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1. 发明申请

US20130234291A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20130234291A1
公开(公告)日：2013-09-12
申请号：US13733723
申请日：2013-01-03
申请人： Noboru MIYAMOTO , Yoshikazu TSUNODA
发明人： Noboru MIYAMOTO , Yoshikazu TSUNODA
IPC分类号： H01L29/92
CPC分类号： H01L29/92 , H01G4/232 , H01G4/30 , H01G4/33 , H01G4/40 , H01L23/49562 , H01L23/49589 , H01L23/642 , H01L24/32 , H01L25/16 , H01L28/82 , H01L28/86 , H01L28/90 , H01L2924/13055 , H01L2924/00
摘要： A semiconductor device includes a first electrode electrically connected to an upper surface of a semiconductor element, a first internal electrode electrically connected to a lower surface of the semiconductor element and having a plurality of first comb finger portions and a first connection portion connecting the plurality of first comb finger portions together, a second electrode electrically connected to the first internal electrode, a second internal electrode electrically connected to a lower surface of the first electrode and having a plurality of second comb finger portions and a second connection portion connecting the plurality of second comb finger portions together, the plurality of second comb finger portions being interdigitated with but not in contact with the plurality of first comb finger portions, and a lower dielectric filling the space between the plurality of first comb finger portions and the plurality of second comb finger portions.
摘要翻译：半导体器件包括电连接到半导体元件的上表面的第一电极，与半导体元件的下表面电连接并具有多个第一梳状指部的第一内部电极和连接多个电连接到第一内部电极的第二电极，与第一电极的下表面电连接并具有多个第二梳形指状部分的第二内部电极和连接多个第二梳状部分的第二连接部分，梳状指部分在一起，多个第二梳状指部分与多个第一梳状指部分相互交错但不接触;以及下部电介质，其填充多个第一梳状指部分与多个第二梳状指状部分之间的空间部分。

2. 发明申请

US20110309776A1 SEMICONDUCTOR CIRCUIT DEVICE INCLUDING SWITCHING ELEMENT 有权
标题翻译：包括开关元件的半导体电路设备
公开(公告)号：US20110309776A1
公开(公告)日：2011-12-22
申请号：US13042791
申请日：2011-03-08
申请人： Noboru MIYAMOTO
发明人： Noboru MIYAMOTO
IPC分类号： H02P27/06
CPC分类号： H02P27/06 , H02M2001/0029
摘要： A semiconductor circuit device includes a semiconductor circuit including a switching element, a temperature monitoring unit, and a control unit. The temperature monitoring unit detects or estimates a temperature of a component connected to an inside or an outside of the semiconductor circuit. Here, the temperature of the component changes in accordance with a frequency of a current flowing through the component, and the frequency of the current flowing through the component changes in accordance with a switching frequency of the switching element. The control unit adjusts the switching frequency of the switching element such that the temperature of the component is equal to a target temperature.
摘要翻译：半导体电路器件包括具有开关元件，温度监控单元和控制单元的半导体电路。温度监视单元检测或估计连接到半导体电路的内部或外部的部件的温度。这里，元件的温度根据流过元件的电流的频率而变化，流过元件的电流的频率根据开关元件的开关频率而变化。控制单元调节开关元件的开关频率，使得元件的温度等于目标温度。

3. 发明申请

US20110304039A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20110304039A1
公开(公告)日：2011-12-15
申请号：US13113380
申请日：2011-05-23
申请人： Noboru MIYAMOTO
发明人： Noboru MIYAMOTO
IPC分类号： H01L23/34
CPC分类号： H01L23/4334 , H01L23/4006 , H01L23/473 , H01L24/73 , H01L2224/48247 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device includes a semiconductor chip having a first main surface and a second main surface; a stacked structure on which the semiconductor chip is disposed; and a cooling body on which the stacked structure is disposed. The stacked structure includes a first thermal conductor fixed to the cooling body, an insulator disposed on the first thermal conductor, and a second thermal conductor disposed on the insulator and having the semiconductor chip disposed thereon. The first main surface of the semiconductor chip opposite to the second main surface in contact with the stacked structure is sealed with an insulation material. At least a part of the first thermal conductor protrudes outwardly of the insulation material in plan view.
摘要翻译：半导体器件包括具有第一主表面和第二主表面的半导体芯片; 其上设置有半导体芯片的堆叠结构; 以及设置有堆叠结构的冷却体。堆叠结构包括固定到冷却体的第一热导体，设置在第一热导体上的绝缘体和设置在绝缘体上并且设置有半导体芯片的第二热导体。与层叠结构接触的与第二主表面相反的半导体芯片的第一主表面用绝缘材料密封。第一热导体的至少一部分在平面图中向绝缘材料的外侧突出。

