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1. 发明申请

US20070290202A1 ORGANOSILICON COMPOUND 审中-公开
标题翻译：有机硅化合物
公开(公告)号：US20070290202A1
公开(公告)日：2007-12-20
申请号：US11763782
申请日：2007-06-15
申请人： Nobuaki Matsumoto , Kei Miyoshi , Kunihiro Yamada , Toshiyuki Ozai
发明人： Nobuaki Matsumoto , Kei Miyoshi , Kunihiro Yamada , Toshiyuki Ozai
IPC分类号： H01L29/08
CPC分类号： C07F7/1804
摘要： Provided is a novel organosilicon compound which functions as a silane coupling agent (wetter) that enables a silicone to be filled with a large quantity of a filler.The organosilicon compound is represented by a general formula (1) wherein, R1 represents a hydrogen atom, or an unsubstituted or substituted monovalent hydrocarbon group, R2 to R4 represent identical or different unsubstituted or substituted monovalent hydrocarbon groups, each R5 represents, independently, a hydrogen atom, or an unsubstituted or substituted monovalent hydrocarbon group, each R6 represents, independently, an identical or different unsubstituted or substituted monovalent organic group, m represents an integer from 0 to 4, and n represents an integer from 2 to 20; as well as a method of producing the above organosilicon compound, wherein a one end organohydrogensilyl-terminated organopolysiloxane is produced by reacting an organohydrogensiloxane with a vinylsilane or an alkenyltriorganooxysilane in the presence of a hydrosilylation catalyst, and optionally this one end organohydrogensilyl-terminated organopolysiloxane is then reacted with an alkene in the presence of a hydrosilylation catalyst.
摘要翻译：提供了一种新型的有机硅化合物，其作为使硅氧烷填充有大量填料的硅烷偶联剂（润湿剂）起作用。有机硅化合物由通式（1）表示，其中R 1表示氢原子，或未取代或取代的一价烃基，R 2至R 0 表示相同或不同的未取代或取代的单价烃基，每个R 5独立地表示氢原子或未取代或取代的一价烃基，每个R 6 独立地表示相同或不同的未取代或取代的一价有机基团，m表示0至4的整数，n表示2至20的整数; 以及制备上述有机硅化合物的方法，其中通过在氢化硅烷化催化剂存在下使有机氢硅氧烷与乙烯基硅烷或烯基三有机氧基硅烷反应制备一端有机氢甲硅烷基封端的有机基聚硅氧烷，任选地，该一端有机氢甲硅烷基封端的有机聚硅氧烷是然后在氢化硅烷化催化剂存在下与烯烃反应。

2. 发明申请

US20090258216A1 SILICONE ADHESIVE FOR SEMICONDUCTOR ELEMENT 审中-公开
标题翻译：硅胶用于半导体元件
公开(公告)号：US20090258216A1
公开(公告)日：2009-10-15
申请号：US12421876
申请日：2009-04-10
申请人： Naoki YAMAKAWA , Kei Miyoshi , Toshiyuki Ozai , Yoshinori Ogawa
发明人： Naoki YAMAKAWA , Kei Miyoshi , Toshiyuki Ozai , Yoshinori Ogawa
IPC分类号： B32B7/12 , C09J183/00 , C09J183/06
CPC分类号： H01L33/56 , C09J183/14
摘要： A silicone adhesive for a semiconductor element that is suitable as a die bonding material for fixing a light emitting diode chip to a substrate. The adhesive includes (a) an addition reaction-curable silicone resin composition having a viscosity at 25° C. of not more than 100 Pa·s, and yielding a cured product upon heating at 150° C. for 3 hours that has a type D hardness prescribed in JIS K6253 of at least 30, (b) a white pigment powder having an average particle size of less than 1 μm, and (c) a white or colorless and transparent powder having an average particle size of at least 1 μm but less than 10 μm. The adhesive exhibits high levels of concealment, effectively reflects light emitted from the LED chip, and also exhibits favorable chip positioning properties, superior adhesive strength, and excellent durability.
摘要翻译：一种用于半导体元件的硅粘合剂，其适合作为用于将发光二极管芯片固定到基板的芯片接合材料。粘合剂包括（a）在25℃下的粘度不大于100Pa.s的加成反应固化性有机硅树脂组合物，并且在150℃加热3小时时产生固化产物，其具有类型 JIS K6253规定的D硬度为30以上，（b）平均粒径小于1μm的白色颜料粉末，（c）平均粒径为1μm以上的白色或无色透明粉末但少于10个妈妈。粘合剂显示出高水平的隐蔽性，有效地反映了从LED芯片发出的光，并且还显示出有利的芯片定位性能，优异的粘合强度和优异的耐久性。

