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1. 发明授权

US08068313B2 Microactuator, head gimbal assembly, and disk drive device 有权
标题翻译：微型致动器，头万向架组件和磁盘驱动器
公开(公告)号：US08068313B2
公开(公告)日：2011-11-29
申请号：US12271820
申请日：2008-11-14
申请人： Nobumasa Nishiyama , Ryo Yoshida , Haruhide Takahashi , Shinobu Hagiya , Toshiki Hirano
发明人： Nobumasa Nishiyama , Ryo Yoshida , Haruhide Takahashi , Shinobu Hagiya , Toshiki Hirano
IPC分类号： G11B5/48
CPC分类号： G11B5/4826 , G11B5/4873 , G11B5/5552
摘要： Embodiments of the present invention relate to approaches to effectively let noise on a head slider bonded to a silicon substrate of a microactuator, escape to the ground. A head gimbal assembly (HGA) according to an embodiment of the present invention comprises a microactuator bonded to a gimbal tongue. The microactuator comprises a piezoelectric element and a movable part for moving in response to expansion or contraction of the piezoelectric element. The motion of the movable part causes a head slider to slightly move. The microactuator further comprises a conductive path including an impurity-containing silicon layer formed on the silicon substrate. The conductive path transmits electric charge of the head slider to a suspension. The conductivity of the impurity-containing silicon layer is lower than the one of the silicon substrate so that the noise charge of the head slider may escape to the suspension.
摘要翻译：本发明的实施例涉及有效地使结合到微致动器的硅衬底的磁头滑块上的噪声逃逸到地面的方法。根据本发明的实施例的头万向节组件（HGA）包括结合到万向节舌的微致动器。微致动器包括压电元件和用于响应于压电元件的膨胀或收缩而移动的可移动部件。可移动部分的运动导致磁头滑块稍微移动。微致动器还包括导电路径，该导电路径包括在硅衬底上形成的含杂质的硅层。导电路径将磁头滑块的电荷传递到悬架。含杂质的硅层的导电率低于硅衬底的电导率，使得磁头滑块的噪声电荷可能逸出到悬架。

2. 发明申请

US20090135523A1 MICROACTUATOR, HEAD GIMBAL ASSEMBLY, AND DISK DRIVE DEVICE 有权
标题翻译：微处理器，头盖组件和磁盘驱动器件
公开(公告)号：US20090135523A1
公开(公告)日：2009-05-28
申请号：US12271820
申请日：2008-11-14
申请人： Nobumasa Nishiyama , Ryo Yoshida , Haruhide Takahashi , Shinobu Hagiya , Toshiki Hirano
发明人： Nobumasa Nishiyama , Ryo Yoshida , Haruhide Takahashi , Shinobu Hagiya , Toshiki Hirano
IPC分类号： G11B5/48
CPC分类号： G11B5/4826 , G11B5/4873 , G11B5/5552
摘要： Embodiments of the present invention relate to approaches to effectively let noise on a head slider bonded to a silicon substrate of a microactuator, escape to the ground. A head gimbal assembly (HGA) according to an embodiment of the present invention comprises a microactuator bonded to a gimbal tongue. The microactuator comprises a piezoelectric element and a movable part for moving in response to expansion or contraction of the piezoelectric element. The motion of the movable part causes a head slider to slightly move. The microactuator further comprises a conductive path including an impurity-containing silicon layer formed on the silicon substrate. The conductive path transmits electric charge of the head slider to a suspension. The conductivity of the impurity-containing silicon layer is lower than the one of the silicon substrate so that the noise charge of the head slider may escape to the suspension.
摘要翻译：本发明的实施例涉及有效地使结合到微致动器的硅衬底的磁头滑块上的噪声逃逸到地面的方法。根据本发明的实施例的头万向节组件（HGA）包括结合到万向节舌的微致动器。微致动器包括压电元件和用于响应于压电元件的膨胀或收缩而移动的可移动部件。可移动部分的运动导致磁头滑块稍微移动。微致动器还包括导电路径，该导电路径包括在硅衬底上形成的含杂质的硅层。导电路径将磁头滑块的电荷传递到悬架。含杂质的硅层的导电率低于硅衬底的电导率，使得磁头滑块的噪声电荷可以逸出到悬架。

