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1. 发明授权

US08646504B2 Adhesive tape affixing equipment and press-fitting equipment 有权
标题翻译：胶带固定设备和压配设备
公开(公告)号：US08646504B2
公开(公告)日：2014-02-11
申请号：US13122172
申请日：2010-01-18
申请人： Nobuhiko Muraoka , Syozo Kadota
发明人： Nobuhiko Muraoka , Syozo Kadota
IPC分类号： B32B37/10 , B32B37/02 , B32B37/12
CPC分类号： B65H37/002 , H05K3/323
摘要： An adhesive tape affixing equipment for pulling out a tape from a supply reel on which the tape constructed by laminating an adhesive tape on a separator tape is wound, and then affixing the adhesive tape onto predetermined locations of a substrate by pushing the tape using a press-fitting tool. A radial direction of the supply reel is arranged to intersect substantially orthogonally with a longitudinal direction of the press-fitting tool during the affixing of the adhesive tape by the press-fitting tool. Also included is a tape running route setting device for causing the tape pulled out from the supply reel to run through an area between the press-fitting tool and the substrate along the longitudinal direction of the press-fitting tool via a tape running direction changing portion being provided to at least one location.
摘要翻译：一种用于从供带盘拉出带子的胶带固定设备，其上缠绕通过将粘合带层压在隔离带上而构成的带，然后通过使用压机推动带将粘合带粘贴到基板的预定位置上适合工具。在通过压配工具粘贴胶带的过程中，供给卷轴的径向方向布置成与压配工具的纵向大致正交地相交。还包括一个带子运行路线设置装置，用于使从供带盘拉出的带通过带运行方向改变部分沿着压配工具的长度方向穿过压配工具和基板之间的区域提供给至少一个位置。

2. 发明授权

US08646171B2 Component mounting apparatus and method 有权
标题翻译：组件安装装置及方法
公开(公告)号：US08646171B2
公开(公告)日：2014-02-11
申请号：US12935640
申请日：2009-03-30
申请人： Nobuhiko Muraoka , Syozo Kadota
发明人： Nobuhiko Muraoka , Syozo Kadota
IPC分类号： H05K13/04
CPC分类号： H01L24/86 , H01L2224/86 , H01L2924/01004 , H01L2924/01033 , H01L2924/01051 , H01L2924/01074 , H01L2924/01082 , H01L2924/15788 , H01L2924/181 , H05K3/323 , H05K3/361 , Y10T29/4913 , Y10T29/49149 , Y10T29/53174 , Y10T29/53191 , Y10T29/53261 , H01L2924/00
摘要： A component mounting apparatus includes: a conveyor device for sucking and holding a substrate in a substantially vertical posture and conveying the substrate in a direction extending along its flat plate surface; a plurality of working devices for performing a working process for mounting areas in edge portions of the substantially vertical-postured substrate received from the conveyor device. In the component mounting apparatus, each of the working devices includes: a substrate holder for sucking and holding the substrate in a substantially vertical posture; a holder up/down device for moving the sucked and held substrate to a downward working position; a receiving member for supporting an edge portion of the substrate positioned in the working position from its back face side; and a working unit for performing the working process on the mounting areas of the edge portions of the substrate positioned in the working position from its front face side.
摘要翻译：一种部件安装装置，包括：输送装置，用于以基本垂直的姿态吸附和保持基板，并沿着其平板表面延伸的方向输送基板; 多个工作装置，用于执行用于在从输送装置接收的基本垂直姿势的基板的边缘部分中安装区域的工作过程。在部件安装装置中，每个工作装置包括：基板保持件，用于以基本垂直的姿势吸附和保持基板; 用于将被吸持和保持的基板移动到向下工作位置的保持器上/下装置; 接收构件，用于从其背面侧支撑位于工作位置的基板的边缘部分; 以及工作单元，用于从其正面侧对位于工作位置的基板的边缘部分的安装区域进行加工过程。

