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1. 发明授权

US5978352A Multiplex transmission system 失效
标题翻译：多路传输系统
公开(公告)号：US5978352A
公开(公告)日：1999-11-02
申请号：US673046
申请日：1996-07-01
申请人： Nobuhiro Imaizumi , Tatsuaki Oniishi
发明人： Nobuhiro Imaizumi , Tatsuaki Oniishi
IPC分类号： B60R16/02 , B60R16/03 , H04J3/02 , H04J3/14
CPC分类号： B60R16/0315 , B60R2016/0322 , Y10T307/469
摘要： A multiplex transmission system is made up of a master load control unit which is connected to a multiplex transmission network and is capable of executing a multiplexing operation based on control specification information as a master system, slave load control units capable of the multiplexing operation as a slave system, and a nonvolatile removable external storage unit capable of reading the control specification information as required. Abnormalities associated with the multiplexing operation which arise in the multiplex transmission system are detected, and load control units in an abnormal condition can be restored to a normal condition by resetting.
摘要翻译：多路复用传输系统由连接到复用传输网络的主负载控制单元组成，并且能够执行基于作为主系统的控制指定信息的复用操作，能够进行多路复用操作的从属负载控制单元从系统和能够根据需要读取控制规范信息的非易失性可移动外部存储单元。检测与复用传输系统中出现的多路复用操作有关的异常情况，异常状态下的负载控制单元可通过复位恢复正常状态。

2. 发明授权

US06522935B1 Control-specification design management system used for load control devices 失效
标题翻译：用于负载控制装置的控制规范设计管理系统
公开(公告)号：US06522935B1
公开(公告)日：2003-02-18
申请号：US08674452
申请日：1996-07-01
申请人： Nobuhiro Imaizumi , Tatsuaki Oniishi
发明人： Nobuhiro Imaizumi , Tatsuaki Oniishi
IPC分类号： G06F1546
CPC分类号： B60R16/0315 , B60R2016/0322 , Y02P90/265
摘要： In designing the connection correspondence of the control switches to the loads, the control-specification design management system used for the load control devices refers to the connection correspondence stored in the look-up table or a slip file prepared in the preceding design, and presents to a designer candidates for the loads that can be controlled when these are connected to the control switches. While seeing the candidates, the designer selects the most suitable one from among those presented candidates. He designs control-specification information and prints out the contents of the slip file.
摘要翻译：在设计控制开关与负载的连接对应关系时，用于负载控制装置的控制规范设计管理系统是指存储在查找表中的连接对应或前一设计中准备的滑动文件，给设计师候选人，当这些负载连接到控制开关时可以控制的负载。在看到候选人的同时，设计者从提出候选人中选出最适合的人物。他设计控制规范信息并打印出打印文件的内容。

3. 发明授权

US5895989A Power supply unit and connector connection failure detection method 失效
标题翻译：电源单元和连接器连接故障检测方法
公开(公告)号：US5895989A
公开(公告)日：1999-04-20
申请号：US956432
申请日：1997-10-23
申请人： Nobuhiro Imaizumi , Hiromichi Hanaoka , Tatsuaki Oniishi
发明人： Nobuhiro Imaizumi , Hiromichi Hanaoka , Tatsuaki Oniishi
IPC分类号： G01R31/02 , B60R16/02 , B60R16/03 , G01R31/00 , G01R31/04 , G05F1/10 , H02H3/00 , H02H3/087 , H02H5/10 , H02H3/027
CPC分类号： H02H3/087 , G01R31/007 , G01R31/045 , B60R16/03 , G01R31/024 , H02H5/10 , Y10T307/826 , Y10T307/937
摘要： A power supply unit adapted to supply power from a power supply section to a load via a plurality of power supply lines connected by an on/off switch and connectors. The power supply unit includes a load open detection section for detecting an open state between the on/off switch and the load, a monitor section for monitoring the number of times the open state has been entered per unit time based on the detection result of the load open detection section, and a control section for controlling the on/off switch off when the number of times the open state has been entered per unit time is greater than a predetermined number of times.
摘要翻译：电源单元，其适于经由通过开/关开关和连接器连接的多个电源线从电源部分向负载供电。电源单元包括用于检测开/关开关和负载之间的打开状态的负载打开检测部分，用于基于检测结果监视每单位时间已经进入打开状态的次数的监视部分负载打开检测部分，以及当每单位时间进入打开状态的次数时，用于控制开关断开的控制部分大于预定次数。