3. 发明授权

US08351159B2 Suspension for protecting a component from mechanical shock 有权
标题翻译：用于保护部件免受机械冲击的悬架
公开(公告)号：US08351159B2
公开(公告)日：2013-01-08
申请号：US12578754
申请日：2009-10-14
申请人： Toshiki Hirano , Haruhide Takahashi , Shinobu Hagiya , Shigenori Takada , Kousaku Wakatsuki
发明人： Toshiki Hirano , Haruhide Takahashi , Shinobu Hagiya , Shigenori Takada , Kousaku Wakatsuki
IPC分类号： G11B5/54 , G11B5/58 , G11B5/60
CPC分类号： G11B5/4826
摘要： Approaches for protecting a component when a hard-disk drive (HDD) experiences a mechanical shock. An HDD includes a suspension comprising a load beam, a gimbal, and a flexure tongue. A component, such as a microactuator, is mounted on the suspension. The flexure tongue extends to at least the edge of the microactuator that is furthest from the gimbal. The flexure tongue prevents the microactuator from contacting the load beam when the HDD receives a mechanical shock. Alternately, the flexure tongue may comprise a tip portion that extends beyond the edge of the microactuator that is furthest from the gimbal, and the tip portion of the flexure tongue may deform to act as shock absorber when the HDD receives a mechanical shock. Alternately or additionally, a padding material may be used to prevent the microactuator or the flexure tongue from contacting the load beam when the HDD receives a mechanical shock.
摘要翻译：当硬盘驱动器（HDD）遭受机械冲击时保护组件的方法。 HDD包括悬架，其包括负载梁，万向节和弯曲舌头。诸如微型致动器的部件安装在悬架上。弯曲舌片至少延伸到距离万向节最远的微型致动器的边缘。当HDD接收到机械冲击时，挠曲舌防止微型致动器接触负载梁。或者，挠曲舌片可以包括延伸超出微型致动器的边缘的尖端部分，其最远离万向节，并且当HDD接收到机械冲击时，弯曲舌头的尖端部分可以变形以用作减震器。替代地或另外地，当HDD接收到机械冲击时，填充材料可以用于防止微致动器或弯曲舌片接触负载梁。

4. 发明申请

US20110085270A1 Suspension for Protecting a Component from Mechanical Shock 有权
标题翻译：用于保护部件免受机械冲击的悬架
公开(公告)号：US20110085270A1
公开(公告)日：2011-04-14
申请号：US12578754
申请日：2009-10-14
申请人： Toshiki Hirano , Haruhide Takahashi , Shinobu Hagiya , Shigenori Takada , Kousaku Wakatsuki
发明人： Toshiki Hirano , Haruhide Takahashi , Shinobu Hagiya , Shigenori Takada , Kousaku Wakatsuki
IPC分类号： G11B21/16
CPC分类号： G11B5/4826
摘要： Approaches for protecting a component when a hard-disk drive (HDD) experiences a mechanical shock. An HDD includes a suspension comprising a load beam, a gimbal, and a flexure tongue. A component, such as a microactuator, is mounted on the suspension. The flexure tongue extends to at least the edge of the microactuator that is furthest from the gimbal. The flexure tongue prevents the microactuator from contacting the load beam when the HDD receives a mechanical shock. Alternately, the flexure tongue may comprise a tip portion that extends beyond the edge of the microactuator that is furthest from the gimbal, and the tip portion of the flexure tongue may deform to act as shock absorber when the HDD receives a mechanical shock. Alternately or additionally, a padding material may be used to prevent the microactuator or the flexure tongue from contacting the load beam when the HDD receives a mechanical shock.
摘要翻译：当硬盘驱动器（HDD）遭受机械冲击时保护组件的方法。 HDD包括悬架，其包括负载梁，万向节和弯曲舌头。诸如微型致动器的部件安装在悬架上。弯曲舌片至少延伸到距离万向节最远的微型致动器的边缘。当HDD接收到机械冲击时，挠曲舌防止微型致动器接触负载梁。或者，挠曲舌片可以包括延伸超出微型致动器的边缘的尖端部分，其最远离万向节，并且当HDD接收到机械冲击时，弯曲舌头的尖端部分可以变形以用作减震器。替代地或另外地，当HDD接收到机械冲击时，填充材料可以用于防止微致动器或弯曲舌片接触负载梁。