3. 发明申请

US20110023296A1 COMPONENT MOUNTING APPARATUS AND METHOD 有权
标题翻译：组件安装设备和方法
公开(公告)号：US20110023296A1
公开(公告)日：2011-02-03
申请号：US12935640
申请日：2009-03-30
申请人： Nobuhiko Muraoka , Syozo Kadota
发明人： Nobuhiko Muraoka , Syozo Kadota
IPC分类号： H01L21/60
CPC分类号： H01L24/86 , H01L2224/86 , H01L2924/01004 , H01L2924/01033 , H01L2924/01051 , H01L2924/01074 , H01L2924/01082 , H01L2924/15788 , H01L2924/181 , H05K3/323 , H05K3/361 , Y10T29/4913 , Y10T29/49149 , Y10T29/53174 , Y10T29/53191 , Y10T29/53261 , H01L2924/00
摘要： A component mounting apparatus includes: a conveyor device for sucking and holding a substrate in a substantially vertical posture and conveying the substrate in a direction extending along its flat plate surface; a plurality of working devices for performing working process for mounting areas in edge portions of the substantially vertical-postured substrate received from the conveyor device. In the component mounting apparatus, each of the working devices includes: a substrate holder for sucking and holding the substrate in a substantially vertical posture; a holder up/down device for moving the sucked and held substrate to a downward working position; a receiving member for supporting an edge portion of the substrate positioned in the working position from its back face side; and a working unit for performing working process on the mounting areas of the edge portions of the substrate positioned in the working position from its front face side.
摘要翻译：一种部件安装装置，包括：输送装置，用于以基本垂直的姿态吸附和保持基板，并沿着其平板表面延伸的方向输送基板; 多个用于执行加工过程的工作装置，用于将从输送装置接收的基本垂直姿势的基板的边缘部分中安装区域。在部件安装装置中，每个工作装置包括：基板保持件，用于以基本垂直的姿势吸附和保持基板; 用于将被吸持和保持的基板移动到向下工作位置的保持器上/下装置; 接收构件，用于从其背面侧支撑位于工作位置的基板的边缘部分; 以及工作单元，用于从其正面侧对位于工作位置的基板的边缘部分的安装区域进行加工处理。

4. 发明授权

US08528196B2 Component mounting apparatus and method 有权
标题翻译：组件安装装置及方法
公开(公告)号：US08528196B2
公开(公告)日：2013-09-10
申请号：US13143587
申请日：2010-01-08
申请人： Kazuaki Kosaka , Akira Kabeshita , Nobuhiko Muraoka , Syozo Kadota
发明人： Kazuaki Kosaka , Akira Kabeshita , Nobuhiko Muraoka , Syozo Kadota
IPC分类号： H05K3/30 , B23P19/00
CPC分类号： H05K13/0452
摘要： A component mounting apparatus for mounting components on a plurality of mounting regions placed on an edge part of a substrate along a first direction that is a direction along the edge part of the substrate, comprises component placing units for holding components placed in component delivery positions that are spaced from the edge part of the substrate in a second direction orthogonal to the first direction, moving the held components in the second direction, and placing the components onto the mounting regions, component feeding units for sequentially feeding the components to component feeding positions spaced from the component delivery positions, and component carrying units for holding the components fed to the component feeding positions, moving the held components, and placing the components in the component delivery positions. Therefore, the components can be placed even onto a large substrate with satisfactory working efficiency.
摘要翻译：一种用于将元件安装在沿着基板边缘部分的方向的第一方向上放置在基板的边缘部分上的多个安装区域上的部件安装装置，包括用于保持放置在部件传送位置的部件的部件放置单元，在与第一方向正交的第二方向上与基板的边缘部分间隔开，沿着第二方向移动被保持的部件，并将部件放置在安装区域上，用于将部件顺序地供给到间隔开的部件供给位置的部件供给单元以及用于保持馈送到部件供给位置的部件的元件传送单元，移动保持的部件，以及将部件放置在部件传送位置。因此，能够以良好的工作效率将部件均匀地配置在大的基板上。