4. 发明授权

US6009105A Multiplex communication system for vehicle 失效
标题翻译：车辆多路通讯系统
公开(公告)号：US6009105A
公开(公告)日：1999-12-28
申请号：US671647
申请日：1996-06-28
申请人： Kiyoshi Hosokawa , Nobuhiro Imaizumi , Tatsuaki Oniishi
发明人： Kiyoshi Hosokawa , Nobuhiro Imaizumi , Tatsuaki Oniishi
IPC分类号： B60R16/02 , B60R16/023 , B60R16/03 , H04L12/43 , H04B7/212
CPC分类号： B60R16/0315 , B60R2016/0322
摘要： In a multiplex communication system for a bus vehicle, including: a plurality of loads disposed in the bus vehicle and connected to a wire harness; a switch unit for inputting signals to operate the loads and generating multiplex data; a first load drive unit for controlling the loads placed mainly on a floor of the bus vehicle; and a second load drive unit for controlling the loads placed mainly on a ceiling of the bus vehicle, the multiplex communication system further includes a multiplex line interconnecting the switch unit, the first load drive unit and the second load drive unit, and transmitting the multiplex data to the first and second load drive units to execute a multiplex communication, each the first and second load drive units controlling the loads in accordance with the multiplex data received through the multiplex line from the switch unit. The wire harness can be formed with high assembling performance or productivity in the bus vehicle.
摘要翻译：一种用于总线车辆的多路复用通信系统，包括：多个负载，设置在总线车辆中并连接到线束; 用于输入信号以操作所述负载并产生多路复用数据的开关单元; 用于控制主要放置在公交车辆的地板上的负载的第一负载驱动单元; 以及第二负载驱动单元，用于控制主要放置在总线车辆的天花板上的负载，所述多路通信系统还包括互连所述开关单元，所述第一负载驱动单元和所述第二负载驱动单元的多路复用线路，数据到第一和第二负载驱动单元以执行多路复用通信，每个第一和第二负载驱动单元根据通过多路复用线从开关单元接收的多路复用数据来控制负载。线束可以形成为具有高的组装性能或公交车辆的生产率。

5. 发明授权

US5859845A Vehicle load control system 失效
标题翻译：车辆负荷控制系统
公开(公告)号：US5859845A
公开(公告)日：1999-01-12
申请号：US684182
申请日：1996-07-19
申请人： Tatsuaki Oniishi , Akiyoshi Kanazawa , Nobuhiro Imaizumi
发明人： Tatsuaki Oniishi , Akiyoshi Kanazawa , Nobuhiro Imaizumi
IPC分类号： B60R16/02 , B60R16/03 , H04S3/00
CPC分类号： B60R16/0315 , B60R2016/0322
摘要： A control signal generated as a result of the actuation of each of control switches of a control section is multiplexed by a multiplexing section, and the thus multiplexed signal is sent to a multiplex transmission line. Load control sections receive the multiplexed control signal sent over the multiplex transmission line. The load control sections then control the electric power fed to a corresponding one of loads on the basis of the received control signal. Control data, representing the form of output control of the corresponding load which is controlled as a result of the actuation of the control switch, are stored according to the control switches. Control means control the electric power fed to the load on the basis of the control signal using the control data.
摘要翻译：作为控制部分的每个控制开关的致动结果产生的控制信号由多路复用部分复用，并且将这样复用的信号发送到多路传输线路。负载控制部分接收通过多路传输线路发送的复用控制信号。然后，负载控制部根据接收到的控制信号来控制供给到相应一个负载的电力。根据控制开关存储表示作为控制开关的动作控制的对应负载的输出控制的形式的控制数据。控制装置使用控制数据控制基于控制信号馈送到负载的电力。