3. 发明授权

US07875695B2 Hydrophilic organopolysiloxane composition for use as dental impression material 有权
标题翻译：用作牙科印模材料的亲水性有机聚硅氧烷组合物
公开(公告)号：US07875695B2
公开(公告)日：2011-01-25
申请号：US12251252
申请日：2008-10-14
申请人： Hiroshi Kamohara , Toshiyuki Ozai , Hideki Sugahara
发明人： Hiroshi Kamohara , Toshiyuki Ozai , Hideki Sugahara
IPC分类号： C08G77/20
CPC分类号： A61K6/10 , C08L83/04
摘要： A hydrophilic organopolysiloxane composition of the hydrosilylation reaction cure type for use as dental impression material is characterized by comprising as essential components (A) a diorganopolysiloxane having at least 0.1 silicon-bonded alkenyl group in a molecule, (B) a liquid or solid organopolysiloxane having average compositional formula (1), comprising SiO2 units and R3SiO1/2 units (R is a monovalent hydrocarbon, alkoxy or hydroxyl group) and having a viscosity of at least 10 mPa-s at 23° C., (C) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, (D) a hydrosilylation catalyst, and (E) a polyether having average compositional formula (2).
摘要翻译：用作牙印模材料的氢化硅烷化反应固化型的亲水性有机聚硅氧烷组合物的特征在于包含作为必需组分（A）在分子中具有至少0.1个硅键合的烯基的二有机聚硅氧烷，（B）具有平均组成式（1），其包含SiO 2单元和R 3 SiO 1/2单元（R是单价烃，烷氧基或羟基），并且在23℃具有至少10mPa·s的粘度，（C）有机氢聚硅氧烷，分子中至少两个硅键合的氢原子，（D）氢化硅烷化催化剂和（E）具有平均组成式（2）的聚醚。

4. 发明授权

US07737212B2 Heat conductive silicone composition 有权
标题翻译：导热硅胶组合物
公开(公告)号：US07737212B2
公开(公告)日：2010-06-15
申请号：US11439277
申请日：2006-05-24
申请人： Toshiyuki Ozai , Naoki Yamakawa
发明人： Toshiyuki Ozai , Naoki Yamakawa
IPC分类号： C08L83/04
CPC分类号： C08L83/04 , C08G77/045 , C08G77/12 , C08G77/14 , C08G77/18 , C08G77/20 , C08L83/00
摘要： A heat conductive silicone composition is provided, which includes (A) an organopolysiloxane having the formula (1): {(CH2═CH)R12SiO1/2}L(R1SiO3/2)m(R12SiO)n{O1/2SiR12—R2—SiR1(3-a)(OR3)a}o (1) wherein R1 represents monovalent hydrocarbon groups, R2 represents an oxygen atom or a bivalent hydrocarbon group, R3 represents an alkyl group, alkoxyalkyl group, alkenyl group, or acyl group, L and o represent numbers from 1 to 10, m represents a number from 0 to 10, n represents a number from 5 to 100, a represents an integer from 1 to 3, and when m=0, L+o=2 and R2 is a bivalent hydrocarbon group, (B) a heat conductive filler, and (C) an organopolysiloxane other than the component (A). Even upon high-level packing with the heat conductive filler to obtain a highly heat conductivity, the composition still exhibits favorable handling and moldability properties.
摘要翻译：提供了一种导热硅氧烷组合物，其包括（A）具有式（1）的有机聚硅氧烷：{（CH 2 = CH）R 12 SiO 1/2/2）L（R 1 SiO 3/2）m（R 12 SiO）n {O 1 / 2SiR 12 -R 2 - SiR1（3-a）（OR3）a} o（1）其中R1表示一价烃基，R2表示氧原子或二价烃基，R3表示烷基，烷氧基烷基，烯基或酰基，L o表示1〜10的数，m表示0〜10的数，n表示5〜100的数，a表示1〜3的整数，m = 0时，L + o = 2，R2表示二价烃基，（B）导热性填料，（C）除（A）成分以外的有机聚硅氧烷。即使使用导热填料进行高级包装以获得高导热性，组合物仍然表现出良好的处理和成型性能。

5. 发明授权

US07563843B2 Flame retardant silicone compositions 失效
标题翻译：阻燃硅酮组合物
公开(公告)号：US07563843B2
公开(公告)日：2009-07-21
申请号：US10438863
申请日：2003-05-16
申请人： Toshiyuki Ozai , Yoshifumi Inoue
发明人： Toshiyuki Ozai , Yoshifumi Inoue
IPC分类号： C08L83/04
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C08K5/544 , C08L83/00
摘要： An amino compound having a secondary amino group directly bonded to a phenyl group is modified by silylating the secondary amino group. When the silylated amino compound is compounded in a silicone composition comprising an organopolysiloxane containing at least two lower alkenyl groups, an organohydrogenpolysiloxane, and a platinum base curing catalyst, the composition is improved in flame retardance to the level of UL-94 V-0 without sacrificing the activity of the curing catalyst.
摘要翻译：具有与苯基直接键合的仲氨基的氨基化合物通过使仲氨基甲硅烷基化而被修饰。当甲硅烷基化的氨基化合物在包含含有至少两个低级链烯基的有机聚硅氧烷，有机氢聚硅氧烷和铂基固化催化剂的硅氧烷组合物中配混时，该组合物的阻燃性提高到UL-94V-0的水平，而没有牺牲固化催化剂的活性。