5. 发明申请

US20110289772A1 COMPONENT MOUNTING APPARATUS AND METHOD 有权
标题翻译：组件安装设备和方法
公开(公告)号：US20110289772A1
公开(公告)日：2011-12-01
申请号：US13143587
申请日：2010-01-08
申请人： Kazuaki Kosaka , Akira Kabeshita , Nobuhiko Muraoka , Syozo Kadota
发明人： Kazuaki Kosaka , Akira Kabeshita , Nobuhiko Muraoka , Syozo Kadota
IPC分类号： H05K13/04
CPC分类号： H05K13/0452
摘要： A component mounting apparatus for mounting components on a plurality of mounting regions placed on an edge part of a substrate along a first direction that is a direction along the edge part of the substrate, comprises component placing units for holding components placed in component delivery positions that are spaced from the edge part of the substrate in a second direction orthogonal to the first direction, moving the held components in the second direction, and placing the components onto the mounting regions, component feeding units for sequentially feeding the components to component feeding positions spaced from the component delivery positions, and component carrying units for holding the components fed to the component feeding positions, moving the held components, and placing the components in the component delivery positions. Therefore, the components can be placed even onto a large substrate with satisfactory working efficiency.
摘要翻译：一种用于将元件安装在沿着基板边缘部分的方向的第一方向上放置在基板的边缘部分上的多个安装区域上的部件安装装置，包括用于保持放置在部件传送位置的部件的部件放置单元，在与第一方向正交的第二方向上与基板的边缘部分间隔开，沿着第二方向移动被保持的部件，并将部件放置在安装区域上，用于将部件顺序地供给到间隔开的部件供给位置的部件供给单元以及用于保持馈送到部件供给位置的部件的元件传送单元，移动保持的部件，以及将部件放置在部件传送位置。因此，能够以良好的工作效率将部件均匀地配置在大的基板上。

6. 发明申请

US20110186235A1 ADHESIVE TAPE AFFIXING EQUIPMENT AND PRESS-FITTING EQUIPMENT 有权
标题翻译：胶带贴附设备和压力设备
公开(公告)号：US20110186235A1
公开(公告)日：2011-08-04
申请号：US13122172
申请日：2010-01-18
申请人： Nobuhiko Muraoka , Syozo Kadota
发明人： Nobuhiko Muraoka , Syozo Kadota
IPC分类号： B32B37/10 , B32B37/02 , B32B37/12
CPC分类号： B65H37/002 , H05K3/323
摘要： An object of the present invention is to affix an ACF or other adhesive tape onto a plurality of predetermined locations that are aligned in parallel on a substrate, or execute effectively an operation for press-fitting a press-fitted component.An adhesive tape affixing equipment (1) for pulling out a tape (20) from a supply reel (22) on which the tape (20) constructed by laminating an adhesive tape (21) on a separator tape (20a) is wound, and then affixing the adhesive tape (21) onto electrodes (11) of a substrate (2) by pushing the tape (20) by means of a press-fitting tool (18), wherein the supply reel (22) is arranged to intersect substantially orthogonally with a longitudinal direction of the press-fitting tool (18), and a tape running route setting means (28) for causing the tape (20) pulled out from the supply reel (22) to run through an area between the press-fitting tool (18) and the substrate (2) along the longitudinal direction of the press-fitting tool (18) via a tape running direction changing portion (27a) being provided to at least one location.
摘要翻译：本发明的目的是将ACF或其它粘合带粘贴到在基板上平行排列的多个预定位置上，或者有效地执行用于压配合压配件的操作。一种用于从供带盘（22）拉出带（20）的胶带固定设备（1），其上缠绕了通过在胶带（20a）上层压粘合带（21）构成的带（20），以及然后通过压入工具（18）推动带（20）将粘合带（21）固定到基底（2）的电极（11）上，其中供带盘（22）布置成基本相交与压配工具（18）的纵向方向正交地连接，以及一带材运行路径设定装置（28），用于使从供带盘（22）拉出的带子（20）装配工具（18）和基板（2）沿着压配工具（18）的纵向方向经由带运行方向改变部分（27a）设置在至少一个位置。