6. 发明授权

US08728867B2 Semiconductor device, manufacturing method of semiconductor device, and power source device 有权
标题翻译：半导体装置，半导体装置的制造方法以及电源装置
公开(公告)号：US08728867B2
公开(公告)日：2014-05-20
申请号：US13355792
申请日：2012-01-23
申请人： Kozo Shimizu , Keishiro Okamoto , Nobuhiro Imaizumi , Tadahiro Imada , Keiji Watanabe
发明人： Kozo Shimizu , Keishiro Okamoto , Nobuhiro Imaizumi , Tadahiro Imada , Keiji Watanabe
IPC分类号： H01L21/44
CPC分类号： H01L23/48 , H01L23/3128 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/04026 , H01L2224/05005 , H01L2224/05082 , H01L2224/05155 , H01L2224/05166 , H01L2224/05169 , H01L2224/05541 , H01L2224/05573 , H01L2224/05644 , H01L2224/0603 , H01L2224/26175 , H01L2224/2745 , H01L2224/2746 , H01L2224/29019 , H01L2224/29036 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/2912 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29499 , H01L2224/32225 , H01L2224/32245 , H01L2224/325 , H01L2224/32502 , H01L2224/32506 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48245 , H01L2224/48247 , H01L2224/48644 , H01L2224/48744 , H01L2224/4903 , H01L2224/73265 , H01L2224/83193 , H01L2224/83194 , H01L2224/83801 , H01L2224/83851 , H01L2924/00013 , H01L2924/01029 , H01L2924/01322 , H01L2924/13064 , H01L2924/15311 , H01L2924/181 , H01L2224/83439 , H01L2924/00014 , H01L2924/00012 , H01L2924/0132 , H01L2924/01047 , H01L2924/0105 , H01L2924/0665 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： A manufacturing of a semiconductor device includes forming one of a layer with a first metal and the layer with a second metal on one of a semiconductor chip mounting area of a support plate and a back surface of the semiconductor chip; forming the other of the layer with the first metal and the layer with the second metal on an area corresponding to a part of the area, in which one of the layer with the first metal and the layer with the second metal, of the other one of the semiconductor chip mounting area and the back surface of the semiconductor chip; and forming a layer which includes an alloy with the first metal and the second metal after positioning the semiconductor chip in the semiconductor chip mounting area to bond the semiconductor chip with the semiconductor chip mounting area.
摘要翻译：半导体器件的制造包括在支撑板的半导体芯片安装区域和半导体芯片的后表面中的一个上形成具有第一金属的层和具有第二金属的层; 在第一金属层和第二金属层之间形成与第一金属层和第二金属层之间的一个区域对应的区域的另一层的半导体芯片安装区域和半导体芯片的背面; 以及在将所述半导体芯片定位在所述半导体芯片安装区域中之后，形成与所述第一金属和所述第二金属合金的层，以将半导体芯片与半导体芯片安装区域接合。