5. 发明申请

US20080151432A1 High frequency interconnect signal transmission lines 有权
标题翻译：高频互连信号传输线
公开(公告)号：US20080151432A1
公开(公告)日：2008-06-26
申请号：US11643269
申请日：2006-12-20
申请人： Toshiki Hirano , Nobumasa Nishiyama , Haruhide Takahashi
发明人： Toshiki Hirano , Nobumasa Nishiyama , Haruhide Takahashi
IPC分类号： G11B5/48
CPC分类号： G11B5/4853 , G11B5/5552
摘要： A micro-electromechanical signal transmission line is made from an electrically conductive material. It has a first distal end and a second distal end. The second distal end is free to move with respect to said first distal end. There exists an unsupported region between the first distal end and the second distal end. The unsupported region is juxtaposed at a controlled distance from at least one grounded conductive surface.
摘要翻译：微机电信号传输线由导电材料制成。它具有第一远端和第二远端。第二远端相对于所述第一远端自由移动。在第一远端和第二远端之间存在无支撑区域。未受支撑的区域与至少一个接地的导电表面在可控的距离处并置。

6. 发明授权

US07804663B2 High frequency interconnect signal transmission lines 有权
标题翻译：高频互连信号传输线
公开(公告)号：US07804663B2
公开(公告)日：2010-09-28
申请号：US11643269
申请日：2006-12-20
申请人： Toshiki Hirano , Nobumasa Nishiyama , Haruhide Takahashi
发明人： Toshiki Hirano , Nobumasa Nishiyama , Haruhide Takahashi
IPC分类号： G11B5/48
CPC分类号： G11B5/4853 , G11B5/5552
摘要： A micro-electromechanical signal transmission line is made from an electrically conductive material. It has a first distal end and a second distal end. The second distal end is free to move with respect to said first distal end. There exists an unsupported region between the first distal end and the second distal end. The unsupported region is juxtaposed at a controlled distance from at least one grounded conductive surface.
摘要翻译：微机电信号传输线由导电材料制成。它具有第一远端和第二远端。第二远端相对于所述第一远端自由移动。在第一远端和第二远端之间存在无支撑区域。未受支撑的区域与至少一个接地的导电表面在可控的距离处并置。

7. 发明授权

US08213127B2 Microactuator, head gimbal assembly, and magnetic disk drive 有权
标题翻译：微型制动器，磁头万向架组件和磁盘驱动器
公开(公告)号：US08213127B2
公开(公告)日：2012-07-03
申请号：US12284252
申请日：2008-09-19
申请人： Haruhide Takahashi , Toshiki Hirano
发明人： Haruhide Takahashi , Toshiki Hirano
IPC分类号： G11B5/56
CPC分类号： G11B5/4826 , G11B5/4873 , G11B5/5552
摘要： Embodiments of the present invention help to suppress reduction of the operation quantity of a microactuator. According to one embodiment, a microactuator comprises a silicon substrate and a piezoelectric element. The silicon substrate has some rigidity and provides elastic counter force to the piezoelectric element. In the piezoelectric element, a secondary piezoelectric layer is laminated on a primary piezoelectric layer opposite from the silicon substrate. The contraction force of the secondary piezoelectric layer acts on the primary piezoelectric layer so that it bends toward the secondary piezoelectric layer opposite from the silicon substrate. When the primary piezoelectric layer expands, the contraction force of the secondary piezoelectric layer acts on the primary piezoelectric layer so that it warps against the primary piezoelectric layer.
摘要翻译：本发明的实施例有助于抑制微致动器的操作量的减少。根据一个实施例，微致动器包括硅衬底和压电元件。硅衬底具有一定的刚性并且向压电元件提供弹性反作用力。在压电元件中，在与硅衬底相反的初级压电层上层压次级压电层。次级压电层的收缩力作用在初级压电层上，使其向与第二压电层相对的硅衬底弯曲。当主压电层膨胀时，次级压电层的收缩力作用在初级压电层上，使其与主压电层翘曲。