7. 发明授权

US5854745A Method and apparatus for mounting electronic component 失效
标题翻译：电子元件安装方法及装置
公开(公告)号：US5854745A
公开(公告)日：1998-12-29
申请号：US413441
申请日：1995-03-30
申请人： Nobuhiko Muraoka , Shinji Kanayama , Shinzo Eguchi , Masaru Ichihara , Shuichi Hirata , Nobuhisa Watanabe
发明人： Nobuhiko Muraoka , Shinji Kanayama , Shinzo Eguchi , Masaru Ichihara , Shuichi Hirata , Nobuhisa Watanabe
IPC分类号： H01L21/00 , G06F19/00
CPC分类号： H01L21/67144 , Y10T29/53087 , Y10T29/53191
摘要： When an electronic component is picked up at an electronic component feeding part and then positioned and mounted at a predetermined mounting position on a transparent panel, mounting position marks formed at the mounting position on the transparent panel are registered with positioning marks formed on the electronic component, to thereby recognize the relative position from a surface opposite to a surface of the transparent panel where the electronic component is to be mounted, so that the position of the electronic component is corrected based on the result of the recognition before the electronic component is mounted at the predetermined mounting position on the transparent panel.
摘要翻译：当在电子部件供给部拾取电子部件，然后定位并安装在透明板上的预定安装位置时，形成在透明板上的安装位置的安装位置标记与形成在电子部件上的定位标记对准，从而从与要安装电子部件的透明面板的与表面相反的表面相对位置识别，从而基于在安装电子部件之前的识别结果来校正电子部件的位置在透明面板上的预定安装位置。

8. 发明授权

US5575059A Tape carrier package mounting apparatus with heaters for bonding tools 失效
标题翻译：胶带载体封装安装装置，具有用于粘合工具的加热器
公开(公告)号：US5575059A
公开(公告)日：1996-11-19
申请号：US447048
申请日：1995-05-22
申请人： Nobuhiko Muraoka , Nobuhisa Watanabe , Shinjiro Tsuji , Ikuko Obata
发明人： Nobuhiko Muraoka , Nobuhisa Watanabe , Shinjiro Tsuji , Ikuko Obata
IPC分类号： B23P21/00 , H01L21/60 , H05K13/02 , H05K13/04 , H05K3/34 , B23P19/04
CPC分类号： H05K13/0421 , Y10T29/53178 , Y10T29/53191
摘要： A TCP mounting apparatus includes a tool storing and holding section having arranged therein a plurality of different kinds of bonding tools which suction tape carrier packages of respective different shapes to heat and pressure bond the tape carrier packages to a liquid crystal panel. The bonding tools are stored at predetermined positions within the tool storing and holding section, and the tool storing and holding section includes a heater for heating the stored and held bonding tools and detector for detecting a presence and absence of the stored bonding tools at each position. A head part is also provided for extracting any selected one of the bonding tools stored and held in the tool storing and holding section. The head part also includes a heater for heating an extracted bonding tool. A conveyor mechanism moves and positions the head part to the predetermined positions of the tool storing and holding section.
摘要翻译：一种TCP安装装置，包括：工具存放部，其具有多个不同种类的接合工具，该多个接合工具可吸收各种不同形状的带状载体封装，将带状载体封装加热粘合到液晶面板。焊接工具存储在工具存放部内的预定位置，工具存放保持部包括用于加热存储和保持的焊接工具和检测器的加热器，用于检测每个位置上存储的焊接工具的存在和不存在。还提供头部，用于提取存储并保持在工具存储和保持部中的任何选定的一个接合工具。头部还包括用于加热提取的粘合工具的加热器。传送机构将头部移动并定位到工具存放部的规定位置。