4. 发明申请

US20090149970A1 SYSTEM CONTROL DEVICE 有权
标题翻译：系统控制装置
公开(公告)号：US20090149970A1
公开(公告)日：2009-06-11
申请号：US12170788
申请日：2008-07-10
申请人： Noboru MIYAMOTO , Koichi USHIJIMA
发明人： Noboru MIYAMOTO , Koichi USHIJIMA
IPC分类号： G05B13/02
CPC分类号： G05B11/40 , G05B13/021 , H02M1/32 , H02M3/157
摘要： Disclosed is a system control device that includes a semiconductor element; an actual control value acquisition section; a deviation computation section for computing the deviation between the actual control value and a target control value; an integral term computation means for computing an integral term contained in a control command value; a first control command value computation section for determining the next control command value from the immediately preceding integral term and the deviation; a first feedback control section for exercising control in accordance with the first control command value; a protective control section for providing protective control while allowing the first control command value computation section to perform computations during a period during which the first feedback control section exercises control; a control command value decrease section; a termination time acquisition section for acquiring the information about the termination time for the protective control; and a termination control section which uses a control command value decreased by the control command value decrease section as the initial control command value after the termination time.
摘要翻译：公开了一种包括半导体元件的系统控制装置; 实际控制值获取部分; 用于计算实际控制值和目标控制值之间的偏差的偏差计算部分; 用于计算包含在控制命令值中的积分项的积分项计算装置; 第一控制命令值计算部分，用于从紧接在前的积分项和偏差确定下一个控制命令值; 第一反馈控制部分，用于根据第一控制命令值进行控制; 保护控制部分，用于在允许第一控制命令值计算部分在第一反馈控制部分执行控制的时段期间执行计算，从而提供保护控制; 控制指令值减少部分; 终止时间获取部，用于获取关于所述保护控制的终止时间的信息; 以及终止控制部，其使用由控制指令值减少部减少的控制指令值作为终止时间之后的初始控制指令值。

5. 发明申请

US20090096502A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20090096502A1
公开(公告)日：2009-04-16
申请号：US12116570
申请日：2008-05-07
申请人： Noboru MIYAMOTO , Natsuki Tsuji
发明人： Noboru MIYAMOTO , Natsuki Tsuji
IPC分类号： H03K17/28
CPC分类号： H02M1/38 , H02M2001/385 , H03K17/0828 , H03K17/165
摘要： The present invention provides a semiconductor device includes arms formed by two semiconductor elements, a map memory device which stores therein a correlation map between a control value for each of the arms and an optimized dead time to be set for the control value or is capable of storing the same therein, drive control value acquiring means for acquiring a drive control value of each of the arms, and a dead time generating circuit for extracting the optimized dead time corresponding to the drive control value from the correlation map. The time taken until the other of the semiconductor elements is turned on after one thereof has received a command to turn off the same is the optimized dead time extracted by the dead time generating circuit.
摘要翻译：本发明提供了一种半导体器件，包括由两个半导体元件形成的臂，地图存储器件，其中存储有用于每个臂的控制值与要设置的控制值的优化死区时间之间的相关图，或者能够存储其中的驱动控制值获取装置，用于获取每个臂的驱动控制值;以及死区时间生成电路，用于从相关图提取与驱动控制值相对应的优化死区时间。在其中一个半导体元件中的一个已经接收到关闭它的命令之后，其余的半导体元件所经过的时间是由死区时间产生电路提取的优化的死区时间。

6. 发明申请

US20130215571A1 SEMICONDUCTOR DEVICE AND COOLING SYSTEM FOR SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件的半导体器件和冷却系统
公开(公告)号：US20130215571A1
公开(公告)日：2013-08-22
申请号：US13619434
申请日：2012-09-14
申请人： Noboru MIYAMOTO , Mitsunori AIKO
发明人： Noboru MIYAMOTO , Mitsunori AIKO
IPC分类号： H05K7/20 , H03K3/011
CPC分类号： B60L1/003 , B60L2240/525
摘要： A semiconductor device of the present invention is a semiconductor device applicable in a cooling system including an ECU functioning as a setting part that sets target temperature of a refrigerant used to cool the semiconductor device, and a sensor functioning as a detector that detects the temperature of the refrigerant as refrigerant's temperature. The semiconductor device generates variable heating loss. The semiconductor device includes a heating controller that controls the heating loss in the semiconductor device such that the target temperature and the refrigerant's temperature become the same.
摘要翻译：本发明的半导体装置是适用于冷却系统的半导体装置，该冷却系统具有作为设定部的ECU，该设定部设定用于冷却半导体装置的制冷剂的目标温度，以及用作检测器的温度的检测器制冷剂作为制冷剂的温度。半导体器件产生可变的加热损失。半导体器件包括加热控制器，其控制半导体器件中的加热损失，使得目标温度和制冷剂的温度变得相同。

7. 发明申请

US20080229082A1 CONTROL SUB-UNIT AND CONTROL MAIN UNIT 有权
标题翻译：控制子单元和控制主单元
公开(公告)号：US20080229082A1
公开(公告)日：2008-09-18
申请号：US11843295
申请日：2007-08-22
申请人： Noboru MIYAMOTO
发明人： Noboru MIYAMOTO
IPC分类号： G06F9/318 , G06F19/00
CPC分类号： G05B19/0421 , G05B2219/2231
摘要： A sub-unit judges whether an instruction received from an external unit is executable. If the instruction is judged to be executable, the sub-unit executes it. If, on the other hand, the instruction is judged to be unexecutable, the sub-unit notifies the external unit of an executable plan.
摘要翻译：子单元判断从外部单元接收到的指令是否可执行。如果判断为可执行指令，则子单元执行。另一方面，如果该指令被判断为不可执行，则该子单元向外部单元通知可执行计划。

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