6. 发明申请

US20070287014A1 Liquid organopolysiloxane composition for matting and cured article having a matted surface 审中-公开
标题翻译：用于消光和固化制品的液体有机聚硅氧烷组合物具有无光泽表面
公开(公告)号：US20070287014A1
公开(公告)日：2007-12-13
申请号：US11808082
申请日：2007-06-06
申请人： Toshiyuki Ozai , Mitsuhiro Iwata
发明人： Toshiyuki Ozai , Mitsuhiro Iwata
IPC分类号： B32B9/04 , C08K3/40
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C08K7/22 , Y10T428/24372 , Y10T428/24421 , Y10T428/31663 , C08L83/00
摘要： A liquid organopolysiloxane composition is provided. This composition can readily form a cured article having a matted surface without requiring separate step such as mechanical surface roughening, and this composition is well adapted for use as a potting material or a coating material in electric and electronic components such as LED. An article having a matted surface produced by curing such composition is also provided. The liquid organopolysiloxane composition for matting comprises (A) 100 parts by weight of a thermosetting liquid organopolysiloxane composition, and (B) 0.1 to 100 parts by weight of a hollow filler having a melting point of at least 150° C., a specific weight of 0.01 to 0.8, and a particle size of up to 200 μm. The composition has a viscosity at room temperature of 100 to 100,000 mPa·s. The resulting cured article has a surface glossiness of up to 40.
摘要翻译：提供液体有机聚硅氧烷组合物。该组合物可以容易地形成具有无光表面的固化制品，而不需要诸如机械表面粗糙化的单独步骤，并且该组合物很好地适用于诸如LED的电气和电子部件中的灌封材料或涂料。还提供了通过固化该组合物制成的具有无光泽表面的制品。用于消光的液体有机基聚硅氧烷组合物包含（A）100重量份的热固性液体有机基聚硅氧烷组合物，和（B）0.1至100重量份的熔点至少为150℃的中空填料，为0.01〜0.8，粒径可达200μm。该组合物在室温下具有100至100,000mPa.s的粘度。所得到的固化制品的表面光泽度高达40。

7. 发明授权

US08293810B2 Rapid prototyping resin compositions 有权
标题翻译：快速成型树脂组合物
公开(公告)号：US08293810B2
公开(公告)日：2012-10-23
申请号：US11212711
申请日：2005-08-29
申请人： Takashi Ito , Tsuneo Hagiwara , Toshiyuki Ozai , Takeshi Miyao
发明人： Takashi Ito , Tsuneo Hagiwara , Toshiyuki Ozai , Takeshi Miyao
IPC分类号： C08F283/12 , C08F2/50 , C08J3/28 , G03F7/031 , C08G77/04 , C08G77/20 , C08L83/07
CPC分类号： C08F283/12 , B33Y70/00 , C08L83/08 , C08L83/00
摘要： A resin composition suited for rapid prototyping is provided comprising (I) an actinic energy radiation-curable silicone composition, (II) an actinic energy radiation-sensitive polymerization initiator, and (III) an actinic energy radiation absorber. The resin composition experiences little viscosity buildup and maintains fluidity during long-term storage at elevated temperature, and is effective in rapid prototyping or shaping by stereolithography using any actinic energy radiation.
摘要翻译：提供了适用于快速成型的树脂组合物，其包括（I）光化能辐射可固化硅氧烷组合物，（II）光化能辐射敏感聚合引发剂，和（III）光化能辐射吸收剂。树脂组合物在高温下长时间储存期间几乎不产生粘度增加并保持流动性，并且通过使用任何光化能量辐射的立体光刻技术在快速成型或成型中是有效的。