9. 发明授权

US5766402A Apparatus for applying tape to object by applying pressure thereto 失效
标题翻译：用于通过向其施加压力来施加胶带以对象的装置
公开(公告)号：US5766402A
公开(公告)日：1998-06-16
申请号：US413437
申请日：1995-03-30
申请人： Nobuhiko Muraoka , Shinjiro Tsuji , Shuichi Hirata , Hirohisa Mozaki
发明人： Nobuhiko Muraoka , Shinjiro Tsuji , Shuichi Hirata , Hirohisa Mozaki
IPC分类号： G02F1/13 , B65H20/24 , B65H37/00 , G02F1/1345 , H01L21/52 , B32B31/08 , B65H26/02
CPC分类号： B65H37/002 , B65H20/24 , H01L24/743 , B65H2301/4491 , H01L2224/743 , Y10T156/1705 , Y10T156/1712
摘要： An apparatus, for applying a pressing tape to an object by applying pressure to the object, includes a pair of vertically movable members spaced at a certain interval. A tape-shaped material is traveled members and including a supporting tape carrying a pressing tape thereon. A pressure applying device is positioned between the movable members for pressing the tape-shaped member against an object. A tape feed-out device is provided upstream of one of the movable members for feeding out the tape-shaped material therefrom. A tape winding device is positioned downstream of the other movable member, for winding the tape-shaped material thereon. A tape feeding device is positioned between the other movable member and the winding device for feeding the tape-shaped material by a predetermined length by pulling the tape-shaped material. A first chuck is positioned on one movable member for chucking the tape-shaped material. A second chuck is positioned on the other movable member for chucking the tape-shaped material, and a third chuck device is provided for holding the tape-shaped material between the tape feeding device and the winding device.
摘要翻译：一种用于通过向物体施加压力将加压带施加到物体上的装置包括以一定间隔隔开的一对可垂直移动的构件。带状材料是行进的构件，并且包括在其上承载有压带的支撑带。压力施加装置位于可动构件之间，用于将带状构件压靠在物体上。一个可移动部件的上游设置有带式送出装置，用于从其中输出带状材料。磁带卷绕装置位于另一可移动部件的下游，用于将带状材料卷绕在其上。带进给装置位于另一可移动部件和卷绕装置之间，用于通过拉动带状材料将带状材料供给预定长度。第一卡盘位于一个可动件上，用于夹紧带状材料。第二卡盘位于另一可移动部件上用于夹紧带状材料，并且设置有用于将带状材料保持在带馈送装置和卷绕装置之间的第三卡盘装置。

10. 发明授权

US5582341A Bonding apparatus for terminal component 失效
标题翻译：端子部件用接合装置
公开(公告)号：US5582341A
公开(公告)日：1996-12-10
申请号：US496691
申请日：1995-06-29
申请人： Shinji Kanayama , Akira Kabeshita , Satoshi Ohnakada , Kenichi Nishino , Nobuhiko Muraoka
发明人： Shinji Kanayama , Akira Kabeshita , Satoshi Ohnakada , Kenichi Nishino , Nobuhiko Muraoka
IPC分类号： G02F1/1345 , B23K20/02 , G09F9/00 , H01L23/50 , B23K37/04
CPC分类号： B23K20/023
摘要： A terminal component bonding apparatus is provided that has a stage for supporting a board having terminal components thereon, supporting the board. A pressure tool with a heater is set in a movable manner in a vertical direction above the stage so as to bond the terminal components to the board with heat and pressure. A shockless sheet is disposed along a lower surface of the pressure tool, and a pressing plate for terminal components is arranged along a lower surface of the shockless sheet and is made of a plate of a thermal expansion coefficient lower than that of the shockless sheet.
摘要翻译：提供一种端子部件接合装置，其具有用于支撑其上具有端子部件的板的支撑台。具有加热器的压力工具以可移动的方式设置在工作台上方的垂直方向上，以便将端子部件以热和压力结合到板上。沿着压力工具的下表面设置无震动片材，沿着无震动片材的下表面设置用于端子部件的按压板，并且由比无冲击片材的热膨胀系数低的板材制成。

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