彼此在连接部分处重叠。 重叠的连接部分被一对树脂芯片夹住。 覆盖部分从能够获得密封条件的树脂片的外部熔化和加压,并且提供优异的熔化操作效率,以便在连接部分处导电地连接导线部分。 然后,一对树脂片熔融在一起以密封连接部。 在引入包覆线从树脂片引出的端部中,在相对于匹配树脂芯片的熔化面与外周面之间,设置曲率连续变化的圆角。 因此,可以可靠地获得密封条件和优异的熔融操作效率。
    • 7. 发明授权
    • Connecting structure for shielded wire and processing method therefor
    • 屏蔽线连接结构及其加工方法
    • US06218619B1
    • 2001-04-17
    • US09141513
    • 1998-08-27
    • Nobuyuki AsakuraTetsuro IdeYasumichi Kuwayama
    • Nobuyuki AsakuraTetsuro IdeYasumichi Kuwayama
    • H01R13648
    • H01R9/034H01R9/0512H01R43/0207H01R43/0228
    • A connecting structure for a shielded wire, including a shielded wire having a core made of a conductor, a core cover for covering the core, a braid provided around the core cover for shielding, and an insulating outer cover provided around the braid for covering the core, core cover and braid; and a shield terminal having a lead wire attached at an end to a terminal metal and conductively connected at a portion between the attached end and an unattached end to the braid of the shielded wire. This structure is formed by placing the portion of the lead wire of the shield terminal on the insulating outer cover of the shielded wire, placing a resin chip on the portion of the lead wire of the shield terminal, and applying an ultrasonic vibration so as to melt and disperse the insulating outer covers of the shielded wire and the lead wire, thereby forming a shielded conductive portion in which the shield terminal and braid are conductively in contact with each other.
    • 一种用于屏蔽线的连接结构,包括具有由导体制成的芯的屏蔽线,用于覆盖芯的芯盖,设置在芯盖周围用于屏蔽的编织物和设置在编织物周围的绝缘外盖,用于覆盖 芯,芯覆盖和编织; 以及屏蔽端子,其具有在端子金属端部附接的导线,并且在连接端与未附着端部之间的部分导电地连接到屏蔽线的编织层。 该结构是通过将屏蔽端子的引线部分放置在屏蔽线的绝缘外盖上,将树脂芯片放置在屏蔽端子的引线部分上,并施加超声波振动形成的,以便 熔化和分散屏蔽线和导线的绝缘外盖,从而形成屏蔽导电部分,屏蔽端子和编织层彼此导电接触。
    • 8. 发明授权
    • Method of connecting wire materials to connecting terminal
    • 将线材连接到连接端子的方法
    • US5808260A
    • 1998-09-15
    • US762851
    • 1996-12-06
    • Nobuyuki AsakuraTetsuro Ide
    • Nobuyuki AsakuraTetsuro Ide
    • B23K11/00B21F15/10H01R4/02H01R4/18H01R43/02B23K11/10
    • H01R43/0214H01R4/187
    • With plural conductive wire materials wrapped by a connecting plate, the plural conductive materials being located between a first electrode and a second electrode of a power supply, the first electrode abutting on the conductive wire materials, the second electrode opposite to the first electrode abutting on said connecting plate, a voltage is applied between the first and the second electrode by the power supply so that the conductive wire materials are welded to the connecting plate. Thus, there is provided a method of connecting the conductive wire materials to the connecting plate which can prevent damages of the vicinity of a crimping portion due to heat and provide complete metallic coupling between the wire materials and the connecting plate with less electric power without using a third member such as metal having a low melting point.
    • 在多个导线材料被连接板包裹的情况下,多个导电材料位于电源的第一电极和第二电极之间,第一电极邻接在导线材料上,与第一电极相对的第二电极邻接 所述连接板,通过电源在第一和第二电极之间施加电压,使得导线材料焊接到连接板。 因此,提供了一种将导线材料连接到连接板的方法,其可以防止由于热量而导致的压接部附近的损坏,并且在不使用电力的情况下在电线材料和连接板之间提供完全金属耦合 诸如具有低熔点的金属的第三构件。
    • 9. 发明授权
    • Connecting structure and method for a shielded cable
    • 屏蔽电缆的连接结构和方法
    • US06184471B2
    • 2001-02-06
    • US09165286
    • 1998-10-02
    • Nobuyuki AsakuraYasumichi KuwayamaTetsuro Ide
    • Nobuyuki AsakuraYasumichi KuwayamaTetsuro Ide
    • H01R13648
    • H01R9/034B23K20/106B23K2101/32H01R4/024H01R9/0512H01R43/0207
    • A shielded cable includes core wires, an inner insulating cover for covering the core wires, a braided wire on an outer periphery of the inner insulating cover, and an outer insulating cover on an outer periphery of the braided wire. A shielded terminal has an insertion connecting portion coated with low-melting point joining material. The insertion connecting portion of the shielded terminal is inserted into the inside of the shielded cable from outside of the outer insulating cover such that the low-melting point joining material opposes the braided wire. With this condition, the shielded cable is subjected to ultrasonic vibration through a plurality of small protrusions of an ultrasonic horn over the outer insulating cover. As a result, the low-melting point joining material is melted so as to conductively connect the insertion connecting portion and braided wire to each other.
    • 屏蔽电缆包括芯线,用于覆盖芯线的内绝缘盖,内绝缘盖的外周上的编织线和编织线的外周上的外绝缘盖。 屏蔽端子具有涂覆有低熔点接合材料的插入连接部分。 屏蔽端子的插入连接部分从外部绝缘盖的外部插入到屏蔽电缆的内部,使得低熔点接合材料与编织线相对。 在这种情况下,屏蔽电缆通过外绝缘盖上的超声波喇叭的多个小突起进行超声波振动。 结果,低熔点接合材料熔化,从而将插入连接部分和编织线彼此导电连接。
    • 10. 发明授权
    • Covered wire connection structure
    • 包线连接结构
    • US5959252A
    • 1999-09-28
    • US867744
    • 1997-06-03
    • Tetsuro IdeNobuyuki Asakura
    • Tetsuro IdeNobuyuki Asakura
    • H01R4/24H01R4/00H01R4/02H01R4/70H01R43/00H01R43/02
    • H01R4/021H01R43/0228H01R4/70Y10T29/49201
    • Two covered wires conductively connected are overlapped with each other at connection portions S. The overlapped connection portions are pinched by a pair of resin chips. Cover portions are melted and the conductive wire portions of both the covered wires are conductively contacted with each other at the connection portions by pressing from outside of the resin chips. Then, the pair of the resin chips are melt-fixed to each other to seal the connection portions. The resin chips are provided with first melting portions which are melt-fixed to a mating chip in area including the connection area to seal the connection portions and second melting portions which are separated from the first melting portions and melt-fixed to the mating chip in area other than the connection portion. Thus, it is possible to achieve reduction of conducting resistance and improvement of mechanical strength.
    • 两个导电连接的导线在连接部分S处彼此重叠。重叠的连接部分被一对树脂芯片夹住。 覆盖部分被熔化,并且两个被覆线的导线部分在连接部分处通过从树脂芯片的外部挤压而彼此导电接触。 然后,一对树脂片彼此熔融固定以密封连接部。 树脂芯片设置有第一熔化部分,其熔融固定到包括连接区域的区域中的配合芯片,以密封与第一熔化部分分离并熔融固定到配合芯片的连接部分和第二熔化部分 区域以外的连接部。 因此,可以实现导电性的降低和机械强度的提高。