8. 发明授权

US07915362B2 Heat-curable silicone composition and light emitting diode element using same 有权
标题翻译：可热固化的硅氧烷组合物和使用其的发光二极管元件
公开(公告)号：US07915362B2
公开(公告)日：2011-03-29
申请号：US11859123
申请日：2007-09-21
申请人： Toshiyuki Ozai
发明人： Toshiyuki Ozai
IPC分类号： C08G77/20
CPC分类号： C09K3/1018 , C08K5/14 , C08L83/06 , C08L83/14 , H01L33/56 , C08L2666/34
摘要： Provided is a heat-curable silicone composition containing: (A) an organopolysiloxane having at least one structure represented by the following general formula (2) within each molecule: wherein m represents an integer of 0, 1 or 2, R1 represents a hydrogen atom, a phenyl group or a halogenated phenyl group, R2 represents a hydrogen atom or a methyl group, R3 represents an identical or different monovalent organic group having 1 to 10 carbon atoms, and R4 represents an identical or different bivalent organic group having 1 to 10 carbon atoms; and (B) a quantity of an organic peroxide that is effective as a curing catalyst. The heat-curable silicon composition yields a cured product having excellent transparency and minimal discoloration over time. Also provided is a light emitting diode element having a material composed of the cured product.
摘要翻译：本发明提供一种可热固化的硅氧烷组合物，其含有：（A）在每个分子内具有至少一个由以下通式（2）表示的结构的有机聚硅氧烷：其中m表示0,1或2的整数，R 1表示氢原子，苯基或卤代苯基，R 2表示氢原子或甲基，R 3表示相同或不同的具有1〜10个碳原子的一价有机基团，R 4表示相同或不同的1价〜10元的有机基团碳原子和（B）一定量的作为固化催化剂有效的有机过氧化物。可热固化的硅组合物产生具有优异透明度和随时间变化最小的固化产物。还提供了具有由固化产物组成的材料的发光二极管元件。

9. 发明授权

US07456246B2 Hydrophilic polyorganosiloxane composition 有权
标题翻译：亲水性聚有机硅氧烷组合物
公开(公告)号：US07456246B2
公开(公告)日：2008-11-25
申请号：US10724221
申请日：2003-12-01
申请人： Hiroshi Kamohara , Toshiyuki Ozai
发明人： Hiroshi Kamohara , Toshiyuki Ozai
IPC分类号： C08G77/12 , C08G77/14 , C08G77/20
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C08G77/24 , C08G77/26 , C08G77/44 , C08G77/70 , C08G77/80 , C08L71/02 , C08L2666/22
摘要： A hydrophilic polyorganosiloxane composition comprising (A) a curable organopolysiloxane containing at least 5 mol % of diphenylsiloxane units or at least 10 mol % of methylphenylsiloxane units, (B) a curing agent, and (C) a specific polyether cures into an elastomeric or gel-like silicone product having excellent hydrophilic properties and prevents separation of the polyether over time.
摘要翻译：亲水性聚有机硅氧烷组合物，其包含（A）含有至少5摩尔％的二苯基硅氧烷单元或至少10摩尔％的甲基苯基硅氧烷单元的可固化的有机聚硅氧烷，（B）固化剂，和（C）特定聚醚固化成弹性体或凝胶类硅氧烷产品具有优异的亲水性，并防止聚醚随时间分离。

10. 发明申请

US20050101791A1 Organosilicon compound 有权
标题翻译：有机硅化合物
公开(公告)号：US20050101791A1
公开(公告)日：2005-05-12
申请号：US11015024
申请日：2004-12-20
申请人： Toshiyuki Ozai , Hiroyasu Hara , Yoshifumi Inoue , Tomoyuki Goto
发明人： Toshiyuki Ozai , Hiroyasu Hara , Yoshifumi Inoue , Tomoyuki Goto
IPC分类号： C07F7/08 , C07F7/18
CPC分类号： C07F7/1804
摘要： An organosilicon compound represented by the following general formula (1): wherein R1 is a hydrogen atom, a phenyl group or a halogenated phenyl group; R2 is a hydrogen atom or a methyl group; R3's are each a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms; X is a hydrolyzable group; Z1 is —R4—, —R4O— or —R4(CH3)2SiO—, where R4 is a substituted or unsubstituted divalent hydrocarbon group having 1 to 10 carbon atoms; Z2 is an oxygen atom or a substituted or unsubstituted divalent hydrocarbon group having 1 to 10 carbon atoms; and m is 0, 1 or 2 and n is 0, 1 or 2. When incorporated in silicone compositions, the organosilicon compound acts as a cross-linking agent having well-balanced photopolymerizability and condensation curability.
摘要翻译：由以下通式（1）表示的有机硅化合物：其中R 1是氢原子，苯基或卤代苯基; R 2是氢原子或甲基; R 3各自为取代或未取代的碳原子数为1〜10的一价烃基; X是可水解基团; Z 1是-R 4 - ， - R 4 O-或-R 4（CH 3） 3 SiO 2，其中R 4是取代或未取代的具有1至10个碳原子的二价烃基; Z 2是氧原子或取代或未取代的碳原子数为1〜10的二价烃基; 并且m为0,1或2，n为0,1或2.当掺入有机硅组合物中时，有机硅化合物用作具有良好平衡光聚合性和缩合固化性的交联剂。

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