8. 发明申请

US20080198511A1 Suspension for a hard disk drive microactuator 审中-公开
标题翻译：暂停用于硬盘驱动器微型致动器
公开(公告)号：US20080198511A1
公开(公告)日：2008-08-21
申请号：US11708938
申请日：2007-02-20
申请人： Toshiki Hirano , Haruhide Takahashi
发明人： Toshiki Hirano , Haruhide Takahashi
IPC分类号： G11B5/56
CPC分类号： G11B5/4833 , G11B5/5552
摘要： A disk drive flexure is provided. The disk drive flexure includes a first surface for coupling with a microactuator, the microactuator comprising a moving portion and a stationary portion wherein the moving portion and the stationary portion are integrated within a substrate and wherein the stationary portion is coupled to the first surface by an adhesive. The disk drive flexure further includes a spacer portion for maintaining a distance between the microactuator and the flexure such that the moving portion does not contact the flexure and wherein the spacer portion prevents the adhesive from contacting the moving portion of the microactuator.
摘要翻译：提供磁盘驱动器的弯曲。磁盘驱动器挠曲包括用于与微致动器耦合的第一表面，微致动器包括移动部分和静止部分，其中移动部分和固定部分集成在基板内，并且其中固定部分通过一个胶粘剂。磁盘驱动器弯曲部还包括用于保持微致动器和挠曲件之间的距离的间隔部分，使得移动部分不接触弯曲部，并且其中间隔部分防止粘合剂接触微致动器的移动部分。

9. 发明申请

US20080180856A1 Method and apparatus for a microactuator bonding pad structure for solder ball placement and reflow joint 审中-公开
标题翻译：用于焊球放置和回流接头的微致动器焊盘结构的方法和装置
公开(公告)号：US20080180856A1
公开(公告)日：2008-07-31
申请号：US11701078
申请日：2007-01-31
申请人： Toshiki Hirano , Haruhide Takahashi , Tatsumi Tsuchiya
发明人： Toshiki Hirano , Haruhide Takahashi , Tatsumi Tsuchiya
IPC分类号： G11B5/56
CPC分类号： G11B5/5552 , G11B5/4826 , H01L2224/11334 , H05K3/3442 , H05K3/3478 , H05K2201/09472 , H05K2203/041 , H05K2203/167 , Y02P70/613 , Y10T29/49069
摘要： An apparatus and method for a microactuator having a bonding pad having a solder ball retainer to decrease instances of solder ball movement. The method provides a substrate for the microactuator. A conductive layer above the substrate is provided. A bonding pad having a solder ball retainer is provided and disposed above the conductive layer. The bonding pad having a solder ball retainer provides reduced instances of movement of a solder ball disposed therewithin prior to and during a reflow process performed on the solder ball.
摘要翻译：一种微致动器的装置和方法，具有具有焊球保持器的焊盘，以减少焊球移动的实例。该方法提供用于微致动器的衬底。提供了衬底上方的导电层。提供具有焊球保持器的焊盘，并设置在导电层的上方。具有焊球保持器的焊盘提供了在焊料球之前和期间在焊球上进行的回流工艺期间设置的焊球的减少的移动实例。

10. 发明授权

US07893534B2 Thermally insulating bonding pad structure for solder reflow connection 有权
标题翻译：用于焊料回流连接的热绝缘焊盘结构
公开(公告)号：US07893534B2
公开(公告)日：2011-02-22
申请号：US11891530
申请日：2007-08-10
申请人： Toshiki Hirano , Haruhide Takahashi , Tatsumi Tsuchiya
发明人： Toshiki Hirano , Haruhide Takahashi , Tatsumi Tsuchiya
IPC分类号： H01L23/48
CPC分类号： H01L23/49816 , G11B5/4853 , G11B5/4873 , H01L2924/0002 , H01L2924/09701 , H05K1/0201 , H05K1/111 , H05K3/3442 , H05K3/3494 , H05K2201/062 , H05K2201/10727 , H05K2203/041 , Y10T29/49025 , Y10T29/49027 , Y10T29/49028 , Y10T29/4903 , Y10T29/49032 , H01L2924/00
摘要： A thermally insulating bonding pad for solder reflow is described. The bonding pad includes a structure. The structure forms the bonding pad. The bonding pad further includes an insulator formed on the structure. The insulator is configured to be interposed between the structure and a substrate of a component onto which said bonding pad is to be disposed. The bonding pad provides thermal insulation for said substrate when said bonding pad is subject to a solder reflow process being performed thereon.
摘要翻译：描述了用于焊料回流的隔热焊盘。接合焊盘包括结构。该结构形成接合垫。接合焊盘还包括形成在结构上的绝缘体。绝缘体被配置为插入在结构和要布置所述接合焊盘的部件的基板之间。当所述接合焊盘经受在其上进行的焊料回流工艺时，所述接合焊盘为所述衬底提供热绝缘。

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