7. 发明授权

US08492784B2 Semiconductor device and method for producing the same, and power supply 有权
标题翻译：半导体装置及其制造方法及电源
公开(公告)号：US08492784B2
公开(公告)日：2013-07-23
申请号：US13331090
申请日：2011-12-20
申请人： Keishiro Okamoto , Tadahiro Imada , Nobuhiro Imaizumi , Keiji Watanabe
发明人： Keishiro Okamoto , Tadahiro Imada , Nobuhiro Imaizumi , Keiji Watanabe
IPC分类号： H01L33/00
CPC分类号： H01L23/3135 , H01L23/3121 , H01L23/3142 , H01L24/45 , H01L24/48 , H01L2224/05553 , H01L2224/05554 , H01L2224/0603 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48472 , H01L2224/8592 , H01L2924/00014 , H01L2924/09701 , H01L2924/13064 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
摘要： A semiconductor device includes: a semiconductor chip including a nitride semiconductor layered structure including a carrier transit layer and a carrier supply layer; a first resin layer on the semiconductor chip, the first resin layer including a coupling agent; a second resin layer on the first resin layer, the second resin layer including a surfactant; and a sealing resin layer to seal the semiconductor chip with the first resin layer and the second resin layer.
摘要翻译：半导体器件包括：半导体芯片，其包括具有载流子迁移层和载流子供给层的氮化物半导体层叠结构; 在所述半导体芯片上的第一树脂层，所述第一树脂层包含偶联剂; 在第一树脂层上的第二树脂层，第二树脂层包括表面活性剂; 以及用第一树脂层和第二树脂层密封半导体芯片的密封树脂层。

8. 发明授权

US07816180B2 Method for processing a base that includes connecting a first base to a second base 有权
标题翻译：用于处理包括将第一基座连接到第二基座的基座的方法
公开(公告)号：US07816180B2
公开(公告)日：2010-10-19
申请号：US12403252
申请日：2009-03-12
申请人： Masataka Mizukoshi , Nobuhiro Imaizumi , Yoshikatsu Ishizuki
发明人： Masataka Mizukoshi , Nobuhiro Imaizumi , Yoshikatsu Ishizuki
IPC分类号： H01L21/58
CPC分类号： H01L24/13 , H01L21/563 , H01L24/02 , H01L24/06 , H01L24/11 , H01L24/16 , H01L2224/0401 , H01L2224/05578 , H01L2224/06102 , H01L2224/1134 , H01L2224/1147 , H01L2224/1184 , H01L2224/13028 , H01L2224/13082 , H01L2224/13144 , H01L2224/1357 , H01L2224/13639 , H01L2224/13644 , H01L2224/13664 , H01L2224/13669 , H01L2224/16106 , H01L2224/16225 , H01L2224/2784 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/8113 , H01L2224/81132 , H01L2224/81191 , H01L2224/83121 , H01L2224/83191 , H01L2224/83856 , H01L2924/00 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01043 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01057 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/13091 , H01L2924/19041 , Y10T29/49126 , H01L2924/00014 , H01L2224/13099 , H01L2224/29099
摘要： The present invention realizes a semiconductor device of high reliability which allows metal terminals which have a uniform height, are flat and smooth to be formed under low load and at low costs and to be mounted with low damage. The electrodes 5 and the insulating film 6 are both formed of materials having the property that they are solid and do not exhibit the adhesiveness at room temperature and exhibit the adhesiveness at a temperature not lower than a first temperature and cure at a temperature not lower than a second temperature higher than the first temperature. The surfaces of the electrodes 5 and the insulating film 6 of a semiconductor chip 1a are planarized in continuously flat with a hard cutting tool, as of diamond or others.
摘要翻译：本发明实现了一种高可靠性的半导体器件，其允许在低负载和低成本下形成具有均匀高度，平坦和平滑的金属端子并且以低损伤安装。电极5和绝缘膜6均由具有固体特性的材料形成，并且在室温下不显示粘合性，并且在不低于第一温度的温度下显示粘附性，并且在不低于第二温度高于第一温度。半导体芯片1a的电极5和绝缘膜6的表面与硬质切削工具一样平坦化，如金刚石等。

9. 发明授权

US07811835B2 Method for processing a base that includes connecting a first base to a second base with an insulating film 有权
标题翻译：用于处理基底的方法，其包括用绝缘膜将第一基底连接到第二基底
公开(公告)号：US07811835B2
公开(公告)日：2010-10-12
申请号：US12403283
申请日：2009-03-12
申请人： Masataka Mizukoshi , Nobuhiro Imaizumi , Yoshikatsu Ishizuki
发明人： Masataka Mizukoshi , Nobuhiro Imaizumi , Yoshikatsu Ishizuki
IPC分类号： H01L21/58
CPC分类号： H01L24/13 , H01L21/563 , H01L24/02 , H01L24/06 , H01L24/11 , H01L24/16 , H01L2224/0401 , H01L2224/05578 , H01L2224/06102 , H01L2224/1134 , H01L2224/1147 , H01L2224/1184 , H01L2224/13028 , H01L2224/13082 , H01L2224/13144 , H01L2224/1357 , H01L2224/13639 , H01L2224/13644 , H01L2224/13664 , H01L2224/13669 , H01L2224/16106 , H01L2224/16225 , H01L2224/2784 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/8113 , H01L2224/81132 , H01L2224/81191 , H01L2224/83121 , H01L2224/83191 , H01L2224/83856 , H01L2924/00 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01043 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01057 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/13091 , H01L2924/19041 , Y10T29/49126 , H01L2924/00014 , H01L2224/13099 , H01L2224/29099
摘要： The present invention realizes a semiconductor device of high reliability which allows metal terminals which have a uniform height, are flat and smooth to be formed under low load and at low costs and to be mounted with low damage. The electrodes 5 and the insulating film 6 are both formed of materials having the property that they are solid and do not exhibit the adhesiveness at room temperature and exhibit the adhesiveness at a temperature not lower than a first temperature and cure at a temperature not lower than a second temperature higher than the first temperature. The surfaces of the electrodes 5 and the insulating film 6 of a semiconductor chip 1a are planarized in continuously flat with a hard cutting tool, as of diamond or others.
摘要翻译：本发明实现了一种高可靠性的半导体器件，其允许在低负载和低成本下形成具有均匀高度，平坦和平滑的金属端子并且以低损伤安装。电极5和绝缘膜6均由具有固体特性的材料形成，并且在室温下不显示粘合性，并且在不低于第一温度的温度下显示粘附性，并且在不低于第二温度高于第一温度。半导体芯片1a的电极5和绝缘膜6的表面与硬质切削工具一样平坦化，如金刚石等。

10. 发明申请

US20090181497A1 METHOD FOR PROCESSING A BASE 有权
公开(公告)号：US20090181497A1
公开(公告)日：2009-07-16
申请号：US12403283
申请日：2009-03-12
申请人： Masataka Mizukoshi , Nobuhiro Imaizumi , Yoshikatsu Ishizuki
发明人： Masataka Mizukoshi , Nobuhiro Imaizumi , Yoshikatsu Ishizuki
IPC分类号： H01L21/60
CPC分类号： H01L24/13 , H01L21/563 , H01L24/02 , H01L24/06 , H01L24/11 , H01L24/16 , H01L2224/0401 , H01L2224/05578 , H01L2224/06102 , H01L2224/1134 , H01L2224/1147 , H01L2224/1184 , H01L2224/13028 , H01L2224/13082 , H01L2224/13144 , H01L2224/1357 , H01L2224/13639 , H01L2224/13644 , H01L2224/13664 , H01L2224/13669 , H01L2224/16106 , H01L2224/16225 , H01L2224/2784 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/8113 , H01L2224/81132 , H01L2224/81191 , H01L2224/83121 , H01L2224/83191 , H01L2224/83856 , H01L2924/00 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01043 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01057 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/13091 , H01L2924/19041 , Y10T29/49126 , H01L2924/00014 , H01L2224/13099 , H01L2224/29099
摘要： The present invention realizes a semiconductor device of high reliability which allows metal terminals which have a uniform height, are flat and smooth to be formed under low load and at low costs and to be mounted with low damage. The electrodes 5 and the insulating film 6 are both formed of materials having the property that they are solid and do not exhibit the adhesiveness at room temperature and exhibit the adhesiveness at a temperature not lower than a first temperature and cure at a temperature not lower than a second temperature higher than the first temperature. The surfaces of the electrodes 5 and the insulating film 6 of a semiconductor chip 1a are planarized in continuously flat with a hard cutting tool, as of diamond or others.

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